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    • 1. 发明授权
    • Multi-band focal plane array
    • 多波段焦平面阵列
    • US07592593B2
    • 2009-09-22
    • US11493121
    • 2006-07-26
    • Christopher Lee KauffmanGerald Pray GriffithRonald B. JonesSung-Shik YooMichael A. Davis
    • Christopher Lee KauffmanGerald Pray GriffithRonald B. JonesSung-Shik YooMichael A. Davis
    • H01L25/00
    • H01L27/14649G01J3/36
    • A multi-band focal plane array architecture operative to detect multiple spectral image. The multi-band focal plane array architecture has an integrated readout circuit, a plurality of first detectors integrated in the readout circuit and a plurality of second detectors deposited on the readout circuit. Preferably, the first detectors are operative to detect visible signals and the second detectors are operative to detect infrared signals. The first and second detectors are arranged in a checkerboard pattern, in alternate rows or columns, or at least partially overlapped with each other to realize simultaneous detection in two different wavelength bands. The architecture may also have an additional integrated readout circuit flip-chip bonded to the integrated readout circuit. By forming a plurality of third detectors on the additional integrated readout circuit, a tri-band focal plane array may be realized. In one embodiment, a dual-band focal plane array architecture by forming two arrays of detectors on two individual integrated readout circuit and flip-chip bonding these two readout circuits.
    • 一种可以检测多个光谱图像的多波段焦平面阵列结构。 多频带焦平面阵列结构具有集成读出电路,集成在读出电路中的多个第一检测器和沉积在读出电路上的多个第二检测器。 优选地,第一检测器可操作以检测可见信号,并且第二检测器可操作以检测红外信号。 第一和第二检测器被布置成棋盘图案,以交替行或列排列,或至少部分地彼此重叠,以实现两个不同波长带中的同时检测。 该架构还可以具有结合到集成读出电路的额外的集成读出电路倒装芯片。 通过在附加集成读出电路上形成多个第三检测器,可以实现三波段焦平面阵列。 在一个实施例中,双波段焦平面阵列架构通过在两个单独的集成读出电路上形成两个检测器阵列并将这两个读出电路进行倒装芯片接合。
    • 2. 发明申请
    • MULTI-BAND FOCAL PLANE ARRAY
    • 多带对焦平面阵列
    • US20090173883A1
    • 2009-07-09
    • US11493121
    • 2006-07-26
    • Christopher Lee KauffmanGerald Pray GriffithRonald B. JonesSung-Shik YooMichael A. Davis
    • Christopher Lee KauffmanGerald Pray GriffithRonald B. JonesSung-Shik YooMichael A. Davis
    • H01L27/14H01L27/00
    • H01L27/14649G01J3/36
    • A multi-band focal plane array architecture operative to detect multiple spectral image. The multi-band focal plane array architecture has an integrated readout circuit, a plurality of first detectors integrated in the readout circuit and a plurality of second detectors deposited on the readout circuit. Preferably, the first detectors are operative to detect visible signals and the second detectors are operative to detect infrared signals. The first and second detectors are arranged in a checkerboard pattern, in alternate rows or columns, or at least partially overlapped with each other to realize simultaneous detection in two different wavelength bands. The architecture may also have an additional integrated readout circuit flip-chip bonded to the integrated readout circuit. By forming a plurality of third detectors on the additional integrated readout circuit, a tri-band focal plane array may be realized. In one embodiment, a dual-band focal plane array architecture by forming two arrays of detectors on two individual integrated readout circuit and flip-chip bonding these two readout circuits.
    • 一种可以检测多个光谱图像的多波段焦平面阵列结构。 多频带焦平面阵列结构具有集成读出电路,集成在读出电路中的多个第一检测器和沉积在读出电路上的多个第二检测器。 优选地,第一检测器可操作以检测可见信号,并且第二检测器可操作以检测红外信号。 第一和第二检测器被布置成棋盘图案,以交替行或列排列,或至少部分地彼此重叠,以实现两个不同波长带中的同时检测。 该架构还可以具有结合到集成读出电路的额外的集成读出电路倒装芯片。 通过在附加集成读出电路上形成多个第三检测器,可以实现三波段焦平面阵列。 在一个实施例中,双波段焦平面阵列架构通过在两个单独的集成读出电路上形成两个检测器阵列并将这两个读出电路进行倒装芯片接合。