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    • 2. 发明专利
    • 閘極側壁儲存之雙位元快閃記憶體及其操作方法 TWIN NONVOLATILE MEMORY CELL ON UNIT DEVICE AND METHOD OF OPERATING THE SAME
    • 闸极侧壁存储之双比特闪存及其操作方法 TWIN NONVOLATILE MEMORY CELL ON UNIT DEVICE AND METHOD OF OPERATING THE SAME
    • TW200743181A
    • 2007-11-16
    • TW095116135
    • 2006-05-05
    • 金雅琴 YA-CHIN KING林崇榮
    • 金雅琴 YA-CHIN KING林崇榮 CHRONG-JUNG LIN
    • H01L
    • 一種形成於n型井之pMOS電晶體雙非揮發型記憶胞至少包含一選擇閘極,一對ONO(氧化層、氮化層、氧化層)間隙壁分別形成於該選擇閘極之兩側壁,該ONO間隙壁的該氮化層分別為L形及L形鏡像可儲存載子,而使每一該ONO間隙壁可以依程式化條件而構成一位元之儲存記憶胞,一源極具有重摻雜p型雜質,一延伸源極具有n型雜質,一汲極具有重摻雜p型雜質,一延伸汲極具有n型雜質。該雙非揮發型記憶胞程式化時可以利用帶對帶熱電子注入被選到的記憶胞的氮化層內,進行讀取時則採取逆讀法,以防止對未被選取的另一記憶胞干擾。位元資料抹除時可以利用(1)FN抹除及(2)帶對帶熱電洞注入(band to band hot hole injection)其中之一種。
    • 一种形成于n型井之pMOS晶体管双非挥发型记忆胞至少包含一选择闸极,一对ONO(氧化层、氮化层、氧化层)间隙壁分别形成于该选择闸极之两侧壁,该ONO间隙壁的该氮化层分别为L形及L形镜像可存储载子,而使每一该ONO间隙壁可以依进程化条件而构成一比特之存储记忆胞,一源极具有重掺杂p型杂质,一延伸源极具有n型杂质,一汲极具有重掺杂p型杂质,一延伸汲极具有n型杂质。该双非挥发型记忆胞进程化时可以利用带对带热电子注入被选到的记忆胞的氮化层内,进行读取时则采取逆读法,以防止对未被选取的另一记忆胞干扰。比特数据抹除时可以利用(1)FN抹除及(2)带对带热电洞注入(band to band hot hole injection)其中之一种。
    • 4. 发明授权
    • Non-volatile semiconductor device, and method of operating the same
    • 非易失性半导体器件及其操作方法
    • US08837227B2
    • 2014-09-16
    • US13438660
    • 2012-04-03
    • Chrong-Jung LinYa-Chin King
    • Chrong-Jung LinYa-Chin King
    • G11C16/04H01L29/788
    • G11C16/0408H01L29/7883
    • A non-volatile semiconductor device and a method for operating the same are disclosed, where the non-volatile semiconductor device includes a gate dielectric layer, a p-type floating gate, a coupling gate, a first p-type source/drain, a second p-type source/drain, a first contact plug and a second contact plug. The gate dielectric layer is formed on a n-type semiconductor substrate. The p-type floating gate is formed on the gate dielectric layer. The first p-type source/drain and the second p-type source/drain are formed in the n-type semiconductor substrate. The first and second contact plugs are formed on the first and second p-type source/drains respectively. The coupling gate consists essentially of a capacitor dielectric layer and a third contact plug, where the capacitor dielectric layer is formed on the p-type floating gate, and the third contact plug is formed on the capacitor dielectric layer.
    • 公开了一种非易失性半导体器件及其操作方法,其中非易失性半导体器件包括栅极介电层,p型浮置栅极,耦合栅极,第一p型源极/漏极, 第二p型源极/漏极,第一接触插塞和第二接触插塞。 栅介质层形成在n型半导体衬底上。 p型浮栅形成在栅介质层上。 第一p型源极/漏极和第二p型源极/漏极形成在n型半导体衬底中。 第一和第二接触塞分别形成在第一和第二p型源极/漏极上。 耦合栅极基本上由电容器介质层和第三接触插塞构成,其中电容器电介质层形成在p型浮置栅极上,第三接触插塞形成在电容器介电层上。
    • 5. 发明授权
    • Non-volatile semiconductor device, and method of operating the same
    • 非易失性半导体器件及其操作方法
    • US08724398B2
    • 2014-05-13
    • US13438642
    • 2012-04-03
    • Chrong-Jung LinYa-Chin King
    • Chrong-Jung LinYa-Chin King
    • G11C16/04G11C16/16
    • G11C16/16G11C16/0416H01L27/11521
    • A non-volatile semiconductor device and a method for operating the same are disclosed, where the non-volatile semiconductor device includes a gate dielectric layer, a n-type floating gate, a coupling gate, a first n-type source/drain, a second n-type source/drain, a first contact plug and a second contact plug. The gate dielectric layer is formed on a p-type semiconductor substrate. The n-type floating gate is formed on the gate dielectric layer. The first n-type source/drain and the second n-type source/drain are formed in the p-type semiconductor substrate. The first and second contact plugs are formed on the first and second n-type source/drains respectively. The coupling gate consists essentially of a capacitor dielectric layer and a third contact plug, where the capacitor dielectric layer is formed on the n-type floating gate, and the third contact plug is formed on the capacitor dielectric layer.
    • 公开了一种非易失性半导体器件及其操作方法,其中非易失性半导体器件包括栅极电介质层,n型浮动栅极,耦合栅极,第一n型源极/漏极, 第二n型源极/漏极,第一接触插塞和第二接触插塞。 栅电介质层形成在p型半导体衬底上。 n型浮栅形成在栅介质层上。 第一n型源极/漏极和第二n型源极/漏极形成在p型半导体衬底中。 第一和第二接触塞分别形成在第一和第二n型源极/漏极上。 耦合栅极基本上由电容器介电层和第三接触插塞构成,其中电容器电介质层形成在n型浮置栅极上,第三接触插塞形成在电容器介电层上。
    • 8. 发明申请
    • PROGRAM AND ERASE METHODS WITH SUBSTRATE TRANSIENT HOT CARRIER INJECTIONS IN A NON-VOLATILE MEMORY
    • 在非易失性存储器中具有基板瞬态热载体注入的程序和擦除方法
    • US20110116317A1
    • 2011-05-19
    • US12985743
    • 2011-01-06
    • TZU HSUAN HSUChao-I WuKuang Yeu HsiehYa-Chin King
    • TZU HSUAN HSUChao-I WuKuang Yeu HsiehYa-Chin King
    • G11C16/04
    • G11C16/0466
    • The present invention describes a uniform program method and a uniform erase method of a charge trapping memory by employing a substrate transient hot electron technique for programming, and a substrate transient hot hole technique for erasing, which emulate an FN tunneling method for NAND memory operation. The methods of the present invention are applicable to a wide variety of charge trapping memories including n-channel or p-channel SONOS types of memories and floating gate (FG) type memories. the programming of the charge trapping memory is conducted using a substrate transient hot electron injection in which a body bias voltage Vb has a short pulse width and a gate bias voltage Vg has a pulse width that is sufficient to move electrons from a channel region to a charge trapping structure.
    • 本发明通过采用用于编程的衬底瞬态热电子技术和用于擦除的衬底瞬时热孔技术来描述电荷俘获存储器的均匀编程方法和均匀擦除方法,其模拟用于NAND存储器操作的FN隧道法。 本发明的方法可应用于包括n沟道或p沟道SONOS类型的存储器和浮动栅(FG)型存储器的各种电荷捕获存储器。 使用衬底瞬态热电子注入进行电荷俘获存储器的编程,其中体偏置电压Vb具有短的脉冲宽度,并且栅极偏置电压Vg具有足以将电子从沟道区域移动到 电荷捕获结构。