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1. 发明授权

US06612915B1 Work piece carrier head for plating and polishing 有权
标题翻译：工件载体头用于电镀和抛光
公开(公告)号：US06612915B1
公开(公告)日：2003-09-02
申请号：US09472523
申请日：1999-12-27
申请人： Cyprian Uzoh , Boguslaw Andrzej Nagorski , Konstantin Volodarsky , Douglas W. Young
发明人： Cyprian Uzoh , Boguslaw Andrzej Nagorski , Konstantin Volodarsky , Douglas W. Young
IPC分类号： B24B700
CPC分类号： B24B37/30 , C25D7/12
摘要： A work piece carrier head can carry a semiconductor wafer during both plating and polishing operations. The carrier head includes a first component secured to a shaft by which the carrier head can be rotated, translated, and moved up and down, a second component connected to the first component and movable by fluid pressure relative to the first component between retracted and extended positions, and a third component connected to the first and second components for up and down movement between wafer loading or unloading and wafer plating or polishing positions. The third carrier head component includes a contact element by which electrical contact with the wafer is provided to permit wafer plating.
摘要翻译：工件载体头可以在电镀和抛光操作期间承载半导体晶片。承载头包括固定到轴的第一部件，承载头可以通过该第一部件旋转，平移和上下移动;第二部件，连接到第一部件并且可相对于第一部件在流体压力下相对于第一部件在缩回和延伸之间移动位置，以及连接到第一和第二部件的第三部件，用于晶片装载或卸载以及晶片电镀或抛光位置之间的上下移动。第三载体头部件包括接触元件，通过该接触元件提供与晶片的电接触以允许晶片电镀。

2. 发明授权

US06478936B1 Anode assembly for plating and planarizing a conductive layer 有权
标题翻译：用于电镀和平坦化导电层的阳极组件
公开(公告)号：US06478936B1
公开(公告)日：2002-11-12
申请号：US09568584
申请日：2000-05-11
申请人： Rimma Volodarsky , Konstantin Volodarsky , Cyprian Uzoh , Homayoun Talieh , Douglas W. Young
发明人： Rimma Volodarsky , Konstantin Volodarsky , Cyprian Uzoh , Homayoun Talieh , Douglas W. Young
IPC分类号： C25B1103
CPC分类号： C25D17/14 , C25F7/00
摘要： A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.
摘要翻译：可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。还提供了可以将溶液输送到所述阳极腔的溶液输送结构。溶液输送结构可以包含在进行操作的室内。护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。

3. 发明授权

US06969456B2 Method of using vertically configured chamber used for multiple processes 有权
标题翻译：使用垂直配置的室用于多个过程的方法
公开(公告)号：US06969456B2
公开(公告)日：2005-11-29
申请号：US10041029
申请日：2001-12-28
申请人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
发明人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
IPC分类号： C25D7/12 , H01L21/00 , H01L21/02 , H01L21/3063 , C25F3/00 , B08B3/04
CPC分类号： H01L21/6719 , C25D7/12 , C25D17/001 , H01L21/67028 , Y10S134/902
摘要： The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.
摘要翻译：本发明涉及一种用于进行多个处理步骤的容纳室，例如沉积，抛光，蚀刻，改性，漂洗，清洁和干燥工件上的表面。在本发明的一个实例中，室用于在半导体晶片上化学机械地沉积导电材料。然后可以使用相同的容纳室来冲洗和清洁相同的晶片。结果，本发明消除了对用于沉积导电材料和清洁晶片的单独处理站的需要。因此，利用本发明，降低了成本和物理空间，同时提供了使用容纳室在晶片表面上执行多个工艺的有效的装置和方法。

4. 发明授权

US06773576B2 Anode assembly for plating and planarizing a conductive layer 有权
标题翻译：用于电镀和平坦化导电层的阳极组件
公开(公告)号：US06773576B2
公开(公告)日：2004-08-10
申请号：US10251377
申请日：2002-09-20
申请人： Rimma Volodarsky , Konstantin Volodarsky , Cyprian Uzoh , Homayoun Talieh , Douglas W. Young
发明人： Rimma Volodarsky , Konstantin Volodarsky , Cyprian Uzoh , Homayoun Talieh , Douglas W. Young
IPC分类号： C25F302
CPC分类号： C25D17/14 , C25F7/00
摘要： A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.
摘要翻译：可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。还提供了可以将溶液输送到所述阳极腔的溶液输送结构。溶液输送结构可以包含在进行操作的室内。护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。

5. 发明授权

US06884334B2 Vertically configured chamber used for multiple processes 有权
标题翻译：垂直配置的腔室用于多个过程
公开(公告)号：US06884334B2
公开(公告)日：2005-04-26
申请号：US10041058
申请日：2001-12-28
申请人： Konstantin Volodarsky , Boguslaw A. Nigorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
发明人： Konstantin Volodarsky , Boguslaw A. Nigorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
IPC分类号： C25D7/12 , H01L21/00 , H01L21/02 , H01L21/3063 , C25D5/00
CPC分类号： H01L21/6719 , C25D7/12 , C25D17/001 , H01L21/67028 , Y10S134/902
摘要： The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.
摘要翻译：本发明涉及一种用于进行多个处理步骤的容纳室，例如沉积，抛光，蚀刻，改性，漂洗，清洁和干燥工件上的表面。在本发明的一个实例中，室用于在半导体晶片上化学机械地沉积导电材料。然后可以使用相同的容纳室来冲洗和清洁相同的晶片。结果，本发明消除了对用于沉积导电材料和清洁晶片的单独处理站的需要。因此，利用本发明，降低了成本和物理空间，同时提供了使用容纳室在晶片表面上执行多个工艺的有效的装置和方法。

6. 发明授权

US06352623B1 Vertically configured chamber used for multiple processes 有权
公开(公告)号：US06352623B1
公开(公告)日：2002-03-05
申请号：US09466014
申请日：1999-12-17
申请人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
发明人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
IPC分类号： C25B900
CPC分类号： H01L21/6719 , C25D7/12 , C25D17/001 , H01L21/67028 , Y10S134/902
摘要： The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

7. 发明授权

US06932679B2 Apparatus and method for loading a wafer in polishing system 失效
标题翻译：在抛光系统中装载晶片的装置和方法
公开(公告)号：US06932679B2
公开(公告)日：2005-08-23
申请号：US10295197
申请日：2002-11-15
申请人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
发明人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
IPC分类号： B24B21/04 , B24B21/08 , B24B21/22 , B24B37/04 , B24B47/04 , B24B49/16 , B24B1/00
CPC分类号： B24B21/04 , B24B21/08 , B24B21/22 , B24B37/013 , B24B37/04 , B24B37/205 , B24B47/04 , B24B49/16
摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.
摘要翻译：本发明包括固定到机构的抛光垫或皮带，该机构允许垫或带以往往的方式即即向前和向后两个方向高速移动。抛光垫或带在其抛光晶片时恒定的双向运动在晶片表面上提供了优异的平面性和均匀性。当需要衬垫的新鲜部分时，衬垫移动通过包含辊的驱动系统，使得辊仅接触衬垫的背面，从而最小化除了从抛光抛光的晶片之外的摩擦源并且使抛光垫的寿命最大化。

8. 发明授权

US06425812B1 Polishing head for chemical mechanical polishing using linear planarization technology 失效
标题翻译：抛光头采用线性平面化技术进行化学机械抛光
公开(公告)号：US06425812B1
公开(公告)日：2002-07-30
申请号：US09475543
申请日：1999-12-30
申请人： Anil K. Pant , Douglas W. Young , Glenn Travis , Konstantin Volodarsky , Andrew Nagengast
发明人： Anil K. Pant , Douglas W. Young , Glenn Travis , Konstantin Volodarsky , Andrew Nagengast
IPC分类号： B24B722
CPC分类号： B24B37/30
摘要： A polishing head for performing chemical-mechanical polishing on a linear polisher has a flexible diaphragm coupling between a wafer carrier and a support housing which houses the wafer carrier. The diaphragm allows the carrier to move-substantially in the vertical direction within the housing, but a center shaft assembly limits movement in the horizontal direction.
摘要翻译：用于在线性抛光机上进行化学机械抛光的抛光头具有在晶片载体和容纳晶片载体的支撑壳体之间的柔性膜片联接。隔膜允许载体基本上在壳体内沿垂直方向移动，但是中心轴组件限制了在水平方向上的移动。

9. 发明授权

US06604988B2 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein 失效
公开(公告)号：US06604988B2
公开(公告)日：2003-08-12
申请号：US10252149
申请日：2002-09-20
申请人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
发明人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
IPC分类号： B24B2100
CPC分类号： B24B21/04 , B24B21/08 , B24B21/22 , B24B37/013 , B24B37/04 , B24B37/205 , B24B47/04 , B24B49/16
摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

10. 发明授权

US06468139B1 Polishing apparatus and method with a refreshing polishing belt and loadable housing 有权
标题翻译：抛光装置和方法具有清爽的抛光带和可装载的外壳
公开(公告)号：US06468139B1
公开(公告)日：2002-10-22
申请号：US09684059
申请日：2000-10-06
申请人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
发明人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
IPC分类号： B24B2100
CPC分类号： B24B37/205 , B24B21/04 , B24B37/04 , B24B47/04
摘要： The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.
摘要翻译：本发明涉及使用可沿前后方向移动的垫或带来抛光半导体晶片的表面的方法和装置。在VLSI和ULSI应用中，非常需要抛光晶片表面以完成平坦度。抛光垫或带的向前和向后移动为晶片的表面提供了优异的平面性和均匀性。当抛光晶片表面时，衬垫或带沿正向和反向移动，晶片表面被压靠在抛光垫或带上。在抛光期间，晶片由具有新颖的晶片装载和卸载方法的晶片壳体支撑。

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