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    • 2. 发明申请
    • Methods and apparatuses for regulating the temperature of multi-via heater chips
    • 用于调节多通道加热器芯片温度的方法和装置
    • US20070153045A1
    • 2007-07-05
    • US11324167
    • 2005-12-30
    • Lucas BarkleyBruce GibsonEric HallDavid KingGeorge Parish
    • Lucas BarkleyBruce GibsonEric HallDavid KingGeorge Parish
    • B41J29/38
    • B41J2/195B41J2/04563B41J2/0458
    • Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. Additionally, the first heater array and the second heater array are operable to receive heating responsive to the temperature of the region sensed by the temperature sensing element to regulate the temperature of the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor and the heating may occur via non-nucleating heating.
    • 用于与打印装置一起使用的加热器芯片,例如包括基本上邻近第一通孔定位的第一加热器阵列的加热器芯片和基本上邻近第二通孔定位的第二加热器阵列。 加热器芯片还可以包括位于第一加热器阵列和第二加热器阵列之间的区域,以及温度感测元件,其可操作以感测区域的温度,其中温度感测元件相对于该区域基本上居中设置。 另外,第一加热器阵列和第二加热器阵列可操作以响应于由温度感测元件感测的区域的温度接收加热,以调节该区域的温度。 根据本发明的一个实施例,温度感测元件包括温度感测电阻器,并且加热可以通过非成核加热发生。