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1. 发明申请

US20120168217A1 EMBEDDED CAPACITOR SUBSTRATE MODULE 有权
标题翻译：嵌入式电容器基板模块
公开(公告)号：US20120168217A1
公开(公告)日：2012-07-05
申请号：US13197283
申请日：2011-08-03
申请人： Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
发明人： Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
IPC分类号： H05K1/16
CPC分类号： H05K1/0231 , H01G9/012 , H01G9/15 , H01L23/49822 , H01L23/642 , H01L24/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/14 , H01L2924/19041 , H05K1/162 , H05K3/4608 , H05K2201/0187 , H05K2201/09309 , H05K2203/0315
摘要： An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board.
摘要翻译：嵌入式电容器基板模块包括基板，金属基板和固体电解电容器材料。在金属基板上形成固体电解电容器材料，以便与基板形成固体电解电容器。嵌入式电容器基板模块还包括通过使基板和金属基板延伸而形成的电极引出区域。金属基板用作第一电极，并且基板用作第二电极。在基板和金属基板之间形成绝缘材料。因此，嵌入式电容器基板模块不仅有利于具有作为常规固体电容器的大电容，而且还可以在嵌入印刷电路板中之后被钻孔或电镀并电连接到其它电路。

2. 发明授权

US08941015B2 Embedded capacitor substrate module 有权
标题翻译：嵌入式电容器基板模块
公开(公告)号：US08941015B2
公开(公告)日：2015-01-27
申请号：US13197283
申请日：2011-08-03
申请人： Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
发明人： Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
IPC分类号： H05K1/16 , H05K1/02 , H01L23/498 , H01L23/64 , H05K3/46 , H01L23/00 , H01G9/012 , H01G9/15
CPC分类号： H05K1/0231 , H01G9/012 , H01G9/15 , H01L23/49822 , H01L23/642 , H01L24/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/14 , H01L2924/19041 , H05K1/162 , H05K3/4608 , H05K2201/0187 , H05K2201/09309 , H05K2203/0315
摘要： An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board.
摘要翻译：嵌入式电容器基板模块包括基板，金属基板和固体电解电容器材料。在金属基板上形成固体电解电容器材料，以便与基板形成固体电解电容器。嵌入式电容器基板模块还包括通过使基板和金属基板延伸而形成的电极引出区域。金属基板用作第一电极，并且基板用作第二电极。在基板和金属基板之间形成绝缘材料。因此，嵌入式电容器基板模块不仅有利于具有作为常规固体电容器的大电容，而且可以在嵌入印刷电路板中之后被钻孔或电镀并电连接到其它电路。

3. 发明授权

US09030808B2 Solid electrolytic capacitor and circuit board having the same 有权
标题翻译：固体电解电容器和具有相同功能的电路板
公开(公告)号：US09030808B2
公开(公告)日：2015-05-12
申请号：US13607820
申请日：2012-09-10
申请人： Chien-Min Hsu , Min-Lin Lee , Li-Duan Tsai
发明人： Chien-Min Hsu , Min-Lin Lee , Li-Duan Tsai
IPC分类号： H01G5/38 , H01G9/04 , H05K1/16 , H01G9/012 , H01G9/15 , H01G9/26 , H05K1/02 , H05K1/05
CPC分类号： H05K1/162 , H01G9/012 , H01G9/04 , H01G9/15 , H01G9/26 , H05K1/0231 , H05K1/053 , H05K2201/0116 , H05K2201/0175 , H05K2201/0191 , H05K2201/0323 , H05K2201/0329 , H05K2201/0338 , H05K2201/09063 , H05K2201/10522 , H05K2203/0307 , H05K2203/0315 , H05K2203/0369 , H05K2203/0723
摘要： A capacitor and a circuit board having the same are provided. The capacitor includes a substrate, an oxide layer, a second electrode, an insulating layer, a plurality of conductive sheets and a plurality of vias. The substrate includes a first electrode and a porous structure. The porous structure in at least of two distribution regions has different depths. An oxide layer is disposed on the surface of the porous structure. The second electrode is disposed on the oxide layer and includes a conductive polymer material. The insulating layer disposed on the second electrode has a third and a fourth surfaces. The fourth surface of the insulating layer is connected with the second electrode. The conductive sheets are disposed on the first surface of the first electrode and the third surface of the insulating layer and electrically connected with the corresponding vias according to different polarities.
摘要翻译：提供电容器和具有该电容器的电路板。电容器包括衬底，氧化物层，第二电极，绝缘层，多个导电片和多个通孔。基板包括第一电极和多孔结构。至少两个分布区域中的多孔结构具有不同的深度。氧化物层设置在多孔结构的表面上。第二电极设置在氧化物层上并且包括导电聚合物材料。设置在第二电极上的绝缘层具有第三和第四表面。绝缘层的第四表面与第二电极连接。导电片设置在第一电极的第一表面和绝缘层的第三表面上，并根据不同的极性与相应的通孔电连接。

4. 发明申请

US20130233605A1 SOLID ELECTROLYTIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME 有权
标题翻译：固体电解电容器和具有该电容器的电路板
公开(公告)号：US20130233605A1
公开(公告)日：2013-09-12
申请号：US13607820
申请日：2012-09-10
申请人： Chien-Min Hsu , Min-Lin Lee , Li-Duan Tsai
发明人： Chien-Min Hsu , Min-Lin Lee , Li-Duan Tsai
IPC分类号： H05K1/18
CPC分类号： H05K1/162 , H01G9/012 , H01G9/04 , H01G9/15 , H01G9/26 , H05K1/0231 , H05K1/053 , H05K2201/0116 , H05K2201/0175 , H05K2201/0191 , H05K2201/0323 , H05K2201/0329 , H05K2201/0338 , H05K2201/09063 , H05K2201/10522 , H05K2203/0307 , H05K2203/0315 , H05K2203/0369 , H05K2203/0723
摘要： A capacitor and a circuit board having the same are provided. The capacitor includes a substrate, an oxide layer, a second electrode, an insulating layer, a plurality of conductive sheets and a plurality of vias. The substrate includes a first electrode and a porous structure. The porous structure in at least of two distribution regions has different depths. An oxide layer is disposed on the surface of the porous structure. The second electrode is disposed on the oxide layer and includes a conductive polymer material. The insulating layer disposed on the second electrode has a third and a fourth surfaces. The fourth surface of the insulating layer is connected with the second electrode. The conductive sheets are disposed on the first surface of the first electrode and the third surface of the insulating layer and electrically connected with the corresponding vias according to different polarities.
摘要翻译：提供电容器和具有该电容器的电路板。电容器包括衬底，氧化物层，第二电极，绝缘层，多个导电片和多个通孔。基板包括第一电极和多孔结构。至少两个分布区域中的多孔结构具有不同的深度。氧化物层设置在多孔结构的表面上。第二电极设置在氧化物层上并且包括导电聚合物材料。设置在第二电极上的绝缘层具有第三和第四表面。绝缘层的第四表面与第二电极连接。导电片设置在第一电极的第一表面和绝缘层的第三表面上，并根据不同的极性与相应的通孔电连接。

5. 发明授权

US08094429B2 Multilayer capacitors and methods for making the same 有权
标题翻译：多层电容器及其制造方法
公开(公告)号：US08094429B2
公开(公告)日：2012-01-10
申请号：US12488780
申请日：2009-06-22
申请人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai
发明人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai
IPC分类号： H01G4/228
CPC分类号： H05K1/162 , H01G4/1209 , H01G4/232 , H01G4/30 , H01G4/35 , H01L28/86 , H05K3/429 , H05K2201/0187 , H05K2201/09309 , H05K2201/09663 , H05K2201/09672 , H05K2201/09718 , Y10T29/43
摘要： A capacitor device may include a first electrode, a second electrode, a third electrode, a first dielectric layer, and a second dielectric layer. The first electrode may be coupled with a first terminal of the capacitor device. The second electrode is under the first electrode and may be coupled with a second terminal of the capacitor device. The second electrode may be electrically isolated from the first electrode. The third electrode is under the first electrode and the second electrode and may be electrically isolated from the second electrode and electrically coupled with the first electrode. The first dielectric layer has a first dielectric constant and may be sandwiched between the first electrode and the second electrode. The second dielectric layer may have a second dielectric constant and may be sandwiched between the second electrode and the third electrode. In one embodiment, the second dielectric constant is at least five times larger than the first dielectric constant.
摘要翻译：电容器装置可以包括第一电极，第二电极，第三电极，第一电介质层和第二电介质层。第一电极可以与电容器装置的第一端子耦合。第二电极位于第一电极下方并且可以与电容器装置的第二端子耦合。第二电极可以与第一电极电隔离。第三电极在第一电极和第二电极之下，并且可以与第二电极电隔离并与第一电极电耦合。第一电介质层具有第一介电常数并且可夹在第一电极和第二电极之间。第二电介质层可以具有第二介电常数并且可以夹在第二电极和第三电极之间。在一个实施例中，第二介电常数比第一介电常数大至少五倍。

6. 发明申请

US20090107717A1 ELECTRICALLY CONDUCTIVE STRUCTURE OF CIRCUIT BOARD AND CIRCUIT BOARD USING THE SAME 有权
标题翻译：使用电路板和电路板的电导体结构
公开(公告)号：US20090107717A1
公开(公告)日：2009-04-30
申请号：US12181330
申请日：2008-07-29
申请人： Chien-Min Hsu , Shih-Hsien Wu , Shinn-Juh LAI , Min-Lin LEE
发明人： Chien-Min Hsu , Shih-Hsien Wu , Shinn-Juh LAI , Min-Lin LEE
IPC分类号： H05K1/11
CPC分类号： H05K1/112 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H05K1/0228 , H05K1/0231 , H05K1/0263 , H05K1/162 , H05K1/185 , H05K3/429 , H05K3/4602 , H05K2201/09245 , H05K2201/09627 , H05K2201/09709 , H05K2201/10734 , H01L2224/05599
摘要： An electrically conductive structure includes a first conductive structure and a second conductive structure. Each has a conducting section at one end and a coupling section at the other end. The first and second conducting sections are electrically connected to a power and ground contact of an electronic device, respectively. The first and second coupling sections are respectively connected with power and ground layer of a circuit board. The first coupling sections are connected with the first conducting section through first extending sections and the second coupling sections are connected with the second conducting section through second extending sections. At least two coupling sections of the conductive structures are arranged in pairs. The first conductive structure and the second conductive structure are arranged in a staggered array to form two wiring loops having opposite current directions, thereby generating a magnetic flux cancellation effect.
摘要翻译：导电结构包括第一导电结构和第二导电结构。每个在一端具有导电部分，另一端具有耦合部分。第一和第二导电部分分别电连接到电子设备的电源和接地触点。第一和第二耦合部分分别与电路板的电源层和接地层连接。第一耦合部分通过第一延伸部分与第一导电部分连接，第二耦合部分通过第二延伸部分与第二导电部分连接。导电结构的至少两个耦合部分成对布置。第一导电结构和第二导电结构以交错阵列布置以形成具有相反电流方向的两个布线环，从而产生磁通消除效果。

7. 发明授权

US08125761B2 Capacitor devices with co-coupling electrode planes 有权
标题翻译：具有共耦合电极平面的电容器件
公开(公告)号：US08125761B2
公开(公告)日：2012-02-28
申请号：US12390237
申请日：2009-02-20
申请人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Chen-Hsuan Chiu
发明人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Chen-Hsuan Chiu
IPC分类号： H01G4/00
CPC分类号： H01G4/005 , H01G4/228 , H01L2224/16225 , H05K1/0231 , H05K1/0298 , H05K1/112 , H05K1/162 , H05K3/429 , H05K2201/09309 , H05K2201/09672 , H05K2201/09845 , H05K2201/10734
摘要： A capacitive module is provided. The capacitive module may include a first capacitor including a first electrode and a second electrode, one of the first electrode and the second electrode being coupled to at least one first conductive via and the other one of the first electrode and the second electrode being coupled to at least one second conductive via. The capacitive module may also include a second capacitor spaced apart from the first capacitor, the second capacitor including a third electrode and a fourth electrode, one of the third electrode and the fourth electrode being coupled to the at least one first conductive via and the other one of the third electrode and the fourth electrode being coupled to the at least one second conductive via. Furthermore, the capacitive module may include a first conductive plane being electrically coupled to a first plane with a first polarity through one of the at least one first conductive via and a second conductive plane being electrically coupled to a second plane with a second polarity, opposite to the first polarity, through one of the at least one second conductive via.
摘要翻译：提供电容模块。电容性模块可以包括包括第一电极和第二电极的第一电容器，第一电极和第二电极中的一个耦合到至少一个第一导电通孔，而第一电极和第二电极中的另一个耦合到至少一个第二导电通孔。电容性模块还可以包括与第一电容器间隔开的第二电容器，第二电容器包括第三电极和第四电极，第三电极和第四电极中的一个耦合到至少一个第一导电通孔和另一个第三电极和第四电极中的一个耦合到至少一个第二导电通孔。此外，电容性模块可以包括第一导电平面，其通过第一导电通孔中的一个与第一极性电耦合到第一平面，第二导电平面电耦合到具有第二极性的第二平面，通过至少一个第二导电通孔中的一个延伸到第一极性。

8. 发明申请

US20090219668A1 CAPACITOR DEVICES HAVING MULTI-SECTIONAL CONDUCTORS 有权
标题翻译：具有多部分导体的电容器件
公开(公告)号：US20090219668A1
公开(公告)日：2009-09-03
申请号：US12392272
申请日：2009-02-25
申请人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Huey-Ru Chang , Ray-Fong Hong
发明人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Huey-Ru Chang , Ray-Fong Hong
IPC分类号： H01G4/005
CPC分类号： H05K1/162 , H01G4/228 , H01G4/248 , H01G4/33 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H05K1/112 , H05K2201/09309 , H05K2201/09663 , H05K2201/09736 , H05K2201/09845 , H05K2201/10674
摘要： A capacitive device is provided. The capacitive device includes a first electrode and a second electrode below the first electrode and spaced apart from the first electrode, wherein at least one of the first electrode and the second electrode includes a plurality of conductive step sections, the plurality of conductive step sections having different heights. The capacitive device also includes an insulating region between the first electrode and the second electrode; and at least one slot formed on one of the first electrode and the second electrode.
摘要翻译：提供了一种电容器件。该电容性装置包括第一电极和第一电极之下并与第一电极间隔开的第二电极，其中第一电极和第二电极中的至少一个包括多个导电步骤部分，所述多个导电步骤部分具有不同的高度电容性装置还包括在第一电极和第二电极之间的绝缘区域; 以及形成在第一电极和第二电极之一上的至少一个槽。

9. 发明授权

US08198538B2 Capacitor devices having multi-sectional conductors 有权
标题翻译：具有多段导体的电容器件
公开(公告)号：US08198538B2
公开(公告)日：2012-06-12
申请号：US12392272
申请日：2009-02-25
申请人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Huey-Ru Chang , Ray-Fong Hong
发明人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Huey-Ru Chang , Ray-Fong Hong
IPC分类号： H05K1/09
CPC分类号： H05K1/162 , H01G4/228 , H01G4/248 , H01G4/33 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H05K1/112 , H05K2201/09309 , H05K2201/09663 , H05K2201/09736 , H05K2201/09845 , H05K2201/10674
摘要： A capacitive device is provided. The capacitive device includes a first electrode and a second electrode below the first electrode and spaced apart from the first electrode, wherein at least one of the first electrode and the second electrode includes a plurality of conductive step sections, the plurality of conductive step sections having different heights. The capacitive device also includes an insulating region between the first electrode and the second electrode; and at least one slot formed on one of the first electrode and the second electrode.
摘要翻译：提供了一种电容器件。该电容性装置包括第一电极和第一电极之下并与第一电极间隔开的第二电极，其中第一电极和第二电极中的至少一个包括多个导电步骤部分，所述多个导电步骤部分具有不同的高度电容性装置还包括在第一电极和第二电极之间的绝缘区域; 以及形成在第一电极和第二电极之一上的至少一个槽。

10. 发明授权

US08071890B2 Electrically conductive structure of circuit board and circuit board using the same 有权
标题翻译：导电结构的电路板和电路板使用相同
公开(公告)号：US08071890B2
公开(公告)日：2011-12-06
申请号：US12181330
申请日：2008-07-29
申请人： Chien-Min Hsu , Shih-Hsien Wu , Shinn-Juh Lai , Min-Lin Lee
发明人： Chien-Min Hsu , Shih-Hsien Wu , Shinn-Juh Lai , Min-Lin Lee
IPC分类号： H05K1/16
CPC分类号： H05K1/112 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H05K1/0228 , H05K1/0231 , H05K1/0263 , H05K1/162 , H05K1/185 , H05K3/429 , H05K3/4602 , H05K2201/09245 , H05K2201/09627 , H05K2201/09709 , H05K2201/10734 , H01L2224/05599
摘要： An electrically conductive structure includes a first conductive structure and a second conductive structure. Each has a conducting section at one end and a coupling section at the other end. The first and second conducting sections are electrically connected to a power and ground contact of an electronic device, respectively. The first and second coupling sections are respectively connected with power and ground layer of a circuit board. The first coupling sections are connected with the first conducting section through first extending sections and the second coupling sections are connected with the second conducting section through second extending sections. At least two coupling sections of the conductive structures are arranged in pairs. The first conductive structure and the second conductive structure are arranged in a staggered array to form two wiring loops having opposite current directions, thereby generating a magnetic flux cancellation effect.
摘要翻译：导电结构包括第一导电结构和第二导电结构。每个在一端具有导电部分，另一端具有耦合部分。第一和第二导电部分分别电连接到电子设备的电源和接地触点。第一和第二耦合部分分别与电路板的电源层和接地层连接。第一耦合部分通过第一延伸部分与第一导电部分连接，第二耦合部分通过第二延伸部分与第二导电部分连接。导电结构的至少两个耦合部分成对布置。第一导电结构和第二导电结构以交错阵列布置以形成具有相反电流方向的两个布线环，从而产生磁通消除效果。

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