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1. 发明授权

US07192129B2 Bridging wick and method for an inkjet printhead 有权
标题翻译：喷墨打印头连接芯和方法
公开(公告)号：US07192129B2
公开(公告)日：2007-03-20
申请号：US11018025
申请日：2004-12-20
申请人： Curtis R. Droege , Bruce Gibson , Sam Norasak , Ann M. Trebolo , Kent L. Ubellacker , Frank E. Anderson , Adam N. Chalin
发明人： Curtis R. Droege , Bruce Gibson , Sam Norasak , Ann M. Trebolo , Kent L. Ubellacker , Frank E. Anderson , Adam N. Chalin
IPC分类号： B41J2/175
CPC分类号： B41J2/17513
摘要： Some embodiments of the present invention provide an inkjet printhead within which a removable ink cartridge can be installed. Upon installation, the ink cartridge can be coupled to one or more wicks in the printhead for establishing fluid communication between one or more chambers in the ink cartridge and nozzles through which ink exits the printhead during operation. The wick can extend from a cartridge receptacle to a substantially enclosed ink reservoir in order to transport ink from the removable cartridge to the ink reservoir.
摘要翻译：本发明的一些实施例提供一种喷墨打印头，其中可以安装可拆卸的墨盒。在安装时，墨盒可以联接到打印头中的一个或多个灯芯，以在墨盒中的一个或多个腔室和喷嘴之间建立流体连通，墨水在操作期间通过墨水从打印头中排出。芯可以从墨盒容器延伸到基本上封闭的墨水容器，以便将墨从可移除墨盒运送到墨水容器。

2. 发明授权

US07938508B2 Low profile printhead 有权
标题翻译：低调打印头
公开(公告)号：US07938508B2
公开(公告)日：2011-05-10
申请号：US12336117
申请日：2008-12-16
申请人： Frank E. Anderson , Curtis R. Droege , Sam Norasak
发明人： Frank E. Anderson , Curtis R. Droege , Sam Norasak
IPC分类号： B41J2/14 , B41J2/16 , B41J2/05 , B41J2/15 , B41J2/145
CPC分类号： B41J2/14072
摘要： An inkjet printhead having a housing having a top face and a bottom face, an ink ejection device and a contact circuit. The contact circuit is affixed to the housing in a substantially horizontal orientation and is in communication with the ink ejection device. The contact circuit is configured to connect the ink ejection device to an external device.
摘要翻译：一种具有外壳的喷墨打印头，具有顶面和底面，喷墨装置和接触电路。接触电路以基本上水平的方向固定到壳体上，并且与喷墨装置连通。接触电路构造成将喷墨装置连接到外部装置。

3. 发明申请

US20090153616A1 Low Profile Printhead 有权
标题翻译：低调打印头
公开(公告)号：US20090153616A1
公开(公告)日：2009-06-18
申请号：US12336117
申请日：2008-12-16
申请人： Frank E. Anderson , Curtis R. Droege , Sam Norasak
发明人： Frank E. Anderson , Curtis R. Droege , Sam Norasak
IPC分类号： B41J2/145
CPC分类号： B41J2/14072
摘要： An inkjet printhead having a housing having a top face and a bottom face, an ink ejection device and a contact circuit. The contact circuit is affixed to the housing in a substantially horizontal orientation and is in communication with the ink ejection device. The contact circuit is configured to connect the ink ejection device to an external device.
摘要翻译：一种具有外壳的喷墨打印头，具有顶面和底面，喷墨装置和接触电路。接触电路以基本上水平的方向固定到壳体上，并且与喷墨装置连通。接触电路构造成将喷墨装置连接到外部装置。

4. 发明授权

US08366952B2 Low ejection energy micro-fluid ejection heads 有权
标题翻译：低喷射能量微流体喷射头
公开(公告)号：US08366952B2
公开(公告)日：2013-02-05
申请号：US12758161
申请日：2010-04-12
申请人： Frank E. Anderson , Byron V. Bell , Robert W. Cornell , Yimin Guan
发明人： Frank E. Anderson , Byron V. Bell , Robert W. Cornell , Yimin Guan
IPC分类号： G01D15/00 , G11B5/127
CPC分类号： B41J2/1603 , B41J2/14129 , B41J2/1628 , B41J2/164 , Y10T29/49401
摘要： A micro-fluid ejection device structure and method therefor having improved low energy design. The devices include a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.
摘要翻译：一种具有改进的低能量设计的微流体喷射装置结构及其方法。这些器件包括沉积在半导体衬底上的半导体衬底和绝缘层。在选自TaAl，Ta2N，TaAl（O，N），TaAlSi，Ti（N，O），WSi（O，N），TaAlN等的电阻层的绝缘层上形成多个加热电阻体，和TaAl / TaAlN。选自可氧化金属并且具有约500至约5000埃的厚度的牺牲层沉积在多个加热电阻器上。电极从第一金属导电层形成在牺牲层上，以提供与多个加热电阻器的阳极和阴极连接。牺牲层在等离子体氧化过程中被氧化以在多个加热电阻器上提供流体接触层。

5. 发明申请

US20110009255A1 BORON-SILICON-CARBON CERAMIC MATERIALS AND METHOD OF MAKING 审中-公开
标题翻译：硼碳陶瓷材料及其制备方法
公开(公告)号：US20110009255A1
公开(公告)日：2011-01-13
申请号：US11538409
申请日：2006-10-03
申请人： Frank E. Anderson , Kevin R. McNerney , Steven M. Brazil
发明人： Frank E. Anderson , Kevin R. McNerney , Steven M. Brazil
IPC分类号： C04B35/565 , C04B35/563
CPC分类号： C04B40/0089 , C04B35/563 , C04B35/6316 , C04B35/65 , C04B2235/3821 , C04B2235/3826 , C04B2235/383 , C04B2235/3834 , C04B2235/422 , C04B2235/424 , C04B2235/425 , C04B2235/428 , C04B2235/48 , C04B2235/5436 , C04B2235/77 , C04B2235/79 , C04B2235/80 , C04B2235/96 , C04B2235/9607
摘要： A reaction bonded ceramic body that has 50% to 60%, by weight, boron carbide, and 20% to 30%, by weight, silicon carbide. The reaction bonded ceramic body has least a portion of the boron carbide reacted with silicon to become siliconized boron carbide. Also, a method of making a reaction bonded ceramic material. The method may include the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder, and contacting the green body with a liquid infiltrant comprising silicon. The infiltrant has a temperature of about 1625° C. to about 1700° C. Furthermore, a method of making a reaction bonded boron carbide ceramic body. The method includes the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder. The weight ratio of boron carbide to carbon in the green body may be about 5:5 to 1 or more. The method also includes siliconizing a first portion of the boron carbide to siliconized boron carbide by contacting the green body with a molten silicon infiltrant, where the infiltrant has a temperature of about 1625° C. to about 1700° C. The method may further include dissolving a second portion of the boron carbide in the silicon infiltrant, where at least some of the dissolved boron carbide is reprecipated as smooth particulates.
摘要翻译：一种反应结合的陶瓷体，其具有50重量％至60重量％的碳化硼和20重量％至30重量％的碳化硅。反应结合的陶瓷体具有与硅反应的碳化硼的至少一部分成为硅化碳化硼。另外，制造反应结合陶瓷材料的方法。该方法可以包括以下步骤：从碳化硼，碳和有机粘合剂的混合物形成生坯，并使生坯与包含硅的液体渗透剂接触。浸渍剂具有约1625℃至约1700℃的温度。此外，制备反应结合碳化硼陶瓷体的方法。该方法包括从碳化硼，碳和有机粘合剂的混合物形成生坯体的步骤。生坯中碳化硼与碳的重量比可以为约5:5至1或更大。该方法还包括通过使生坯与熔融硅浸润剂接触将碳化硼的第一部分硅化成硅化碳化硼，其中浸渗剂具有约1625℃至约1700℃的温度。该方法还可包括将第二部分碳化硼溶解在硅浸润剂中，其中至少一些溶解的碳化硼被再沉淀为平滑颗粒。

6. 发明授权

US4414036A Sanitizer system and sanitizing method for carbonated beverage container filler machine 失效
标题翻译：碳酸饮料容器灌装机消毒系统及消毒方法
公开(公告)号：US4414036A
公开(公告)日：1983-11-08
申请号：US303354
申请日：1981-09-18
申请人： Frank E. Anderson , Robert A. Martin
发明人： Frank E. Anderson , Robert A. Martin
IPC分类号： B67C3/00 , B08B9/00
CPC分类号： B67C3/001
摘要： A sanitizing method and a sanitizer system to be attached to a conventional circular bottle filling machine as used for filling beverage bottles, the system including a plurality of collector manifolds, each manifold being adapted to collect sanitizing liquid from a plurality of adjacent filler valves, there being a sufficient number of manifolds with plural valve engaging tubes to accommodate every filler valve of a particular machine; the manifolds are connectable by flexible hoses to a rotating collector which is preferably permanently installed at the top of the bottle filler machine so that the entry ports of the collector rotate with the rotating conveyor table of the machine and the exit port of the collector is from a stationary portion thereof. There is a provision for passage of carbon dioxide gas through the center of the collector in cases where the bottle filler machine employs an overhead supply conduit for carbon dioxide to maintain carbonation in the beverage in the filler bowl. Jacks are provided for the manifolds to hold them firmly up against the seals of the filler valves. Hoses are connectable to the manifolds by quick connect fittings and the rotating table is provided with retainers to hold the ends of the hoses while the sanitizer system is not in use and the machine is being used in a normal filling operation. The manifolds are completely removable and there is no modification required to the filler valves or other parts of the machine which might interfere with the normal filling operation.
摘要翻译：一种消毒方法和消毒系统，其连接到用于填充饮料瓶的常规圆瓶灌装机，该系统包括多个收集器歧管，每个歧管适于从多个相邻的填充阀收集消毒液体，那里是具有多个阀接合管的足够数量的歧管，以容纳特定机器的每个填充阀; 歧管可以通过柔性软管连接到旋转收集器，旋转收集器优选地永久地安装在加瓶机的顶部，使得收集器的入口端口与机器的旋转输送机台旋转，并且收集器的出口端口从其固定部分。在填充机器采用用于二氧化碳的塔顶供给导管以保持填料碗中的饮料中的碳酸化的情况下，存在通过集电器中心的二氧化碳气体通过的规定。为歧管提供插孔以将其紧紧地固定在填充阀的密封件上。软管可以通过快速连接配件连接到歧管，旋转台上设有保持器，用于在消毒器系统不使用的同时将机器保持在软管的两端，并且机器正在正常的灌装操作中使用。歧管是完全可拆卸的，并且对于可能干扰正常填充操作的加注阀或机器的其它部件，不需要修改。

7. 发明授权

US07414262B2 Electronic devices and methods for forming the same 有权
标题翻译：电子设备及其形成方法
公开(公告)号：US07414262B2
公开(公告)日：2008-08-19
申请号：US11241221
申请日：2005-09-30
申请人： Frank E. Anderson , Robert W. Cornell , Yimin Guan
发明人： Frank E. Anderson , Robert W. Cornell , Yimin Guan
IPC分类号： H01L29/06
CPC分类号： H01L29/78603 , H01L27/1292 , H01L29/66757 , H01L29/74
摘要： Electronic devices, such as those having a flexible substrate and printed material on the flexible substrate. In one embodiment, the printed material and substrate are part of an electronic device having at least three terminals, wherein the electronic device has a charge carrier mobility of at least 10 cm2/V-s. Multi-terminal devices can have a substrate including a doped semiconductor layer and at least two doped regions formed upon the substrate. The doped regions can be doped oppositely from the semiconductor layer and exhibit a charge carrier mobility of greater than 10 cm2/V-s. Methods for making the same are also disclosed.
摘要翻译：诸如在柔性基底上具有柔性基底和印刷材料的电子器件。在一个实施例中，印刷材料和基底是具有至少三个端子的电子器件的一部分，其中电子器件具有至少10cm 2 / V-s的电荷载流子迁移率。多端子器件可以具有包括掺杂半导体层和形成在衬底上的至少两个掺杂区的衬底。掺杂区域可以与半导体层相反地掺杂并且表现出大于10cm 2 / V-s的电荷载流子迁移率。还公开了制备其的方法。

8. 发明授权

US07396186B2 Apparatus for improving the control of a concrete screed head assembly 有权
标题翻译：用于改进混凝土熨平板头组件的控制的装置
公开(公告)号：US07396186B2
公开(公告)日：2008-07-08
申请号：US11673010
申请日：2007-02-09
申请人： Philip J. Quenzi , Carl B. Kieranen , Frank E. Anderson , Jeffrey W. Torvinen , Mark A. Pietila
发明人： Philip J. Quenzi , Carl B. Kieranen , Frank E. Anderson , Jeffrey W. Torvinen , Mark A. Pietila
IPC分类号： E01C23/01
CPC分类号： E01C19/40 , E01C19/006 , E01C19/405 , E01C2301/20 , E04F21/247 , E04G21/066
摘要： A screeding device for screeding a concrete surface includes a support member, a screed head assembly mounted to the support member, and a control. The screed head assembly includes a grade setting device and a vibrating member, and is selectively movable in a screeding direction over and along the concrete surface by the support member. The vibrating member is vibratable to screed the concrete surface as the screed head assembly is moved in the screeding direction over and along the concrete surface. The control is operable to automatically stop vibration of the vibrating member when the support member is not moving the screed head assembly in the screeding direction and to automatically vibrate the vibrating member when the support member moves the screed head assembly in the screeding direction.
摘要翻译：用于熨平混凝土表面的刮平装置包括支撑构件，安装到支撑构件的熨平板头组件和控制装置。熨平头组件包括坡度调节装置和振动构件，并且可以通过支撑构件在混凝土表面上并沿着刮板方向选择性地移动。当熨平板头组件沿着整平方向在混凝土表面上和沿着混凝土表面移动时，振动构件可振动以对混凝土表面进行熨平。当支撑构件在熨平板方向上不使熨平板头组件移动时，控制可自动停止振动构件的振动，并且当支撑构件沿熨平方向移动熨平板头组件时，自动振动振动构件。

9. 发明授权

US07195343B2 Low ejection energy micro-fluid ejection heads 有权
标题翻译：低喷射能量微流体喷射头
公开(公告)号：US07195343B2
公开(公告)日：2007-03-27
申请号：US10927796
申请日：2004-08-27
申请人： Frank E. Anderson , Byron V. Bell , Robert W. Cornell , Yimin Guan
发明人： Frank E. Anderson , Byron V. Bell , Robert W. Cornell , Yimin Guan
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/14129 , B41J2/1628 , B41J2/164 , Y10T29/49401
摘要： A micro-fluid ejection device structure and method therefor having improved low energy design. The devices includes a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.
摘要翻译：一种具有改进的低能量设计的微流体喷射装置结构及其方法。这些器件包括沉积在半导体衬底上的半导体衬底和绝缘层。在选自TaAl，Ta2N，TaAl（O，N），TaAlSi，Ti（N，O），WSi（O，N），TaAlN等的电阻层的绝缘层上形成多个加热电阻体，和TaAl / TaAlN。选自可氧化金属并且具有约500至约5000埃的厚度的牺牲层沉积在多个加热电阻器上。电极从第一金属导电层形成在牺牲层上，以提供与多个加热电阻器的阳极和阴极连接。牺牲层在等离子体氧化过程中被氧化，以在多个加热电阻器上提供流体接触层。

10. 发明授权

US07055756B2 Deposition fabrication using inkjet technology 有权
标题翻译：使用喷墨技术的沉积制造
公开(公告)号：US07055756B2
公开(公告)日：2006-06-06
申请号：US10973106
申请日：2004-10-25
申请人： Frank E. Anderson , Yimin Guan
发明人： Frank E. Anderson , Yimin Guan
IPC分类号： G06K19/06 , H05K1/03 , H05K1/05
CPC分类号： H05K3/125 , H05K3/1208 , H05K2201/0116 , H05K2203/013 , Y10T428/24802 , Y10T436/209163
摘要： A method of fabricating an RFID antenna, the method comprising: (a) depositing a slurry upon a substrate in a predetermined pattern, the substrate including a plurality of micropores operative to drain a fluid component of the slurry from the surface of the substrate, while maintaining conductive particles of the slurry on a surface of the substrate; and (b) drying the conductive particles to secure the conductive particles upon a surface of the substrate and provide a conductive antenna. The invention also includes an RFID tag comprising: (a) a substrate including a plurality of micropores; (b) a microchip; and (c) an RFID antenna in electrical communication with the microchip and contacting the substrate, the RFID antenna comprising conductive particles deposited upon the substrate by ejecting a slurry from an inkjet printer.
摘要翻译：一种制造RFID天线的方法，所述方法包括：（a）以预定图案将浆料沉积在基底上，所述基底包括多个微孔，用于从所述基底的表面排出所述浆液的流体成分，同时将所述浆料的导电颗粒保持在所述基底的表面上; 和（b）干燥导电颗粒以将导电颗粒固定在基板的表面上并提供导电天线。本发明还包括RFID标签，其包括：（a）包括多个微孔的基底; （b）微芯片; 和（c）与微芯片电连通并接触基板的RFID天线，RFID天线包括通过从喷墨打印机喷射浆料而沉积在基板上的导电颗粒。

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