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    • 2. 发明授权
    • Battery core and method of manufacturing the same
    • 电池芯和制造方法相同
    • US09123924B2
    • 2015-09-01
    • US13596299
    • 2012-08-28
    • Ming-Lung ChenChien-Ming ChenChing-Chou YuSheng-Fu Wen
    • Ming-Lung ChenChien-Ming ChenChing-Chou YuSheng-Fu Wen
    • H01M4/64H01M4/04H01M10/04
    • H01M4/0404H01M10/0431Y10T29/49208
    • A battery core and a method of manufacturing the same are disclosed herein. The battery core includes a first electrode plate and a second electrode plate. The first electrode plate includes a substrate and a first active material. A first portion of the first active material is formed on a first area of the substrate, and a second portion of the first active material is formed on a second area of the substrate. The second electrode plate includes first and second substrates disconnected from each other, and a second active material. The first and second substrates are positioned corresponding to the first and second first areas respectively. A first portion of the second active material is formed on the first substrate, and a second portion of the second active material is formed on the second substrate.
    • 本文公开了电池芯及其制造方法。 电池芯包括第一电极板和第二电极板。 第一电极板包括基板和第一活性材料。 第一活性材料的第一部分形成在衬底的第一区域上,并且第一活性材料的第二部分形成在衬底的第二区域上。 第二电极板包括彼此分离的第一和第二基板和第二活性材料。 第一和第二基板分别对应于第一和第二区域定位。 第二活性物质的第一部分形成在第一衬底上,第二活性材料的第二部分形成在第二衬底上。
    • 3. 发明授权
    • Package carrier
    • 包装承运人
    • US08859908B2
    • 2014-10-14
    • US13778078
    • 2013-02-26
    • Chin-Sheng WangChien-Ming Chen
    • Chin-Sheng WangChien-Ming Chen
    • H05K1/00H05K1/11H05K1/02
    • H05K1/0206H01L2924/0002H05K2201/10416H01L2924/00
    • A package carrier includes a substrate, first and second insulation layers, first and second patterned circuit layers, at least one first and second conductive through holes, a heat dissipation channel, an adhesive layer and a heat conducting element. The first and second patterned circuit layers are respectively disposed on the first and second insulation layers which are respectively disposed on upper and lower surfaces of the substrate. The heat dissipation channel at least passes through the first insulation layer, the first and second patterned circuit layers, and the substrate. The first and second conductive through holes electrically connect with the substrate, the first and second patterned circuit layers. At least two opposite side surfaces of the heat conducting element each includes at least one convex portion or at least one concave portion. The heat conducting element is mounted in the heat dissipation channel via the adhesive layer.
    • 封装载体包括衬底,第一和第二绝缘层,第一和第二图案化电路层,至少一个第一和第二导电通孔,散热通道,粘合剂层和导热元件。 第一和第二图案化电路层分别设置在分别设置在基板的上表面和下表面上的第一绝缘层和第二绝缘层上。 散热通道至少穿过第一绝缘层,第一和第二图案化电路层以及基板。 第一和第二导电通孔与衬底电连接,第一和第二图案化电路层。 导热元件的至少两个相对侧表面各自包括至少一个凸部或至少一个凹部。 导热元件通过粘合剂层安装在散热通道中。
    • 4. 发明申请
    • MANUFACTURING METHOD OF COVER STRUCTURE
    • 盖结构的制造方法
    • US20140224411A1
    • 2014-08-14
    • US14253883
    • 2014-04-16
    • Chien-Ming Chen
    • Chien-Ming Chen
    • H05K9/00
    • H05K9/0084H05K9/0086Y10T156/10Y10T156/1039
    • A method of manufacturing a cover structure is provided. A first insulating layer is provided. The first insulating layer has a first surface and a second surface opposite to each other. A second insulating layer is provided. The second insulating layer has a third surface and a fourth surface opposite to each other and an opening passing through the third surface and the fourth surface. A thickness of the second insulating layer is greater than a thickness of the first insulating layer. The first insulating layer and the second insulating layer are laminated to each other, so that the third surface of the second insulating layer connects to the second surface of the first insulating layer. A cavity is defined by the opening of the second insulating layer and the first insulating layer. A metal layer is formed on the cavity.
    • 提供一种制造盖结构的方法。 提供第一绝缘层。 第一绝缘层具有彼此相对的第一表面和第二表面。 提供第二绝缘层。 第二绝缘层具有彼此相对的第三表面和第四表面以及通过第三表面和第四表面的开口。 第二绝缘层的厚度大于第一绝缘层的厚度。 第一绝缘层和第二绝缘层彼此层叠,使得第二绝缘层的第三表面连接到第一绝缘层的第二表面。 空腔由第二绝缘层和第一绝缘层的开口限定。 在空腔上形成金属层。
    • 8. 发明申请
    • Thermal Cutoff Circuit
    • 热断路电路
    • US20120293898A1
    • 2012-11-22
    • US13112372
    • 2011-05-20
    • Meng-Chien ChiangChien-Ming Chen
    • Meng-Chien ChiangChien-Ming Chen
    • H02H3/02
    • H02H5/043
    • A thermal cutoff circuit for an electronic device including a power unit, a thermal sensor, a logic unit, and a power switch unit is provided. The power unit includes a power switch for powering up the thermal cutoff circuit with a supply voltage in response to a user event. The thermal sensor provides an active thermal sense signal and an inactive thermal sense signal when a temperature of the electronic device exceeds a threshold and does not exceed the threshold, respectively. The logic unit provides an inactive cutoff signal and provides an active cutoff signal respectively according to the inactive thermal sense signal and the active thermal sense signal. The power switch unit powers the electronic device up according to the inactive cutoff signal and stops powering up the electronic device according to the active thermal sense signal.
    • 提供一种用于包括功率单元,热传感器,逻辑单元和电源开关单元的电子设备的热断路器。 功率单元包括用于响应于用户事件以电源电压为热断路电路供电的电源开关。 当电子设备的温度超过阈值并且不超过阈值时,热传感器提供有源热感测信号和无效的热感测信号。 逻辑单元提供无效的截止信号,并且根据非活动热感测信号和有源热感测信号分别提供有效的截止信号。 电源开关单元根据不活动的切断信号向上电动电子设备,并根据有源热感测信号停止电子设备的上电。
    • 9. 发明授权
    • Laser capture microdissection system and electric moving stage thereof
    • 激光捕获显微切割系统及其电动移动台
    • US08248585B2
    • 2012-08-21
    • US12654330
    • 2009-12-17
    • Chien-Ming ChenJen-Ai Lee
    • Chien-Ming ChenJen-Ai Lee
    • G01N1/00
    • G01N1/2813G01N2001/284
    • A laser capture microdissection system includes a laser illuminator, a fiber and an electric moving stage. The fiber has a probe terminal and a coupling terminal for being coupled to the laser illuminator. The electric moving stage includes a fiber probe holder, a driving mechanism for vertical shift, a stage unit, a driving mechanism for horizontal shift and an electronic control unit. The driving mechanism for vertical shift serves for driving the fiber probe holder to shift in microscale. The stage unit has a nanoscale shift controller, a placing portion, wherein the nano-scale shift controller is connected to the placing portion, and the placing portion is located under the fiber probe holder. The driving mechanism for horizontal shift serves for driving the stage unit to shift in microscale. The electronic control unit is electrically connected to the nanoscale shift controller and the driving mechanism for horizontal shift.
    • 激光捕获显微解剖系统包括激光照明器,光纤和电动移动台。 光纤具有用于耦合到激光照射器的探针端子和耦合端子。 电动平台包括光纤探头支架,用于垂直移动的驱动机构,平台单元,用于水平移动的驱动机构和电子控制单元。 用于垂直偏移的驱动机构用于驱动光纤探头支架以微观移动。 平台单元具有纳米尺度换档控制器,放置部分,其中纳米级换档控制器连接到放置部分,并且放置部分位于光纤探针支架下方。 水平移动的驱动机构用于驱动舞台单元以微型移动。 电子控制单元电连接到纳米级换档控制器和用于水平移位的驱动机构。