会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Programmed pulse electroplating process
    • 程序脉冲电镀工艺
    • US06402924B1
    • 2002-06-11
    • US09561883
    • 2000-05-01
    • James L. MartinStephane MenardDavid N. Michelen
    • James L. MartinStephane MenardDavid N. Michelen
    • C25D518
    • C25D3/38C25D5/18H05K3/241H05K3/423Y10S205/92
    • The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current density; and varying the ratio of peak reverse current density to peak forward current density in periodic cycles to provide metal deposits of uniform thickness and appearance upon the substrate. The invention also relates to a process for improving the properties of an electrodeposit, particularly on substrates having uneven surfaces or apertures, by using programmed pulse periodic reverse current modulation. More particularly, it involves varying the anodic to cathodic current density ratio, in order to improve the surface uniformity appearance, grain structure and levelling of the deposit while maintaining high current density throwing power.
    • 本发明涉及一种将金属电沉积到衬底上的方法,其包括使用峰值反向电流密度和峰值正向电流密度施加脉冲周期反向电流跨越电镀单元的电极; 并且在周期性循环中改变峰值反向电流密度与峰值正向电流密度的比率,以提供在衬底上具有均匀厚度和外观的金属沉积物。 本发明还涉及通过使用编程的脉冲周期性反向电流调制来改善电沉积物的性质,特别是在具有不平坦表面或孔的基底上的方法。 更具体地,涉及改变阳极至阴极电流密度比,以便在保持高电流密度投射功率的同时改善沉积物的表面均匀性外观,晶粒结构和平整度。