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1. 发明申请

WO2013071279A1 ARRANGEMENT FOR PLACEMENT AND ALIGNMENT OF OPTO-ELECTRONIC COMPONENTS 审中-公开
标题翻译： OPTO-ELECTRONIC COMPONENTS的布局和对齐方案
公开(公告)号：WO2013071279A1
公开(公告)日：2013-05-16
申请号：PCT/US2012/064758
申请日：2012-11-13
申请人： CISCO TECHNOLOGY, INC. , SHASTRI, Kalpendu , KACHRU, Ravinder , DESAI, Kishor
发明人： SHASTRI, Kalpendu , KACHRU, Ravinder , DESAI, Kishor
IPC分类号： G02B6/42
CPC分类号： G02B6/423 , G01B11/14 , G02B6/4239 , G02B6/4249
摘要： An arrangement for providing passive alignment of optical components on a common substrate uses a set of reference cavities, where each optical device is positioned within a separate reference cavity. The reference cavities are formed to have a predetermined depth, with perimeters slightly larger than the footprint of their associated optical components. The reference cavity includes at least one right-angle corner that is used as a registration corner against which a right-angle corner of an associated optical component is positioned. The placement of each optical component in its own reference cavity allows for passive optical alignment to be achieved by placing each component against its predefined registration corner.
摘要翻译：用于在公共衬底上提供光学部件的被动对准的装置使用一组参考腔，其中每个光学装置定位在单独的参考腔内。参考空腔形成为具有预定深度，其周长稍大于其相关联的光学部件的覆盖区。参考腔包括至少一个直角角，其被用作相关联的光学部件的直角角位于其上的配准角。每个光学部件在其自己的参考腔中的放置允许通过将每个部件放置在其预定义的配准角上来实现无源光学对准。

2. 发明申请

WO2013059731A1 MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEMBLIES 审中-公开
标题翻译：用于光伏电子组件的水平包装的模制玻璃盖
公开(公告)号：WO2013059731A1
公开(公告)日：2013-04-25
申请号：PCT/US2012/061200
申请日：2012-10-19
申请人： CISCO TECHNOLOGY, INC. , DESAI, Kishor , KACHRU, Ravinder , PATEL, Vipulkumar , DAMA, Bipin , SHASTRI, Kalpendu , PATHAK, Soham
发明人： DESAI, Kishor , KACHRU, Ravinder , PATEL, Vipulkumar , DAMA, Bipin , SHASTRI, Kalpendu , PATHAK, Soham
IPC分类号： G02B6/42 , H01L25/16
CPC分类号： G02B6/4255 , G02B6/12 , G02B6/13 , G02B6/4201 , G02B6/4257 , G02B6/4292 , G02B6/43 , H01L21/50 , H01L23/04 , H01L23/48 , H01L25/167 , H01L31/0203 , H01L33/52 , H01L2924/15311 , H01L2924/16152 , H01L2924/1616 , H01L2924/165 , H01L2924/16788 , H05K1/0268 , H05K1/0274 , H05K2201/10121 , H01L2924/0105 , H01L2924/01079
摘要： An opto-electronic assembly is provided comprising a substrate 20 (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material 22 is disposed to outline a defined peripheral area of the substrate. A molded glass lid 10 is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.
摘要翻译：提供了一种光电组件，其包括用于支撑多个互连的光学和电气部件的基底20（通常为硅或玻璃）。设置密封材料层22以概述衬底的限定的周边区域。模制玻璃盖10设置在基底上并结合到基底上，其中模制的玻璃盖被配置成产生与限定的基底周边区域匹配的覆盖区。模制玻璃盖的底表面包括一层接合材料，其在接触时与基底的密封材料层接触，形成结合组件。在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。

3. 发明申请

WO2014092955A1 COUPLING LIGHT FROM AN EMITTER ARRAY TO A SINGLE MODE FIBER ARRAY 审中-公开
标题翻译：从发射机阵列耦合到单模光纤阵列
公开(公告)号：WO2014092955A1
公开(公告)日：2014-06-19
申请号：PCT/US2013/071053
申请日：2013-11-20
申请人： CISCO TECHNOLOGY, INC.
发明人： KACHRU, Ravinder , TOGAMI, Chris , DESAI, Kishor
IPC分类号： G02B6/42
CPC分类号： G02B6/4226 , G02B6/32 , G02B6/42 , G02B6/4206 , G02B6/4214 , G02B7/005 , H04B10/2503 , H04B10/516
摘要： Techniques for coupling light from a waveguide array to a single mode fiber array are described. In an embodiment, lateral misalignment of an array of focusing lenses (106) and an array of optical fiber ferrules (107) held into alignment by a lens holder sub¬ assembly is compensated by tilting the lens holder sub-assembly with respect to the propagation axis of the light being coupled by the lens holder-subassembly. Since the amount of tilt can be adjusted according to the degree of lateral misalignment, lens holder sub¬ assemblies manufactured with varying degrees of misalignment may be utilized to couple light into single mode fiber-optic cable. In addition, the same technique can also be used to compensate for other defects as well, such as angular errors in manufacturing or placement of a turning mirror (102) or prism used to direct light into the lens holder sub-assembly.
摘要翻译：描述了将光从波导阵列耦合到单模光纤阵列的技术。在一个实施例中，聚焦透镜阵列（106）和通过透镜保持器子组件保持对准的光纤套圈（107）阵列的横向偏移通过相对于传播的倾斜使透镜保持器子组件倾斜来补偿光的轴线由透镜保持器 - 子组件耦合。由于可以根据横向错位的程度来调节倾斜量，所以可以利用以不同程度的不对准制造的透镜保持器子组件将光耦合到单模光纤电缆中。此外，也可以使用相同的技术来补偿其他缺陷，例如用于将光引导到透镜保持器子组件中的旋转镜（102）或棱镜的制造或放置中的角度误差。

4. 发明授权

EP2769253B1 MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEMBLIES 有权转让
公开(公告)号：EP2769253B1
公开(公告)日：2020-07-15
申请号：EP12784181.5
申请日：2012-10-19
申请人： Cisco Technology, Inc.
发明人： DESAI, Kishor , KACHRU, Ravinder , PATEL, Vipulkumar , DAMA, Bipin , SHASTRI, Kalpendu , PATHAK, Soham
IPC分类号： G02B6/42 , H01L21/50 , H05K1/02

5. 发明公开

EP2932324A1 COUPLING LIGHT FROM AN EMITTER ARRAY TO A SINGLE MODE FIBER ARRAY 审中-实审
标题翻译：光从发射器阵列配对单模光纤阵列
公开(公告)号：EP2932324A1
公开(公告)日：2015-10-21
申请号：EP13802491.4
申请日：2013-11-20
申请人： Cisco Technology, Inc.
发明人： KACHRU, Ravinder , TOGAMI, Chris , DESAI, Kishor
IPC分类号： G02B6/42
CPC分类号： G02B6/4226 , G02B6/32 , G02B6/42 , G02B6/4206 , G02B6/4214 , G02B7/005 , H04B10/2503 , H04B10/516
摘要： Techniques for coupling light from a waveguide array to a single mode fiber array are described. In an embodiment, lateral misalignment of an array of focusing lenses (106) and an array of optical fiber ferrules (107) held into alignment by a lens holder sub¬ assembly is compensated by tilting the lens holder sub-assembly with respect to the propagation axis of the light being coupled by the lens holder-subassembly. Since the amount of tilt can be adjusted according to the degree of lateral misalignment, lens holder sub¬ assemblies manufactured with varying degrees of misalignment may be utilized to couple light into single mode fiber-optic cable. In addition, the same technique can also be used to compensate for other defects as well, such as angular errors in manufacturing or placement of a turning mirror (102) or prism used to direct light into the lens holder sub-assembly.

6. 发明公开

EP2776880A1 ARRANGEMENT FOR PLACEMENT AND ALIGNMENT OF OPTO-ELECTRONIC COMPONENTS 审中-公开
标题翻译：安排定位和对准电子元件的OPTO
公开(公告)号：EP2776880A1
公开(公告)日：2014-09-17
申请号：EP12798508.3
申请日：2012-11-13
申请人： Cisco Technology, Inc. , Shastri, Kalpendu , Kachru, Ravinder , Desai, Kishor
发明人： SHASTRI, Kalpendu , KACHRU, Ravinder , DESAI, Kishor
IPC分类号： G02B6/42
CPC分类号： G02B6/423 , G01B11/14 , G02B6/4239 , G02B6/4249
摘要： An arrangement for providing passive alignment of optical components on a common substrate uses a set of reference cavities, where each optical device is positioned within a separate reference cavity. The reference cavities are formed to have a predetermined depth, with perimeters slightly larger than the footprint of their associated optical components. The reference cavity includes at least one right-angle corner that is used as a registration corner against which a right-angle corner of an associated optical component is positioned. The placement of each optical component in its own reference cavity allows for passive optical alignment to be achieved by placing each component against its predefined registration corner.

7. 发明公开

EP2769253A1 MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEMBLIES 有权转让
标题翻译： PRESS玻璃盖板进行封装晶片级光电安排
公开(公告)号：EP2769253A1
公开(公告)日：2014-08-27
申请号：EP12784181.5
申请日：2012-10-19
申请人： Cisco Technology, Inc. , Desai, Kishor , Kachru, Ravinder , Patel, Vipulkumar , Dama, Bipin , Shastri, Kalpendu , Pathak, Soham
发明人： DESAI, Kishor , KACHRU, Ravinder , PATEL, Vipulkumar , DAMA, Bipin , SHASTRI, Kalpendu , PATHAK, Soham
IPC分类号： G02B6/42 , H01L25/16
摘要： An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.

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