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1. 发明授权

US06799864B2 High power LED power pack for spot module illumination 有权
标题翻译：大功率LED电源组，用于现场模块照明
公开(公告)号：US06799864B2
公开(公告)日：2004-10-05
申请号：US10063924
申请日：2002-05-24
申请人： Christopher L. Bohler , Anthony D. Pollard , Greg E. Burkholder , James T. Petroski , Mathew L. Sommers , Robert F. Karlicek, Jr. , Stanton E. Weaver, Jr. , Charles A. Becker
发明人： Christopher L. Bohler , Anthony D. Pollard , Greg E. Burkholder , James T. Petroski , Mathew L. Sommers , Robert F. Karlicek, Jr. , Stanton E. Weaver, Jr. , Charles A. Becker
IPC分类号： F21V2900
CPC分类号： F21V29/74 , F21K9/233 , F21V7/0083 , F21V7/041 , F21V7/06 , F21V19/0005 , F21V29/004 , F21V29/767 , F21V29/773 , F21V29/81 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L33/642 , H01L2224/48091 , Y10S362/80 , H01L2924/00014
摘要： A light module includes a light emitting diode assembly defining a front side light emitting diode array and a rear side. The rear side is in thermal communication with a thermally conductive spreader, and a thermally conductive core is in thermal communication with the conductive spreader. The thermally conductive core includes an electrical conductor in operative communication with the front side light emitting diode array, and a plurality of appendages disposed about the thermally conductive core such that they are in thermal communication with the conductive spreader.
摘要翻译：光模块包括限定前侧发光二极管阵列和后侧的发光二极管组件。后侧与导热散热器热连通，并且导热芯与导电吊具热连通。导热芯包括与前侧发光二极管阵列可操作地连通的电导体和围绕导热芯设置的多个附件，使得它们与导电吊具热连通。

2. 发明授权

US06485160B1 Led flashlight with lens 失效
标题翻译：带手电筒的手电筒
公开(公告)号：US06485160B1
公开(公告)日：2002-11-26
申请号：US09681908
申请日：2001-06-25
申请人： Mathew L. Sommers , James T. Petroski , Greg E. Burkholder
发明人： Mathew L. Sommers , James T. Petroski , Greg E. Burkholder
IPC分类号： F21Y10102
CPC分类号： F21L4/027 , F21V5/006 , F21Y2115/10 , Y10S362/80
摘要： A flashlight includes a housing, an electrical power source in the housing, a semiconductor light source, a reflector well in which the semiconductor light source is seated, and a lens over the reflector. The housing has a closed end and an open end. The semiconductor light source is electrically connected to the power source. The semiconductor light source, reflector, and lens are secured to the housing. Light produced by the semiconductor light source is reflected by the reflector and focussed by the lens in a predetermined direction.
摘要翻译：手电筒包括壳体，外壳中的电源，半导体光源，半导体光源所在的反射器阱和反射器上的透镜。外壳具有封闭端和开口端。半导体光源电连接到电源。半导体光源，反射器和透镜被固定到壳体。由半导体光源产生的光被反射器反射并由透镜在预定方向上聚焦。

3. 发明授权

US06661167B2 LED devices 失效
公开(公告)号：US06661167B2
公开(公告)日：2003-12-09
申请号：US10063052
申请日：2002-03-14
申请人： Ivan Eliashevich , Mathew L. Sommers , Stanton E. Weaver, Jr.
发明人： Ivan Eliashevich , Mathew L. Sommers , Stanton E. Weaver, Jr.
IPC分类号： F21V500
CPC分类号： H01L33/54 , H01L2224/05571 , H01L2224/05573 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00 , H01L2224/05599
摘要： A light emitting diode (LED) device (A) and processes for its manufacture are provided. The LED device (A) includes a light emitting chip or die (10) and an encapsulant (22) surrounding the same. The encapsulant (22) is substantially spherical in shape, and the die (10) is preferably located at a substantial center of the encapsulant (22). An electrically conductive path extends from the chip or die (10) to a periphery of the encapsulant (22) such that the chip/die (10) can be selectively energized to produce light by applying electricity to the electrically conductive path at the periphery of the encapsulant (22). Preferably, the encapsulant (22) is chosen to have an index of refraction as close as possible to the higher of an index of refraction of the die's semiconductor material and an index of refraction of the die's substrate (12).

4. 发明授权

US06674096B2 Light-emitting diode (LED) package and packaging method for shaping the external light intensity distribution 有权
标题翻译：发光二极管（LED）封装和封装方法，用于整形外部光强分布
公开(公告)号：US06674096B2
公开(公告)日：2004-01-06
申请号：US09681806
申请日：2001-06-08
申请人： Mathew L. Sommers
发明人： Mathew L. Sommers
IPC分类号： H01L29227
CPC分类号： H01L33/54 , H01L2924/1815
摘要： An LED package (10) includes LED die (12) mounted onto lead frame (14) and electrically connected thereto whereby LED die (12) is electrically energized through leads (16, 18). An encapsulant (20), preferably an epoxy resin, encapsulates and preferably hermetically seals LED die (12). Encapsulant (20) includes depression (24) defined by preselected curved surfaces (28), at least a portion of which are coated by reflective coating (26). Encapsulant (20) preferably also includes sides (22) with preselected curvature. In operation, LED die (12) emits light (32) directed approximately along LED die surface normal (36). Light rays (32) reflect from reflective surface (26) and reflected rays (38) are subsequently refracted by refracting surface (22) so that refracted rays (40) exit the capsule. The reflecting surface (26) and refracting surface (22) cooperate to convert LED die light distribution (32) into light distribution (40) which appears to emanate from an approximate point source (42).
摘要翻译： LED封装（10）包括安装在引线框架（14）上并与其电连接的LED管芯（12），由此LED管芯（12）通过引线（16,18）供电。密封剂（20），优选环氧树脂，封装并优选密封LED管芯（12）。密封剂（20）包括由预选的曲面（28）限定的凹陷（24），其中至少一部分由反射涂层（26）涂覆。密封剂（20）优选地还包括具有预选曲率的侧面（22）。在操作中，LED管芯（12）发射大致沿着LED管芯表面法线（36）定向的光（32）。光线（32）从反射表面（26）反射，然后由折射表面（22）折射反射光线（38），使得折射光线（40）离开胶囊。反射表面（26）和折射表面（22）协调以将LED管芯光分布（32）转换成从近似点源（42）发出的光分布（40）。

5. 外观设计

USD603079S1 LED luminaire 有权
标题翻译： LED灯具
公开(公告)号：USD603079S1
公开(公告)日：2009-10-27
申请号：US29335179
申请日：2009-04-09
申请人： Alan B. Toot , Mathew L. Sommers , Joseph M. Hobbs , Mark E. Kaminski , Todd E. Cassidy
设计人： Alan B. Toot , Mathew L. Sommers , Joseph M. Hobbs , Mark E. Kaminski , Todd E. Cassidy

6. 发明授权

US06798136B2 Phosphor embedded die epoxy and lead frame modifications 失效
标题翻译：磷光体嵌入式环氧树脂和引线框修改
公开(公告)号：US06798136B2
公开(公告)日：2004-09-28
申请号：US09681861
申请日：2001-06-19
申请人： Mathew L. Sommers
发明人： Mathew L. Sommers
IPC分类号： H01J162
CPC分类号： H01L33/508
摘要： A system for converting light from a first range of wavelengths to a second range of wavelengths includes a semiconductor die and a phosphor embedded epoxy contacting a first end of the semiconductor die. A frame contacts the phosphor embedded epoxy. The first and second ranges of wavelengths include blue/ultraviolet light and visible light, respectively.
摘要翻译：用于将来自第一波长范围的光转换到第二波长范围的系统包括半导体管芯和与半导体管芯的第一端接触的磷光体嵌入式环氧树脂。框架接触磷光体嵌入式环氧树脂。第一和第二波长范围分别包括蓝色/紫外光和可见光。

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