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1. 发明授权

US06799864B2 High power LED power pack for spot module illumination 有权
标题翻译：大功率LED电源组，用于现场模块照明
公开(公告)号：US06799864B2
公开(公告)日：2004-10-05
申请号：US10063924
申请日：2002-05-24
申请人： Christopher L. Bohler , Anthony D. Pollard , Greg E. Burkholder , James T. Petroski , Mathew L. Sommers , Robert F. Karlicek, Jr. , Stanton E. Weaver, Jr. , Charles A. Becker
发明人： Christopher L. Bohler , Anthony D. Pollard , Greg E. Burkholder , James T. Petroski , Mathew L. Sommers , Robert F. Karlicek, Jr. , Stanton E. Weaver, Jr. , Charles A. Becker
IPC分类号： F21V2900
CPC分类号： F21V29/74 , F21K9/233 , F21V7/0083 , F21V7/041 , F21V7/06 , F21V19/0005 , F21V29/004 , F21V29/767 , F21V29/773 , F21V29/81 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L33/642 , H01L2224/48091 , Y10S362/80 , H01L2924/00014
摘要： A light module includes a light emitting diode assembly defining a front side light emitting diode array and a rear side. The rear side is in thermal communication with a thermally conductive spreader, and a thermally conductive core is in thermal communication with the conductive spreader. The thermally conductive core includes an electrical conductor in operative communication with the front side light emitting diode array, and a plurality of appendages disposed about the thermally conductive core such that they are in thermal communication with the conductive spreader.
摘要翻译：光模块包括限定前侧发光二极管阵列和后侧的发光二极管组件。后侧与导热散热器热连通，并且导热芯与导电吊具热连通。导热芯包括与前侧发光二极管阵列可操作地连通的电导体和围绕导热芯设置的多个附件，使得它们与导电吊具热连通。

2. 发明授权

US07635203B2 Method and apparatus for LED panel lamp systems 有权
标题翻译： LED面板灯系统的方法和装置
公开(公告)号：US07635203B2
公开(公告)日：2009-12-22
申请号：US10555913
申请日：2004-05-05
申请人： Stanton E. Weaver, Jr. , Thomas E. Stecher , Anant A. Setlur , Alok M. Srivastava , Holly A. Comanzo , Charles A. Becker , Thomas F. Soules , Chen-Lun Hsing Chen , Rebecca A. Bompiedi
发明人： Stanton E. Weaver, Jr. , Thomas E. Stecher , Anant A. Setlur , Alok M. Srivastava , Holly A. Comanzo , Charles A. Becker , Thomas F. Soules , Chen-Lun Hsing Chen , Rebecca A. Bompiedi
IPC分类号： F21V23/02
CPC分类号： F21K9/64 , F21Y2115/10 , H01L25/0753 , H01L2924/0002 , Y10S362/80 , H01L2924/00
摘要： A lighting apparatus (10) comprises a light engine (12) producing ultra violet radiation. An enclosure (14) surrounds a radiation generating area of the light engine (12) to encompass the radiation. At least one wall (28) of the enclosure (14) is substantially reflective of the ultraviolet radiation. The enclosure (14) includes a replaceable top portion (30) which includes a phosphor portion (32). The phosphor portion (32) is spaced from the radiation generating area of the light engine (12) by a height of the enclosure (14).
摘要翻译：照明装置（10）包括产生紫外辐射的光引擎（12）。外壳（14）围绕光引擎（12）的辐射产生区域以包围辐射。外壳（14）的至少一个壁（28）基本上反射紫外线。外壳（14）包括可更换的顶部（30），其包括磷光体部分（32）。荧光体部分（32）与光引擎（12）的辐射产生区域隔开外壳（14）的高度。

3. 发明授权

US06864571B2 Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking 有权
标题翻译：使用纳米管区域进行热沉积的电子器件及其制造方法
公开(公告)号：US06864571B2
公开(公告)日：2005-03-08
申请号：US10614497
申请日：2003-07-07
申请人： Mehmet Arik , Stanton E. Weaver, Jr. , James C. Carnahan , Charles A. Becker , William D. Gerstler
发明人： Mehmet Arik , Stanton E. Weaver, Jr. , James C. Carnahan , Charles A. Becker , William D. Gerstler
IPC分类号： F28F13/18 , H01L23/373 , H01L23/473 , H01L23/485 , H01L33/62 , H01L33/64 , H01L23/34
CPC分类号： F28F13/185 , B82Y10/00 , H01L23/373 , H01L23/473 , H01L24/10 , H01L24/13 , H01L24/81 , H01L33/62 , H01L33/648 , H01L2224/0401 , H01L2224/06102 , H01L2224/13 , H01L2224/1308 , H01L2224/13084 , H01L2224/13144 , H01L2224/13155 , H01L2224/13166 , H01L2224/1703 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81894 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/19042 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A semiconductor device die (10, 116) is disposed on a heat-sinking support structure (30, 100). Nanotube regions (52, 120) contain nanotubes (54, 126) are arranged on a surface of or in the heatsinking support structure (30, 100). The nanotube regions (52, 120) are arranged to contribute to heat transfer from the semiconductor device die (10, 116) to the heat-sinking support structure (30, 100). In one embodiment, the semiconductor device die (10) includes die electrodes (20, 22), and the support structure (30) includes contact pads (40, 42) defined by at least some of the nanotube regions (52). The contact pads (40, 42) electrically and mechanically contact the die electrodes (20, 22). In another embodiment, the heat-sinking support structure (100) includes microchannels (120) arranged laterally in the support structure (100). At least some of the nanotube regions are disposed inside the microchannels (100).
摘要翻译：半导体器件管芯（10,116）设置在散热支撑结构（30,100）上。纳米管区域（52,120）包含纳米管（54,126）布置在散热支撑结构（30,100）的表面上或散热支撑结构（30,100）中。纳米管区域（52,120）被布置成有助于从半导体器件管芯（10,116）到散热支撑结构（30,100）的热传递。在一个实施例中，半导体器件管芯（10）包括管芯电极（20,22），并且支撑结构（30）包括由至少一些纳米管区域（52）限定的接触焊盘（40,42）。接触焊盘（40,42）与管芯电极（20,22）电接触和机械接触。在另一个实施例中，散热支撑结构（100）包括在支撑结构（100）中侧向设置的微通道（120）。至少一些纳米管区域设置在微通道（100）的内部。

4. 发明授权

US4520357A Electroscopic information display and entry system with writing stylus 失效
标题翻译：电子信息显示和录音系统
公开(公告)号：US4520357A
公开(公告)日：1985-05-28
申请号：US401191
申请日：1982-07-23
申请人： Donald E. Castleberry , Charles A. Becker
发明人： Donald E. Castleberry , Charles A. Becker
IPC分类号： G06F3/033 , G09G3/34
CPC分类号： G06F3/03545
摘要： Information is written into a matrix-addressed electroscopic display by means of a writing stylus having a magnetic tip, utilized to attract a moveable plate electrode in a selected one of the display matrix cells. A capacitance detector, connected to sequential ones of the column electrodes of the display via a first multiplexer and to sequential ones of the row electrodes of the matrix display via a second multiplexer, detects the change in cell interelectrode capacitance caused by movement of the moveable plate electrode. The capacitance of each display cell is compared with the data for the output state commanded for that cell, to recognize input data sites programmed by the magnetic writing stylus.
摘要翻译：信息通过具有磁性尖端的写入笔写入矩阵寻址的电子显示器中，用于在所选择的一个显示矩阵单元中吸引可移动的平板电极。电容检测器，经由第一多路复用器连接到显示器的顺序的列电极，以及经由第二多路复用器连接到矩阵显示器的顺序的行电极，检测由可移动板的移动引起的单元电极间电容的变化电极。将每个显示单元的电容与针对该单元的输出状态的数据进行比较，以识别由磁性写入笔编程的输入数据位置。

5. 发明授权

US5561085A Structure for protecting air bridges on semiconductor chips from damage 失效
标题翻译：用于保护半导体芯片上的空气桥的结构不受损坏
公开(公告)号：US5561085A
公开(公告)日：1996-10-01
申请号：US359128
申请日：1994-12-19
申请人： Bernard Gorowitz , Charles A. Becker , Renato Guida , Thomas B. Gorczyca , James W. Rose
发明人： Bernard Gorowitz , Charles A. Becker , Renato Guida , Thomas B. Gorczyca , James W. Rose
IPC分类号： H01L21/768 , H01L23/00 , H01L23/522 , H01L23/538 , H01L27/00 , H01L21/60
CPC分类号： H01L23/562 , H01L23/5221 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/2402 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/3011 , H01L2924/3025
摘要： A protective cap is deposited over the top and sides of an air bridge structure located on an integrated circuit chip. The protective cap provides mechanical strength during the application of a high density interconnect structure over the chips, to prevent deformation of the sensitive (air bridge) structure, and also to prevent any contamination from intruding under the air bridge. More importantly, the protective cap does not impede the performance of the air bridge and therefore does not need to be removed, thereby eliminating the necessity of ablating the HDI structure. Furthermore, the protective cap allows additional area for metallization to provide alternate circuits for coupling, power or ground planes, etc.
摘要翻译：保护盖沉积在位于集成电路芯片上的空气桥结构的顶部和侧面。保护盖在芯片上施加高密度互连结构时提供机械强度，以防止敏感（空气桥）结构的变形，并且还防止任何污染物侵入空气桥下。更重要的是，保护帽不妨碍空气桥的性能，因此不需要去除，从而消除了消除HDI结构的必要性。此外，保护盖允许额外的金属化区域为耦合，电源或接地平面等提供交替电路。

6. 发明授权

US4403217A Multiplexed varistor-controlled liquid crystal display 失效
标题翻译：多路变阻器控制液晶显示
公开(公告)号：US4403217A
公开(公告)日：1983-09-06
申请号：US274849
申请日：1981-06-18
申请人： Charles A. Becker , Donald E. Castleberry , Mark S. Logan
发明人： Charles A. Becker , Donald E. Castleberry , Mark S. Logan
IPC分类号： G09G3/36 , G02F1/133 , G02F1/1365 , G09F9/30 , G09G3/34
CPC分类号： G02F1/1365
摘要： An improved varistor-controlled multiplexed liquid crystal display of the type having columns of front electrodes and rows of rear electrodes connected in series with combinations of varistor elements and electrical capacitances, has a capacitance of increased magnitude formed in parallel with the capacitance of the liquid crystal layer in each of the multiplicity of the display cells, for reducing capacitive crosstalk between an addressed and unaddressed cell elements of the display. The increased capacitance is provided by auxiliary data electrodes positioned below, and spaced by a thin film dielectric layer from, the reflective rear cell row electrodes of the display, and spaced from the varistor member by at least one thick film dielectric layer. A pair of thick film layers may support the row scan electrodes therebetween, or the scan electrodes may be formed between a single layer and the varistor surface.
摘要翻译：具有与可变电阻元件和电容的组合串联连接的前电极列和后电极列的改进的压敏电阻控制复用液晶显示器具有与液晶的电容平行形成的增加幅度的电容在多个显示单元的每一个中，用于减少显示器的寻址和未寻址的单元元件之间的电容串扰。增加的电容由辅助数据电极提供，辅助数据电极位于显示器的反射式背电池行电极下方并由薄膜电介质层隔开，并且通过至少一个厚膜电介质层与变阻器构件隔开。一对厚膜层可以支撑它们之间的行扫描电极，或者可以在单层和变阻器表面之间形成扫描电极。

7. 发明授权

US4487993A High density electronic circuits having very narrow conductors 失效
标题翻译：具有非常窄导体的高密度电子电路
公开(公告)号：US4487993A
公开(公告)日：1984-12-11
申请号：US523317
申请日：1983-08-15
申请人： Charles A. Becker
发明人： Charles A. Becker
IPC分类号： H05K1/03 , H05K1/09 , H05K3/00 , H05K3/10 , H05K3/12 , H05K3/46
CPC分类号： H05K3/4667 , H05K3/0029 , H05K1/0306 , H05K1/092 , H05K2201/0376 , H05K2203/107 , H05K3/0017 , H05K3/107 , H05K3/1258 , H05K3/465
摘要： Electronics circuits having a relatively high density of relatively narrow conductors therein, are fabricated by cutting a groove into the surface of an insulating layer, as by use of laser machining apparatus and the like, for each conductor. Conductive material is placed into each groove to form each of at least one conductor on each of at least one level of the circuit. A thick film dielectric material is applied, over each insulative layer having at least one conductor embedded therein, to form insulative planes between different planes of conductor. Via interconnects are formed between conductor planes by filling a hole therebetween with conductive material.
摘要翻译：对于每个导体，通过使用激光加工装置等将凹槽切割到绝缘层的表面中来制造具有相对较窄导体密度的电子电路。将导电材料放置在每个凹槽中以在电路的至少一个级别中的每一个上形成至少一个导体中的每一个。在每个具有嵌入其中的至少一个导体的绝缘层上施加厚膜电介质材料，以在导体的不同平面之间形成绝缘平面。通过用导电材料填充其间的孔，在导体平面之间形成通孔互连。

8. 发明授权

US4417393A Method of fabricating high density electronic circuits having very narrow conductors 失效
标题翻译：制造具有非常窄导体的高密度电子电路的方法
公开(公告)号：US4417393A
公开(公告)日：1983-11-29
申请号：US249599
申请日：1981-04-01
申请人： Charles A. Becker
发明人： Charles A. Becker
IPC分类号： H05K1/03 , H05K1/09 , H05K3/00 , H05K3/10 , H05K3/12 , H05K3/46
CPC分类号： H05K3/4667 , H05K3/0029 , H05K1/0306 , H05K1/092 , H05K2201/0376 , H05K2203/107 , H05K3/0017 , H05K3/107 , H05K3/1258 , H05K3/465 , Y10T29/49155 , Y10T29/4916
摘要： Electronics circuits having a relatively high density of relatively narrow conductors therein, are fabricated by cutting a groove into the surface of an insulating layer, as by use of laser machining apparatus and the like, for each conductor. Conductive material is placed into each groove to form each of at least one conductor on each of at least one level of the circuit. A thick film dielectric material is applied, over each insulative layer having at least one conductor embedded therein, to form insulative planes between different planes of conductor. Via interconnects are formed between conductor planes by filling a hole therebetween with conductive material.
摘要翻译：对于每个导体，通过使用激光加工装置等将凹槽切割到绝缘层的表面中来制造具有相对较窄导体密度的电子电路。将导电材料放置在每个凹槽中以在电路的至少一个级别中的每一个上形成至少一个导体中的每一个。在每个具有嵌入其中的至少一个导体的绝缘层上施加厚膜电介质材料，以在导体的不同平面之间形成绝缘平面。通过用导电材料填充其间的孔，在导体平面之间形成通孔互连。

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