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1. 发明公开

EP2776880A1 ARRANGEMENT FOR PLACEMENT AND ALIGNMENT OF OPTO-ELECTRONIC COMPONENTS 审中-公开
标题翻译：安排定位和对准电子元件的OPTO
公开(公告)号：EP2776880A1
公开(公告)日：2014-09-17
申请号：EP12798508.3
申请日：2012-11-13
申请人： Cisco Technology, Inc. , Shastri, Kalpendu , Kachru, Ravinder , Desai, Kishor
发明人： SHASTRI, Kalpendu , KACHRU, Ravinder , DESAI, Kishor
IPC分类号： G02B6/42
CPC分类号： G02B6/423 , G01B11/14 , G02B6/4239 , G02B6/4249
摘要： An arrangement for providing passive alignment of optical components on a common substrate uses a set of reference cavities, where each optical device is positioned within a separate reference cavity. The reference cavities are formed to have a predetermined depth, with perimeters slightly larger than the footprint of their associated optical components. The reference cavity includes at least one right-angle corner that is used as a registration corner against which a right-angle corner of an associated optical component is positioned. The placement of each optical component in its own reference cavity allows for passive optical alignment to be achieved by placing each component against its predefined registration corner.

2. 发明公开

EP2769253A1 MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEMBLIES 有权转让
标题翻译： PRESS玻璃盖板进行封装晶片级光电安排
公开(公告)号：EP2769253A1
公开(公告)日：2014-08-27
申请号：EP12784181.5
申请日：2012-10-19
申请人： Cisco Technology, Inc. , Desai, Kishor , Kachru, Ravinder , Patel, Vipulkumar , Dama, Bipin , Shastri, Kalpendu , Pathak, Soham
发明人： DESAI, Kishor , KACHRU, Ravinder , PATEL, Vipulkumar , DAMA, Bipin , SHASTRI, Kalpendu , PATHAK, Soham
IPC分类号： G02B6/42 , H01L25/16
摘要： An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.

3. 发明申请

WO2013071279A1 ARRANGEMENT FOR PLACEMENT AND ALIGNMENT OF OPTO-ELECTRONIC COMPONENTS 审中-公开
标题翻译： OPTO-ELECTRONIC COMPONENTS的布局和对齐方案
公开(公告)号：WO2013071279A1
公开(公告)日：2013-05-16
申请号：PCT/US2012/064758
申请日：2012-11-13
申请人： CISCO TECHNOLOGY, INC. , SHASTRI, Kalpendu , KACHRU, Ravinder , DESAI, Kishor
发明人： SHASTRI, Kalpendu , KACHRU, Ravinder , DESAI, Kishor
IPC分类号： G02B6/42
CPC分类号： G02B6/423 , G01B11/14 , G02B6/4239 , G02B6/4249
摘要： An arrangement for providing passive alignment of optical components on a common substrate uses a set of reference cavities, where each optical device is positioned within a separate reference cavity. The reference cavities are formed to have a predetermined depth, with perimeters slightly larger than the footprint of their associated optical components. The reference cavity includes at least one right-angle corner that is used as a registration corner against which a right-angle corner of an associated optical component is positioned. The placement of each optical component in its own reference cavity allows for passive optical alignment to be achieved by placing each component against its predefined registration corner.
摘要翻译：用于在公共衬底上提供光学部件的被动对准的装置使用一组参考腔，其中每个光学装置定位在单独的参考腔内。参考空腔形成为具有预定深度，其周长稍大于其相关联的光学部件的覆盖区。参考腔包括至少一个直角角，其被用作相关联的光学部件的直角角位于其上的配准角。每个光学部件在其自己的参考腔中的放置允许通过将每个部件放置在其预定义的配准角上来实现无源光学对准。

4. 发明申请

WO2013059731A1 MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEMBLIES 审中-公开
标题翻译：用于光伏电子组件的水平包装的模制玻璃盖
公开(公告)号：WO2013059731A1
公开(公告)日：2013-04-25
申请号：PCT/US2012/061200
申请日：2012-10-19
申请人： CISCO TECHNOLOGY, INC. , DESAI, Kishor , KACHRU, Ravinder , PATEL, Vipulkumar , DAMA, Bipin , SHASTRI, Kalpendu , PATHAK, Soham
发明人： DESAI, Kishor , KACHRU, Ravinder , PATEL, Vipulkumar , DAMA, Bipin , SHASTRI, Kalpendu , PATHAK, Soham
IPC分类号： G02B6/42 , H01L25/16
CPC分类号： G02B6/4255 , G02B6/12 , G02B6/13 , G02B6/4201 , G02B6/4257 , G02B6/4292 , G02B6/43 , H01L21/50 , H01L23/04 , H01L23/48 , H01L25/167 , H01L31/0203 , H01L33/52 , H01L2924/15311 , H01L2924/16152 , H01L2924/1616 , H01L2924/165 , H01L2924/16788 , H05K1/0268 , H05K1/0274 , H05K2201/10121 , H01L2924/0105 , H01L2924/01079
摘要： An opto-electronic assembly is provided comprising a substrate 20 (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material 22 is disposed to outline a defined peripheral area of the substrate. A molded glass lid 10 is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.
摘要翻译：提供了一种光电组件，其包括用于支撑多个互连的光学和电气部件的基底20（通常为硅或玻璃）。设置密封材料层22以概述衬底的限定的周边区域。模制玻璃盖10设置在基底上并结合到基底上，其中模制的玻璃盖被配置成产生与限定的基底周边区域匹配的覆盖区。模制玻璃盖的底表面包括一层接合材料，其在接触时与基底的密封材料层接触，形成结合组件。在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。

5. 发明申请

WO2012151520A2 WAFER SCALE PACKAGING PLATFORM FOR TRANSCEIVERS 审中-公开
标题翻译：收货机的平均包装平台
公开(公告)号：WO2012151520A2
公开(公告)日：2012-11-08
申请号：PCT/US2012/036582
申请日：2012-05-04
申请人： LIGHTWIRE LLC , SHASTRI, Kalpendu , PATEL, Vipulkumar , WEBSTER, Mark , GOTHOSKAR, Prakash , KACHRU, Ravinder , PATHAK, Soham , YELAMARTY, Rao, V. , DAUGHERTY, Thomas , DAMA, Bipin , PATEL, Kaushik , DESAI, Kishor
发明人： SHASTRI, Kalpendu , PATEL, Vipulkumar , WEBSTER, Mark , GOTHOSKAR, Prakash , KACHRU, Ravinder , PATHAK, Soham , YELAMARTY, Rao, V. , DAUGHERTY, Thomas , DAMA, Bipin , PATEL, Kaushik , DESAI, Kishor
IPC分类号： H01L25/16 , H01L25/18
CPC分类号： H01L25/50 , G02B6/423 , G02B6/4244 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/426 , H01L25/167 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a "platform" (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.
摘要翻译：光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义分离光学元件之间的光信号路径。实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

6. 发明申请

WO2016137954A1 OPTICALLY COUPLING WAVEGUIDES 审中-公开
标题翻译：光耦合波长
公开(公告)号：WO2016137954A1
公开(公告)日：2016-09-01
申请号：PCT/US2016/019073
申请日：2016-02-23
申请人： CISCO TECHNOLOGY, INC.
发明人： KACHRU, Ravinder , SUN, Pang-Chen , TOGAMI, Chris Kiyoshi
IPC分类号： G02B6/30 , G02B6/32 , G02B6/12
CPC分类号： G02B6/26 , G02B6/30 , G02B6/32 , G02B6/4214 , G02B2006/12061 , G02F1/093 , G02F1/39 , H01S5/0208
摘要： Embodiments disclosed herein generally relate to an optical device for transferring light between a first and second waveguide. The optical device may generally include the first waveguide, which may be a silicon waveguide, a first support member and a base on which the first waveguide and first support member are disposed. The optical device may further include a second support member wherein the first support member is disposed between the second support member and the base. The second support member comprises at least one groove or inset. The second waveguide, which may be an optical fiber, may be disposed at least partially in the groove such that the second waveguide is between the first and second support members. The optical device may further include at least one lens disposed between the first waveguide and the second waveguide to transfer an optical signal between the first and second waveguides through the lens.
摘要翻译：本文公开的实施例通常涉及用于在第一和第二波导之间传送光的光学装置。光学器件通常可以包括第一波导，其可以是硅波导，第一支撑构件和基座，第一波导和第一支撑构件设置在基座上。光学装置还可以包括第二支撑构件，其中第一支撑构件设置在第二支撑构件和基座之间。第二支撑构件包括至少一个凹槽或插入物。第二波导（其可以是光纤）可以至少部分地设置在凹槽中，使得第二波导位于第一和第二支撑构件之间。光学装置还可以包括设置在第一波导和第二波导之间的至少一个透镜，以通过透镜在第一和第二波导之间转移光信号。

7. 发明申请

WO2014092955A1 COUPLING LIGHT FROM AN EMITTER ARRAY TO A SINGLE MODE FIBER ARRAY 审中-公开
标题翻译：从发射机阵列耦合到单模光纤阵列
公开(公告)号：WO2014092955A1
公开(公告)日：2014-06-19
申请号：PCT/US2013/071053
申请日：2013-11-20
申请人： CISCO TECHNOLOGY, INC.
发明人： KACHRU, Ravinder , TOGAMI, Chris , DESAI, Kishor
IPC分类号： G02B6/42
CPC分类号： G02B6/4226 , G02B6/32 , G02B6/42 , G02B6/4206 , G02B6/4214 , G02B7/005 , H04B10/2503 , H04B10/516
摘要： Techniques for coupling light from a waveguide array to a single mode fiber array are described. In an embodiment, lateral misalignment of an array of focusing lenses (106) and an array of optical fiber ferrules (107) held into alignment by a lens holder sub¬ assembly is compensated by tilting the lens holder sub-assembly with respect to the propagation axis of the light being coupled by the lens holder-subassembly. Since the amount of tilt can be adjusted according to the degree of lateral misalignment, lens holder sub¬ assemblies manufactured with varying degrees of misalignment may be utilized to couple light into single mode fiber-optic cable. In addition, the same technique can also be used to compensate for other defects as well, such as angular errors in manufacturing or placement of a turning mirror (102) or prism used to direct light into the lens holder sub-assembly.
摘要翻译：描述了将光从波导阵列耦合到单模光纤阵列的技术。在一个实施例中，聚焦透镜阵列（106）和通过透镜保持器子组件保持对准的光纤套圈（107）阵列的横向偏移通过相对于传播的倾斜使透镜保持器子组件倾斜来补偿光的轴线由透镜保持器 - 子组件耦合。由于可以根据横向错位的程度来调节倾斜量，所以可以利用以不同程度的不对准制造的透镜保持器子组件将光耦合到单模光纤电缆中。此外，也可以使用相同的技术来补偿其他缺陷，例如用于将光引导到透镜保持器子组件中的旋转镜（102）或棱镜的制造或放置中的角度误差。

8. 发明授权

EP2769253B1 MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEMBLIES 有权转让
公开(公告)号：EP2769253B1
公开(公告)日：2020-07-15
申请号：EP12784181.5
申请日：2012-10-19
申请人： Cisco Technology, Inc.
发明人： DESAI, Kishor , KACHRU, Ravinder , PATEL, Vipulkumar , DAMA, Bipin , SHASTRI, Kalpendu , PATHAK, Soham
IPC分类号： G02B6/42 , H01L21/50 , H05K1/02

9. 发明公开

EP3262448A1 OPTICALLY COUPLING WAVEGUIDES 有权
标题翻译：光耦合波导
公开(公告)号：EP3262448A1
公开(公告)日：2018-01-03
申请号：EP16706782.6
申请日：2016-02-23
申请人： Cisco Technology, Inc.
发明人： KACHRU, Ravinder , SUN, Pang-Chen , TOGAMI, Chris Kiyoshi
IPC分类号： G02B6/30 , G02B6/32 , G02B6/12
CPC分类号： G02B6/26 , G02B6/30 , G02B6/32 , G02B6/4214 , G02B2006/12061 , G02F1/093 , G02F1/39 , H01S5/0208
摘要： Embodiments disclosed herein generally relate to an optical device for transferring light between a first and second waveguide. The optical device may generally include the first waveguide, a first support member and a base on which the first waveguide and first support member are disposed. The optical device may further include a second support member wherein the first support member is disposed between the second support member and the base. The second support member comprises at least one groove. The second waveguide may be disposed at least partially in the groove such that the second waveguide is between the first and second support members. The optical device may further include at least one lens disposed between the first waveguide and the second waveguide to transfer an optical signal between the first and second waveguides through the lens.

10. 发明公开

EP2932324A1 COUPLING LIGHT FROM AN EMITTER ARRAY TO A SINGLE MODE FIBER ARRAY 审中-实审
标题翻译：光从发射器阵列配对单模光纤阵列
公开(公告)号：EP2932324A1
公开(公告)日：2015-10-21
申请号：EP13802491.4
申请日：2013-11-20
申请人： Cisco Technology, Inc.
发明人： KACHRU, Ravinder , TOGAMI, Chris , DESAI, Kishor
IPC分类号： G02B6/42
CPC分类号： G02B6/4226 , G02B6/32 , G02B6/42 , G02B6/4206 , G02B6/4214 , G02B7/005 , H04B10/2503 , H04B10/516
摘要： Techniques for coupling light from a waveguide array to a single mode fiber array are described. In an embodiment, lateral misalignment of an array of focusing lenses (106) and an array of optical fiber ferrules (107) held into alignment by a lens holder sub¬ assembly is compensated by tilting the lens holder sub-assembly with respect to the propagation axis of the light being coupled by the lens holder-subassembly. Since the amount of tilt can be adjusted according to the degree of lateral misalignment, lens holder sub¬ assemblies manufactured with varying degrees of misalignment may be utilized to couple light into single mode fiber-optic cable. In addition, the same technique can also be used to compensate for other defects as well, such as angular errors in manufacturing or placement of a turning mirror (102) or prism used to direct light into the lens holder sub-assembly.

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