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    • 2. 发明授权
    • Wiring structure of laminated capacitors
    • 层压电容器的接线结构
    • US07742276B2
    • 2010-06-22
    • US11950381
    • 2007-12-04
    • Chien-Min HsuShih-Hsien WuMin-Lin LeeShinn-Juh Lai
    • Chien-Min HsuShih-Hsien WuMin-Lin LeeShinn-Juh Lai
    • H01G4/228
    • H05K1/162H01L2224/16225H01L2924/00011H01L2924/00014H05K1/112H05K3/429H05K3/4688H05K2201/0792H05K2201/09309H05K2201/09536H05K2201/09636H05K2201/10734H01L2224/0401
    • The present invention relates to a wiring structure for reducing the equivalent series inductance (ESL) of a laminated capacitor. The laminated capacitor comprises a number of conductive layers, a power via extending along a thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer, and a ground via extending along the thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer. The conductive layers include a set of first conductive layers and a set of second conductive layers. The power via is electrically coupled to the first conductive layers and the ground via is electrically coupled to the second conductive layers. The laminated capacitor further comprises a supplemental via between the power via and the ground via. The supplemental via is shorter in length than the power via and the ground via. The supplemental via is electrically coupled to one of the first conductive layers and the second conductive layer.
    • 本发明涉及一种用于降低层叠电容器的等效串联电感(ESL)的布线结构。 层叠电容器包括多个导电层,沿层叠电容器的厚度方向延伸的电力通孔,并且从顶部导电层延伸至底部导电层,沿着层叠电容器的厚度方向延伸的接地通孔 并布置成从顶部导电层延伸到底部导电层。 导电层包括一组第一导电层和一组第二导电层。 电源通孔电耦合到第一导电层,并且接地通孔电耦合到第二导电层。 层叠电容器还包括电源通孔和接地通孔之间的补充通路。 补充通孔的长度要短于电源通孔和接地通孔。 辅助通孔电耦合到第一导电层和第二导电层之一。