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1. 发明授权

US06359341B1 Ball grid array integrated circuit package structure 失效
标题翻译：球栅阵列集成电路封装结构
公开(公告)号：US06359341B1
公开(公告)日：2002-03-19
申请号：US09489167
申请日：2000-01-21
申请人： Chien Ping Huang , Kevin Chiang , Tzong Da Ho
发明人： Chien Ping Huang , Kevin Chiang , Tzong Da Ho
IPC分类号： H01L2940
CPC分类号： H01L23/13 , H01L23/3677 , H01L23/49816 , H01L23/50 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K3/341 , H05K3/3436 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A BGA (Ball Grid Array) integrated circuit package is proposed, which is characterized in the use of a ground metallic layer adhered to a substrate. Moreover, the ground metallic layer can provide the semiconductor chip with a heat-dissipation path, allowing heat from the semiconductor chip during operation to be dissipated to the atmosphere via the ground metallic layer, so that the overall heat-dissipation efficiency can be increased. The ground metallic layer is formed with a chip-receiving cavity for accommodating a semiconductor chip mounted on the substrate. As the semiconductor chip is surrounded and in close proximity to the ground metallic layer, it can help reduce undesired simultaneous switching noise, crosstalk, and electromagnetic interference in the integrated circuit package.
摘要翻译：提出了一种BGA（球栅阵列）集成电路封装，其特征在于使用附着在基板上的接地金属层。此外，接地金属层可以为半导体芯片提供散热路径，允许来自半导体芯片的工作中的热量经由接地金属层散发到大气中，从而可以提高总的散热效率。接地金属层形成有用于容纳安装在基板上的半导体芯片的芯片接收腔。当半导体芯片被围绕并且紧邻接地金属层时，它可以帮助减少集成电路封装中的不期望的同时开关噪声，串扰和电磁干扰。

2. 发明授权

US06443351B1 Method of achieving solder ball coplanarity on ball grid array integrated circuit package 有权
标题翻译：在球栅阵列集成电路封装上实现焊球共面性的方法
公开(公告)号：US06443351B1
公开(公告)日：2002-09-03
申请号：US09579992
申请日：2000-05-26
申请人： Chien Ping Huang , Tzong Da Ho
发明人： Chien Ping Huang , Tzong Da Ho
IPC分类号： B23K3102
CPC分类号： B23K3/0623 , B23K2101/42 , H01L2224/0401 , H01L2224/0603 , H01L2224/14 , H01L2224/1403 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K2201/09381 , H05K2201/094 , H05K2201/0989 , Y02P70/613
摘要： A BGA (Ball Grid Array) package fabrication method is proposed for the purpose of achieving solder ball coplanarity on a warped BGA package, such as a concavely-warped BGA package or a convexly-warped BGA package. The proposed method is characterized in the provision of a plurality of variably-sized solder-ball pads over the bottom surface of the substrate, each solder-ball pad having a specified size predetermined in accordance with pre-measured package warpage and predetermined relation of solder ball height against pad size. This provision allows the use of a solder mask having fixed-size openings, as contrary to the prior art that uses a solder mask having variably-sized openings, to allow the implanted solder balls to achieve coplanarity and have strengthened shear for robust solder joint.
摘要翻译：提出了一种BGA（球栅阵列）封装制造方法，用于在翘曲的BGA封装上实现焊球共面性，例如凹曲面BGA封装或凸翘曲BGA封装。所提出的方法的特征在于在衬底的底表面上设置多个可变尺寸的焊球焊盘，每个焊球垫具有根据预测的封装翘曲和预定的焊料关系预定的规定尺寸球高度抵抗垫尺寸。这种设置允许使用具有固定尺寸开口的焊接掩模，这与使用具有可变尺寸开口的焊接掩模的现有技术相反，以允许注入的焊球实现共面性并且具有用于坚固的焊接接头的加强的剪切。

3. 发明授权

US06507104B2 Semiconductor package with embedded heat-dissipating device 有权
标题翻译：半导体封装带嵌入式散热装置
公开(公告)号：US06507104B2
公开(公告)日：2003-01-14
申请号：US09905754
申请日：2001-07-14
申请人： Tzong Da Ho , Chien Ping Huang
发明人： Tzong Da Ho , Chien Ping Huang
IPC分类号： H01L2334
CPC分类号： H01L24/73 , H01L23/3107 , H01L23/3128 , H01L23/4334 , H01L23/49503 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73221 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： A semiconductor package with an embedded heat-dissipating device is proposed. The heat-dissipating device including a heat sink and a plurality of connecting bumps attached to connecting pads formed on the heat sink is mounted on a substrate by reflowing the connecting bumps to ball pads of the substrate. The connecting bumps and the ball pads help buffer a clamping force generated during the molding process, so as to prevent a packaged semiconductor chip from being cracked. Moreover, the reflowing process allows the connecting bumps to be self-aligned on the substrate, so as to assure the toning and planarity of the heat sink mounted thereon. Accordingly, during molding, the precisely-positioned beat sink can have its upper side closely abutting an upper mold, allowing a molding resin to be prevented from flashing on the upper side thereof i.e. an exposed side of the heat sink to the atmosphere, so that the heat-dissipating efficiency is increase and the semiconductor package is more cost-effective to fabricate.
摘要翻译：提出了一种具有嵌入式散热装置的半导体封装。包括散热器和附接到形成在散热器上的连接焊盘的多个连接凸块的散热装置通过将连接凸块回流到衬底的球垫而安装在衬底上。连接凸块和球垫有助于缓冲在模制过程中产生的夹紧力，以防止封装的半导体芯片破裂。此外，回流工艺允许连接凸块在基板上自对准，以确保安装在其上的散热器的调色和平面性。因此，在成型期间，精确定位的打纬槽可以使其上侧紧贴在上模上，从而防止模塑树脂在其上侧即散热片暴露的一面到大气中闪烁，使得散热效率提高，制造半导体封装更具成本效益。

4. 发明授权

US07148561B2 Ball grid array substrate strip with warpage-preventive linkage structure 有权
标题翻译：具有防翘曲连杆结构的球栅阵列基板条
公开(公告)号：US07148561B2
公开(公告)日：2006-12-12
申请号：US09823176
申请日：2001-03-29
申请人： Chien Ping Huang , Tzong Da Ho , Isaac Yu
发明人： Chien Ping Huang , Tzong Da Ho , Isaac Yu
IPC分类号： H01L23/495 , H01L23/04 , H01L23/48
CPC分类号： H01L23/562 , H01L23/49816 , H01L23/4985 , H01L2924/0002 , H01L2924/15311 , H01L2924/3511 , H01L2924/00
摘要： A substrate strip with warpage-preventive linkage structure is proposed for a BGA (Ball Grid Array) application. The proposed substrate strip is composed of a series of substrates, each being used for the construction of an individual unit of a BGA package, and which is characterized by the provision of a warpage-preventive linkage structure, by which each substrate on the substrate strip is supported by means of no more than two tie bars, i.e., either by a two-point linkage structure or a one-point linkage structure, in contrast to the four-point linkage structure utilized by the prior art. During high-temperature fabrication steps when the substrate is subjected to thermal stresses, the substrate can freely expand toward the corners where no tie bars are provided; and consequently, it can be unwarped by the thermal stresses. This unwarped substrate allows the subsequently implanted ball grid array thereon to have high coplanarity.
摘要翻译：针对BGA（球栅阵列）应用提出了具有防翘曲连杆结构的基板条。所提出的衬底条由一系列衬底组成，每个衬底用于构造BGA封装的单个单元，其特征在于提供防翘曲连接结构，通过该衬底条可将衬底条上的每个衬底与现有技术所使用的四点连杆结构相比，不受两个连杆的支撑，即通过两点连杆结构或一点连杆结构来支撑。在衬底受到热应力的高温制造步骤期间，衬底可以自由地朝向不设置连接条的角部扩展; 因此，它可能被热应力所束缚。这种未经衬底的衬底允许随后在其上注入的球栅阵列具有高共面性。

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