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    • 1. 发明申请
    • Photoconductive bolometer infrared detector
    • 光电测辐射热计红外探测器
    • US20060202120A1
    • 2006-09-14
    • US11079592
    • 2005-03-14
    • Christopher KauffmanSung-Shik YooTimothy Beystrum
    • Christopher KauffmanSung-Shik YooTimothy Beystrum
    • G01J5/00
    • G01J5/20
    • A photoconductive bolometer infrared detector using a detector material that has a resistance changed due to photo-excitation and thermal-excitation from an incident radiation in the infrared range. The resistance changes caused by photo-excitation and the thermal excitation are additive for this detector material. The detector material is suspended over a substrate by a gap of one quarter wavelength of the incident radiation, such that the thermal absorption of the incident radiation can be enhanced. Preferably, the detector material is lead selenide that has a thermal coefficient of resistance as high as 3.45%° C.−1, which is about 60% higher than that of vanadium oxide that has been widely used as the detector material in the conventional microbolometers. This detector structure allows dual band uncooled or moderately cooled operation. In the case of the use of PbSe as the detector material, largely enhanced MWIR operation is enabled over a standard uncooled micro-bolometer tuned to the LWIR, and high temperature dual band MWIR and LWIR operation is enabled as compared to quantum well or HgCdTe detectors that must be cooled to cryogenic temperatures.
    • 使用检测器材料的感光辐射热计红外检测器,其具有由红外范围内的入射辐射引起的光激发和热激发而改变的电阻。 由光激发和热激发引起的电阻变化对于该检测器材料是添加剂。 检测器材料通过入射辐射的四分之一波长的间隙悬置在衬底上,使得可以增强入射辐射的热吸收。 优选地,检测器材料是硒化铅,其具有高达3.45%℃的高的电阻系数。其比已广泛用作氧化钒的电阻高约60% 常规微电热计中的检测器材料。 该检测器结构允许双频带非冷却或中等冷却操作。 在使用PbSe作为检测器材料的情况下,可以通过调谐到LWIR的标准非制冷微量辐照计进行大幅增强的MWIR操作,并且与量子阱或HgCdTe检测器相比,实现了高温双波段MWIR和LWIR操作 必须将其冷却至低温。
    • 5. 发明授权
    • Multi-band focal plane array
    • 多波段焦平面阵列
    • US07592593B2
    • 2009-09-22
    • US11493121
    • 2006-07-26
    • Christopher Lee KauffmanGerald Pray GriffithRonald B. JonesSung-Shik YooMichael A. Davis
    • Christopher Lee KauffmanGerald Pray GriffithRonald B. JonesSung-Shik YooMichael A. Davis
    • H01L25/00
    • H01L27/14649G01J3/36
    • A multi-band focal plane array architecture operative to detect multiple spectral image. The multi-band focal plane array architecture has an integrated readout circuit, a plurality of first detectors integrated in the readout circuit and a plurality of second detectors deposited on the readout circuit. Preferably, the first detectors are operative to detect visible signals and the second detectors are operative to detect infrared signals. The first and second detectors are arranged in a checkerboard pattern, in alternate rows or columns, or at least partially overlapped with each other to realize simultaneous detection in two different wavelength bands. The architecture may also have an additional integrated readout circuit flip-chip bonded to the integrated readout circuit. By forming a plurality of third detectors on the additional integrated readout circuit, a tri-band focal plane array may be realized. In one embodiment, a dual-band focal plane array architecture by forming two arrays of detectors on two individual integrated readout circuit and flip-chip bonding these two readout circuits.
    • 一种可以检测多个光谱图像的多波段焦平面阵列结构。 多频带焦平面阵列结构具有集成读出电路,集成在读出电路中的多个第一检测器和沉积在读出电路上的多个第二检测器。 优选地,第一检测器可操作以检测可见信号,并且第二检测器可操作以检测红外信号。 第一和第二检测器被布置成棋盘图案,以交替行或列排列,或至少部分地彼此重叠,以实现两个不同波长带中的同时检测。 该架构还可以具有结合到集成读出电路的额外的集成读出电路倒装芯片。 通过在附加集成读出电路上形成多个第三检测器,可以实现三波段焦平面阵列。 在一个实施例中,双波段焦平面阵列架构通过在两个单独的集成读出电路上形成两个检测器阵列并将这两个读出电路进行倒装芯片接合。
    • 8. 发明申请
    • Cold shield for cryogenic camera
    • 用于低温摄像机的冷盾
    • US20050078208A1
    • 2005-04-14
    • US10683073
    • 2003-10-10
    • Philip MinarikSung-Shik Yoo
    • Philip MinarikSung-Shik Yoo
    • H04N5/225
    • H04N5/2253H04N5/2254
    • A cold shield of a cryogenic camera. The cold shield reflects external thermal radiation away from the cryogenic camera, so as to shield the cryogenic camera in a cryogenic temperature such that no internal thermal radiation will be generated. The cryogenic camera has a lens assembly and a focal plane array. The cold shield has an upper cold shield member for holding the lens assembly and a lower cold shield member for holding the focal plane array. The upper cold shield member fits over the lower cold shield member by contact friction, such that limited translation and rotation of the lower cold shield member relative to the upper cold shield member are allowable. Therefore, the cold shield allows a fine adjustment for aligning the lens assembly to the focal plane array.
    • 低温摄像机的冷盾。 冷屏反映远离低温相机的外部热辐射,以便在低温温度下屏蔽低温相机,使得不会产生内部热辐射。 低温相机具有透镜组件和焦平面阵列。 冷屏具有用于保持透镜组件的上部冷屏部件和用于保持焦平面阵列的下部冷屏部件。 上部冷屏蔽构件通过接触摩擦装配在下部冷屏蔽构件上,使得下部冷屏蔽构件相对于上部冷屏蔽构件的有限平移和旋转是允许的。 因此,冷屏允许微调以将透镜组件对准焦平面阵列。
    • 9. 发明申请
    • MULTI-BAND FOCAL PLANE ARRAY
    • 多带对焦平面阵列
    • US20090173883A1
    • 2009-07-09
    • US11493121
    • 2006-07-26
    • Christopher Lee KauffmanGerald Pray GriffithRonald B. JonesSung-Shik YooMichael A. Davis
    • Christopher Lee KauffmanGerald Pray GriffithRonald B. JonesSung-Shik YooMichael A. Davis
    • H01L27/14H01L27/00
    • H01L27/14649G01J3/36
    • A multi-band focal plane array architecture operative to detect multiple spectral image. The multi-band focal plane array architecture has an integrated readout circuit, a plurality of first detectors integrated in the readout circuit and a plurality of second detectors deposited on the readout circuit. Preferably, the first detectors are operative to detect visible signals and the second detectors are operative to detect infrared signals. The first and second detectors are arranged in a checkerboard pattern, in alternate rows or columns, or at least partially overlapped with each other to realize simultaneous detection in two different wavelength bands. The architecture may also have an additional integrated readout circuit flip-chip bonded to the integrated readout circuit. By forming a plurality of third detectors on the additional integrated readout circuit, a tri-band focal plane array may be realized. In one embodiment, a dual-band focal plane array architecture by forming two arrays of detectors on two individual integrated readout circuit and flip-chip bonding these two readout circuits.
    • 一种可以检测多个光谱图像的多波段焦平面阵列结构。 多频带焦平面阵列结构具有集成读出电路,集成在读出电路中的多个第一检测器和沉积在读出电路上的多个第二检测器。 优选地,第一检测器可操作以检测可见信号,并且第二检测器可操作以检测红外信号。 第一和第二检测器被布置成棋盘图案,以交替行或列排列,或至少部分地彼此重叠,以实现两个不同波长带中的同时检测。 该架构还可以具有结合到集成读出电路的额外的集成读出电路倒装芯片。 通过在附加集成读出电路上形成多个第三检测器,可以实现三波段焦平面阵列。 在一个实施例中,双波段焦平面阵列架构通过在两个单独的集成读出电路上形成两个检测器阵列并将这两个读出电路进行倒装芯片接合。
    • 10. 发明申请
    • Direct-view focal plane array
    • 直视焦平面阵列
    • US20080179520A1
    • 2008-07-31
    • US11699839
    • 2007-01-30
    • Christopher Lee KauffmanSung-Shik Yoo
    • Christopher Lee KauffmanSung-Shik Yoo
    • H01L25/00G01J5/00
    • G02B23/12H01L27/14643H04N5/33H04N5/3651
    • A direct-view focal plane array (FPA) having a detector layer, an amplification layer, a non-uniformity correction layer and a display layer. A direct path from the detector to the display element in each pixel may be established via a configurable digitally set analog circuit that controls gain and level for non-uniformity correction. The detector layer is operative to detect an infrared image with a raw image pixel response x and convert the infrared image into an electrical signal. The electrical signal is then fed into the amplification layer for amplification and the non-uniformity layer for offset and gain correction. An offset correction coefficient b and a gain correction coefficient m are inputted to the non-uniformity layer, to transform the raw image pixel response x into a corrected pixel response y, which prevents the true scene content from bein masked by the fixed pattern.
    • 具有检测器层,放大层,不均匀性校正层和显示层的直视焦平面阵列(FPA)。 可以经由可配置的数字设置的模拟电路来建立从每个像素中的检测器到显示元件的直接路径,该模拟电路控制用于非均匀性校正的增益和电平。 检测器层可操作以用原始图像像素响应x检测红外图像,并将红外图像转换成电信号。 然后将电信号馈送到用于放大的放大层和用于偏移和增益校正的不均匀层。 将偏移校正系数b和增益校正系数m输入到不均匀层,将原始图像像素响应x变换为校正像素响应y,从而防止真实场景内容被固定图案掩蔽。