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    • 3. 发明授权
    • Multilayer capacitors and methods for making the same
    • 多层电容器及其制造方法
    • US08094429B2
    • 2012-01-10
    • US12488780
    • 2009-06-22
    • Chien-Min HsuMin-Lin LeeShinn-Juh Lai
    • Chien-Min HsuMin-Lin LeeShinn-Juh Lai
    • H01G4/228
    • H05K1/162H01G4/1209H01G4/232H01G4/30H01G4/35H01L28/86H05K3/429H05K2201/0187H05K2201/09309H05K2201/09663H05K2201/09672H05K2201/09718Y10T29/43
    • A capacitor device may include a first electrode, a second electrode, a third electrode, a first dielectric layer, and a second dielectric layer. The first electrode may be coupled with a first terminal of the capacitor device. The second electrode is under the first electrode and may be coupled with a second terminal of the capacitor device. The second electrode may be electrically isolated from the first electrode. The third electrode is under the first electrode and the second electrode and may be electrically isolated from the second electrode and electrically coupled with the first electrode. The first dielectric layer has a first dielectric constant and may be sandwiched between the first electrode and the second electrode. The second dielectric layer may have a second dielectric constant and may be sandwiched between the second electrode and the third electrode. In one embodiment, the second dielectric constant is at least five times larger than the first dielectric constant.
    • 电容器装置可以包括第一电极,第二电极,第三电极,第一电介质层和第二电介质层。 第一电极可以与电容器装置的第一端子耦合。 第二电极位于第一电极下方并且可以与电容器装置的第二端子耦合。 第二电极可以与第一电极电隔离。 第三电极在第一电极和第二电极之下,并且可以与第二电极电隔离并与第一电极电耦合。 第一电介质层具有第一介电常数并且可夹在第一电极和第二电极之间。 第二电介质层可以具有第二介电常数并且可以夹在第二电极和第三电极之间。 在一个实施例中,第二介电常数比第一介电常数大至少五倍。
    • 5. 发明授权
    • Capacitor devices with co-coupling electrode planes
    • 具有共耦合电极平面的电容器件
    • US08125761B2
    • 2012-02-28
    • US12390237
    • 2009-02-20
    • Chien-Min HsuMin-Lin LeeShinn-Juh LaiChen-Hsuan Chiu
    • Chien-Min HsuMin-Lin LeeShinn-Juh LaiChen-Hsuan Chiu
    • H01G4/00
    • H01G4/005H01G4/228H01L2224/16225H05K1/0231H05K1/0298H05K1/112H05K1/162H05K3/429H05K2201/09309H05K2201/09672H05K2201/09845H05K2201/10734
    • A capacitive module is provided. The capacitive module may include a first capacitor including a first electrode and a second electrode, one of the first electrode and the second electrode being coupled to at least one first conductive via and the other one of the first electrode and the second electrode being coupled to at least one second conductive via. The capacitive module may also include a second capacitor spaced apart from the first capacitor, the second capacitor including a third electrode and a fourth electrode, one of the third electrode and the fourth electrode being coupled to the at least one first conductive via and the other one of the third electrode and the fourth electrode being coupled to the at least one second conductive via. Furthermore, the capacitive module may include a first conductive plane being electrically coupled to a first plane with a first polarity through one of the at least one first conductive via and a second conductive plane being electrically coupled to a second plane with a second polarity, opposite to the first polarity, through one of the at least one second conductive via.
    • 提供电容模块。 电容性模块可以包括包括第一电极和第二电极的第一电容器,第一电极和第二电极中的一个耦合到至少一个第一导电通孔,而第一电极和第二电极中的另一个耦合到 至少一个第二导电通孔。 电容性模块还可以包括与第一电容器间隔开的第二电容器,第二电容器包括第三电极和第四电极,第三电极和第四电极中的一个耦合到至少一个第一导电通孔和另一个 第三电极和第四电极中的一个耦合到至少一个第二导电通孔。 此外,电容性模块可以包括第一导电平面,其通过第一导电通孔中的一个与第一极性电耦合到第一平面,第二导电平面电耦合到具有第二极性的第二平面, 通过至少一个第二导电通孔中的一个延伸到第一极性。
    • 7. 发明申请
    • MULTILAYER CAPACITORS AND METHODS FOR MAKING THE SAME
    • 多层电容器及其制造方法
    • US20100321858A1
    • 2010-12-23
    • US12488780
    • 2009-06-22
    • Chien-Min HsuMin-Lin LeeShinn-Juh Lai
    • Chien-Min HsuMin-Lin LeeShinn-Juh Lai
    • H01G4/30H01G7/00
    • H05K1/162H01G4/1209H01G4/232H01G4/30H01G4/35H01L28/86H05K3/429H05K2201/0187H05K2201/09309H05K2201/09663H05K2201/09672H05K2201/09718Y10T29/43
    • A capacitor device may include a first electrode, a second electrode, a third electrode, a first dielectric layer, and a second dielectric layer. The first electrode may be coupled with a first terminal of the capacitor device. The second electrode is under the first electrode and may be coupled with a second terminal of the capacitor device. The second electrode may be electrically isolated from the first electrode. The third electrode is under the first electrode and the second electrode and may be electrically isolated from the second electrode and electrically coupled with the first electrode. The first dielectric layer has a first dielectric constant and may be sandwiched between the first electrode and the second electrode. The second dielectric layer may have a second dielectric constant and may be sandwiched between the second electrode and the third electrode. In one embodiment, the second dielectric constant is at least five times larger than the first dielectric constant.
    • 电容器装置可以包括第一电极,第二电极,第三电极,第一电介质层和第二电介质层。 第一电极可以与电容器装置的第一端子耦合。 第二电极位于第一电极下方并且可以与电容器装置的第二端子耦合。 第二电极可以与第一电极电隔离。 第三电极在第一电极和第二电极之下,并且可以与第二电极电隔离并与第一电极电耦合。 第一电介质层具有第一介电常数并且可夹在第一电极和第二电极之间。 第二电介质层可以具有第二介电常数并且可以夹在第二电极和第三电极之间。 在一个实施例中,第二介电常数比第一介电常数大至少五倍。
    • 8. 发明授权
    • Wiring structure of laminated capacitors
    • 层压电容器的接线结构
    • US07742276B2
    • 2010-06-22
    • US11950381
    • 2007-12-04
    • Chien-Min HsuShih-Hsien WuMin-Lin LeeShinn-Juh Lai
    • Chien-Min HsuShih-Hsien WuMin-Lin LeeShinn-Juh Lai
    • H01G4/228
    • H05K1/162H01L2224/16225H01L2924/00011H01L2924/00014H05K1/112H05K3/429H05K3/4688H05K2201/0792H05K2201/09309H05K2201/09536H05K2201/09636H05K2201/10734H01L2224/0401
    • The present invention relates to a wiring structure for reducing the equivalent series inductance (ESL) of a laminated capacitor. The laminated capacitor comprises a number of conductive layers, a power via extending along a thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer, and a ground via extending along the thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer. The conductive layers include a set of first conductive layers and a set of second conductive layers. The power via is electrically coupled to the first conductive layers and the ground via is electrically coupled to the second conductive layers. The laminated capacitor further comprises a supplemental via between the power via and the ground via. The supplemental via is shorter in length than the power via and the ground via. The supplemental via is electrically coupled to one of the first conductive layers and the second conductive layer.
    • 本发明涉及一种用于降低层叠电容器的等效串联电感(ESL)的布线结构。 层叠电容器包括多个导电层,沿层叠电容器的厚度方向延伸的电力通孔,并且从顶部导电层延伸至底部导电层,沿着层叠电容器的厚度方向延伸的接地通孔 并布置成从顶部导电层延伸到底部导电层。 导电层包括一组第一导电层和一组第二导电层。 电源通孔电耦合到第一导电层,并且接地通孔电耦合到第二导电层。 层叠电容器还包括电源通孔和接地通孔之间的补充通路。 补充通孔的长度要短于电源通孔和接地通孔。 辅助通孔电耦合到第一导电层和第二导电层之一。
    • 9. 发明申请
    • CAPACITOR DEVICES WITH CO-COUPLING ELECTRODE PLANES
    • 具有CO耦合电极平面的电容器件
    • US20090213526A1
    • 2009-08-27
    • US12390237
    • 2009-02-20
    • Chien-Min HsuMin-Lin LeeShinn-Juh LaiChen-Hsuan Chiu
    • Chien-Min HsuMin-Lin LeeShinn-Juh LaiChen-Hsuan Chiu
    • H01G4/228H05K1/18
    • H01G4/005H01G4/228H01L2224/16225H05K1/0231H05K1/0298H05K1/112H05K1/162H05K3/429H05K2201/09309H05K2201/09672H05K2201/09845H05K2201/10734
    • A capacitive module is provided. The capacitive module may include a first capacitor including a first electrode and a second electrode, one of the first electrode and the second electrode being coupled to at least one first conductive via and the other one of the first electrode and the second electrode being coupled to at least one second conductive via. The capacitive module may also include a second capacitor spaced apart from the first capacitor, the second capacitor including a third electrode and a fourth electrode, one of the third electrode and the fourth electrode being coupled to the at least one first conductive via and the other one of the third electrode and the fourth electrode being coupled to the at least one second conductive via. Furthermore, the capacitive module may include a first conductive plane being electrically coupled to a first plane with a first polarity through one of the at least one first conductive via and a second conductive plane being electrically coupled to a second plane with a second polarity, opposite to the first polarity, through one of the at least one second conductive via.
    • 提供电容模块。 电容性模块可以包括包括第一电极和第二电极的第一电容器,第一电极和第二电极中的一个耦合到至少一个第一导电通孔,而第一电极和第二电极中的另一个耦合到 至少一个第二导电通孔。 电容性模块还可以包括与第一电容器间隔开的第二电容器,第二电容器包括第三电极和第四电极,第三电极和第四电极中的一个耦合到至少一个第一导电通孔和另一个 第三电极和第四电极中的一个耦合到至少一个第二导电通孔。 此外,电容性模块可以包括第一导电平面,其通过第一导电通孔中的一个与第一极性电耦合到第一平面,第二导电平面电耦合到具有第二极性的第二平面, 通过至少一个第二导电通孔中的一个延伸到第一极性。