专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06867487B2 Flash-preventing semiconductor package 失效
标题翻译：防闪光半导体封装
公开(公告)号：US06867487B2
公开(公告)日：2005-03-15
申请号：US09982347
申请日：2001-10-18
申请人： Chien-Ping Huang , Tzong-Da Ho
发明人： Chien-Ping Huang , Tzong-Da Ho
IPC分类号： H01L21/56 , H01L23/22 , H01L23/24
CPC分类号： H01L21/565 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/1815 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor package and a method for fabricating the same are proposed, wherein, in a molding process for encapsulating a semiconductor chip mounted on a substrate, a mold is used with a molding cavity formed with a plurality of recess portions relatively smaller in height, and with a plurality of air vents for connecting the recess portions to outside of the mold and for ventilate air in the molding cavity. This allows a molding resin used during molding to slow down its flow when flowing into the recess portions, as the molding resin rapidly absorbs heat transmitted from the mold and is increased in viscosity thereof. The slowed down molding resin can therefore be prevented from flashing out of the air vents, so that quality and appearance of the fabricated semiconductor package can be well assured.
摘要翻译：提出了一种半导体封装及其制造方法，其中，在用于封装安装在基板上的半导体芯片的模制工艺中，使用具有形成有相对较小高度的多个凹部的模腔，并且具有用于将凹部连接到模具外部并用于使模制空腔中的空气通风的多个通风口。这样，当模制树脂快速吸收从模具传递的热量并且其粘度增加时，这允许在模制期间使用的模塑树脂在流入凹部时减慢其流动。因此，可以防止减速模制树脂从通风孔中闪出，从而可以很好地确保制造的半导体封装的质量和外观。

2. 发明授权

US06844622B2 Semiconductor package with heat sink 有权
标题翻译：半导体封装带散热片
公开(公告)号：US06844622B2
公开(公告)日：2005-01-18
申请号：US09916021
申请日：2001-07-26
申请人： Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
发明人： Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
IPC分类号： H01L21/56 , H01L23/31 , H01L23/433 , H01L23/34
CPC分类号： H01L24/32 , H01L21/561 , H01L23/3128 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2224/85 , H01L2224/83 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor package with a heat sink is proposed, in which a chip has its first surface attached to a chip carrier, while a second surface of the chip is attached to a heat sink through an adhesive, allowing heat generated by the chip to be transmitted to the heat sink. Moreover, in a molding process, a molding resin is used to form an encapsulant for encapsulating the chip, while a top surface and side surfaces connected to the top surface of the heat sink are exposed to outside of the encapsulant, that is, the heat sink merely has its bottom surface bonded to the encapsulant. This makes the generated heat directly dissipated to the atmosphere through the heat sink. Furthermore, the top surface of the heat sink is coated with an interface layer, while adhesion between the interface layer and the molding resin is smaller than that between the heat sink and the encapsulant. This allows the molding resin remained on the interface layer to be easily removed after completing the molding process, while delamination can be prevented from occurrence between the heat sink or the chip and the encapsulant, and also the chip can be prevented from cracking due to clamping force generated during molding.
摘要翻译：提出了具有散热器的半导体封装，其中芯片的第一表面附着到芯片载体上，而芯片的第二表面通过粘合剂附接到散热器，从而允许芯片产生的热量被传输到散热器此外，在成型工艺中，使用模塑树脂形成用于封装芯片的密封剂，同时连接到散热器的顶表面的顶表面和侧表面暴露于密封剂的外部，即热量水槽只有其底表面与密封剂结合。这使得所产生的热量通过散热器直接耗散到大气中。此外，散热器的顶表面涂覆有界面层，而界面层和模制树脂之间的粘合力小于散热器和密封剂之间的粘合。这允许在完成模制过程之后容易地去除界面层上的模塑树脂，同时可以防止散热片或芯片与密封剂之间发生分层，并且还可以防止芯片由于夹紧而开裂成型时产生的力。

3. 发明授权

US06699731B2 Substrate of semiconductor package 有权
标题翻译：半导体封装基板
公开(公告)号：US06699731B2
公开(公告)日：2004-03-02
申请号：US09946903
申请日：2001-09-05
申请人： Chien-Ping Huang , Tzong-Da Ho , Chen-Hsu Hsiao
发明人： Chien-Ping Huang , Tzong-Da Ho , Chen-Hsu Hsiao
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L21/561 , H01L21/565 , H01L23/3114 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/92147 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H05K3/284 , H05K3/3452 , H05K2201/09781 , H05K2201/099 , Y10S438/976 , Y10T29/49174 , H01L2224/85 , H01L2224/83 , H01L2224/81 , H01L2924/00 , H01L2224/05599 , H01L2224/0401
摘要： A fabricating method for a semiconductor package is proposed, in which a chip carrier accommodates at least one semiconductor chip, which is attached with an interface layer formed on a covering module plate consisting of at least one covering plate, while the interface layer is poor in adhesion to the chip and a molding compound used for forming an encapsulant. So that after completing molding, ball implantation and singulation processes, the interface layer, the covering plate and a portion of the encapsulant formed on the covering plate can be easily removed by heating the singulated semiconductor package. This allows the molding compound not to flash on the chip, and prevents the chip from being damaged by stress generated in the molding process.
摘要翻译：提出一种用于半导体封装的制造方法，其中芯片载体容纳至少一个半导体芯片，该半导体芯片附着有形成在由至少一个覆盖板构成的覆盖模块板上的界面层，而界面层较差与芯片的粘附性和用于形成密封剂的模塑料。因此，在完成成型，球注入和分割工艺之后，可以通过加热单切半导体封装容易地去除界面层，覆盖板和形成在覆盖板上的一部分密封剂。这使得模塑料不会在芯片上闪光，并且防止芯片被模制过程中产生的应力损坏。

4. 发明授权

US06650006B2 Semiconductor package with stacked chips 有权
标题翻译：半导体封装堆叠芯片
公开(公告)号：US06650006B2
公开(公告)日：2003-11-18
申请号：US09922270
申请日：2001-08-03
申请人： Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
发明人： Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
IPC分类号： H01L2302
CPC分类号： H01L23/4334 , H01L23/16 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06582 , H01L2225/06589 , H01L2924/00014 , H01L2924/01079 , H01L2924/10161 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor package with stacked chips is proposed, in which a first chip mounted on and electrically connected to a chip carrier is attached with a rigid interposer thereto, while the rigid interposer has a second chip disposed thereon in a manner that the rigid interposer is interposed between the first chip and the second chip. With the use of the rigid interposer, the second chip stacked on the first chip can be positioned in planarly parallel to the chip carrier, allowing bonding wires for electrically connecting the second chip to the chip carrier to be bonded completely. Moreover, the second chip has portions thereof not located right above the first chip to be firmly supported by the rigid interposer, and thus the second chip can be prevented from cracking in the wire bonding process. Furthermore, on the chip carrier there is formed an encapsulant for encapsulating the first chip, the second chip and part of the chip carrier where the first and second chips are electrically connected thereto,
摘要翻译：提出了一种具有堆叠芯片的半导体封装，其中安装在芯片载体上并电连接到芯片载体的第一芯片附有刚性插入件，而刚性插入件具有设置在其上的第二芯片，其中刚性插入件插入在第一芯片和第二芯片之间。通过使用刚性插入件，堆叠在第一芯片上的第二芯片可以平面地平行于芯片载体定位，从而允许用于将第二芯片电连接到芯片载体的接合线以完全粘合。此外，第二芯片的部分不位于第一芯片的正上方，以由刚性插入件牢固地支撑，因此可以防止第二芯片在引线接合过程中破裂。此外，在芯片载体上形成用于封装第一芯片，第二芯片和芯片载体的一部分的密封剂，其中第一芯片和第二芯片与其电连接，

5. 发明授权

US06479894B2 Layout method for thin and fine ball grid array package substrate with plating bus 有权
标题翻译：精细球栅阵列封装基板与电镀母线布局方法
公开(公告)号：US06479894B2
公开(公告)日：2002-11-12
申请号：US09949536
申请日：2001-09-10
申请人： Chien-Ping Huang , Tzong-Da Ho
发明人： Chien-Ping Huang , Tzong-Da Ho
IPC分类号： H01L2352
CPC分类号： H05K3/242 , H01L23/49838 , H01L2924/0002 , H05K3/0052 , H01L2924/00
摘要： A layout method is proposed for semiconductor package substrate with plating bus, such as TFBGA (Thin & Fine Ball Grid Array) substrate, which can help allow each singulated package unit from the substrate to be substantially free of trace short-circuits due to misaligned cutting during singulation process. The proposed layout method is characterized in the provision of a plating bus of a special layout pattern for interconnecting all the via lands alongside each singulation line. The plating bus includes a plurality of crosswise segments, each being used to to interconnect one crosswise-opposite pair of the via lands across the singulation line; and a plurality of diagonal segments, each being used to interconnect one neighboring pair of the crosswise segments diagonally to each other across the singulation line. The proposed layout method allows each singulated package unit from the substrate to be substantially free of trace short-circuits due to misaligned cutting during singulation process. Moreover, it also allows the layout design work to be less complex than prior art.
摘要翻译：提出了一种具有电镀母线（例如TFBGA（Thin＆Fine Ball Grid Array）薄膜）的半导体封装衬底的布局方法，其可以帮助允许来自衬底的每个单个封装单元由于不对准切割而基本上无痕迹短路在分割过程中。所提出的布局方法的特征在于提供一种专用布局图案的电镀母线，用于将所有通孔焊盘与每条分离线连接。电镀母线包括多个横向段，每个横向段用于将一个横向相对的一对通孔焊盘互相穿过该分离线; 以及多个对角线段，每个对角线段用于将一对相邻的横向线段彼此对角地互相穿过单线。所提出的布局方法允许来自基板的每个单个封装单元在切割过程中由于不对齐切割而基本上没有痕迹短路。此外，它还允许布局设计工作比现有技术更不复杂。

6. 发明授权

US06458626B1 Fabricating method for semiconductor package 有权
标题翻译：半导体封装的制造方法
公开(公告)号：US06458626B1
公开(公告)日：2002-10-01
申请号：US09921775
申请日：2001-08-03
申请人： Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
发明人： Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
IPC分类号： H01L2144
CPC分类号： H01L24/97 , H01L23/3128 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2224/32245 , H01L2224/05599 , H01L2224/0401
摘要： A fabricating method for a semiconductor package is proposed, in which a substrate module plate consisting of a plurality of array-arranged substrates is mounted with at least one chip on each of the substrates, so as to allow a heat sink module plate coated with an interface layer to attach to the chips. Subsequently, an encapsulant is formed by a molding compound for encapsulating the chip carrier module plate, the chips and the heat sink module plate during molding. As the adhesion between the interface layer and the encapsulant is smaller than that between the heat sink module plate and the encapsulant, the portion of the encapsulant formed on the interface layer can be easily removed without causing damage to the fabricated semiconductor package and delamination of the heat sink module plant from the encapsulant.
摘要翻译：提出了一种用于半导体封装的制造方法，其中由多个阵列布置的衬底组成的衬底模块板在每个衬底上安装有至少一个芯片，以便允许涂覆有接口层连接到芯片。随后，通过模制化合物形成密封剂，用于在模制期间封装芯片载体模块板，芯片和散热器模块板。由于界面层和密封剂之间的粘附力小于散热模块板和密封剂之间的密合性，所以形成在界面层上的密封剂部分可以容易地被去除，而不会造成制造的半导体封装的损坏和散热器模块植物从密封剂。

7. 发明授权

US06282094B1 Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same 失效
标题翻译：球栅阵列集成电路封装具有嵌入式散热结构及其制造方法
公开(公告)号：US06282094B1
公开(公告)日：2001-08-28
申请号：US09545996
申请日：2000-04-10
申请人： Randy H. Y. Lo , Jeng Yuan Lai , Eric Ko , Tzong-Da Ho
发明人： Randy H. Y. Lo , Jeng Yuan Lai , Eric Ko , Tzong-Da Ho
IPC分类号： H05K720
CPC分类号： H01L23/3677 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , Y10T29/49149 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A BGA (Ball-Grid Array) IC package with an unembedded type of heat-dissipation structure is proposed. The unembedded type of heat-dissipation structure is characterized in that a plurality of thermally-conductive vias are formed in the substrate and extending from the die-attachment area to the back side of the substrate; and further, a plurality of thermally-conductive balls are bonded to the thermally-conductive vias on the back side of the substrate. Moreover, a thermally-conductive layer is formed over a thermally-conductive area on the back side of the substrate on which the thermally-conductive balls are mounted for the purpose of increasing the exposed area of the overall heat-dissipation structure to the atmosphere. This allows the IC-produced heat during operation to be conducted through the thermally-conductive vias, the thermally-conductive balls, and the thermally-conductive layer to be dissipated the atmosphere. The unembedded manner of integration requires no openings to be formed in the substrate that would otherwise allow ambient moisture to enter into the inside of the package body as in the case of the prior art, and also allows the heat-dissipation structure to be more easily integrated to the package configuration. Due to these benefits, the BGA IC package can be manufactured through a more simplified and cost-effective process, while nevertheless providing a high heat-dissipation efficiency.
摘要翻译：提出了一种具有非嵌入式散热结构的BGA（球栅阵列）IC封装。未嵌入式的散热结构的特征在于，在基板中形成多个导热通孔，并且从管芯附着区域延伸到基板的背面; 此外，多个导热球接合到基板的背面上的导热通孔。此外，为了增加整个散热结构对大气的暴露面积，在其上安装有导热球的基板的背面上的导热区域上形成导热层。这允许在操作期间产生的IC产生的热量通过导热通孔，导热球和导热层传导以消散大气。未嵌入的集成方式不需要在基板中形成开口，否则将使现有技术的情况下环境湿气进入包装体的内部，并且还允许散热结构更容易集成到包配置。由于这些优点，BGA IC封装可以通过更简化和成本有效的工艺制造，同时仍然提供高散热效率。

8. 发明授权

US07074645B2 Fabrication method of semiconductor package with heat sink 有权
标题翻译：具有散热片的半导体封装的制造方法
公开(公告)号：US07074645B2
公开(公告)日：2006-07-11
申请号：US11013980
申请日：2004-12-15
申请人： Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
发明人： Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/32 , H01L21/561 , H01L23/3128 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2224/85 , H01L2224/83 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor package with a heat sink is proposed, in which a chip has its first surface attached to a chip carrier, while a second surface of the chip is attached to a heat sink through an adhesive, allowing heat generated by the chip to be transmitted to the heat sink. Moreover, in a molding process, a molding resin is used to form an encapsulant for encapsulating the chip, while a top surface and side surfaces connected to the top surface of the heat sink are exposed to outside of the encapsulant, that is, the heat sink merely has its bottom surface bonded to the encapsulant. This makes the generated heat directly dissipated to the atmosphere through the heat sink. Furthermore, the top surface of the heat sink is coated with an interface layer, while adhesion between the interface layer and the molding resin is smaller than that between the heat sink and the encapsulant. This allows the molding resin remained on the interface layer to be easily removed after completing the molding process, while delamination can be prevented from occurrence between the heat sink or the chip and the encapsulant, and also the chip can be prevented from cracking due to clamping force generated during molding.
摘要翻译：提出了具有散热器的半导体封装，其中芯片的第一表面附着到芯片载体上，而芯片的第二表面通过粘合剂附接到散热器，从而允许芯片产生的热量被传输到散热器此外，在成型工艺中，使用模塑树脂形成用于封装芯片的密封剂，同时连接到散热器的顶表面的顶表面和侧表面暴露于密封剂的外部，即热量水槽只有其底表面与密封剂结合。这使得所产生的热量通过散热器直接耗散到大气中。此外，散热器的顶表面涂覆有界面层，而界面层和模制树脂之间的粘合力小于散热器和密封剂之间的粘合。这允许在完成模制过程之后容易地去除界面层上的模塑树脂，同时可以防止散热片或芯片与密封剂之间发生分层，并且还可以防止芯片由于夹紧而开裂成型时产生的力。

9. 发明申请

US20050095875A1 Fabrication method of semiconductor package with heat sink 有权
标题翻译：具有散热片的半导体封装的制造方法
公开(公告)号：US20050095875A1
公开(公告)日：2005-05-05
申请号：US11013980
申请日：2004-12-15
申请人： Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
发明人： Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
IPC分类号： H01L21/56 , H01L23/31 , H01L23/433 , H01L23/34
CPC分类号： H01L24/32 , H01L21/561 , H01L23/3128 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2224/85 , H01L2224/83 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor package with a heat sink is proposed, in which a chip has its first surface attached to a chip carrier, while a second surface of the chip is attached to a heat sink through an adhesive, allowing heat generated by the chip to be transmitted to the heat sink. Moreover, in a molding process, a molding resin is used to form an encapsulant for encapsulating the chip, while a top surface and side surfaces connected to the top surface of the heat sink are exposed to outside of the encapsulant, that is, the heat sink merely has its bottom surface bonded to the encapsulant. This makes the generated heat directly dissipated to the atmosphere through the heat sink. Furthermore, the top surface of the heat sink is coated with an interface layer, while adhesion between the interface layer and the molding resin is smaller than that between the heat sink and the encapsulant. This allows the molding resin remained on the interface layer to be easily removed after completing the molding process, while delamination can be prevented from occurrence between the heat sink or the chip and the encapsulant, and also the chip can be prevented from cracking due to clamping force generated during molding.
摘要翻译：提出了具有散热器的半导体封装，其中芯片的第一表面附着到芯片载体上，而芯片的第二表面通过粘合剂附接到散热器，从而允许芯片产生的热量被传输到散热器此外，在成型工艺中，使用模塑树脂形成用于封装芯片的密封剂，同时连接到散热器的顶表面的顶表面和侧表面暴露于密封剂的外部，即热量水槽只有其底表面与密封剂结合。这使得所产生的热量通过散热器直接耗散到大气中。此外，散热器的顶表面涂覆有界面层，而界面层和模制树脂之间的粘合力小于散热器和密封剂之间的粘合。这允许在完成模制过程之后容易地去除界面层上的模塑树脂，同时可以防止散热片或芯片与密封剂之间发生分层，并且还可以防止芯片由于夹紧而开裂成型时产生的力。

10. 发明授权

US06507104B2 Semiconductor package with embedded heat-dissipating device 有权
标题翻译：半导体封装带嵌入式散热装置
公开(公告)号：US06507104B2
公开(公告)日：2003-01-14
申请号：US09905754
申请日：2001-07-14
申请人： Tzong Da Ho , Chien Ping Huang
发明人： Tzong Da Ho , Chien Ping Huang
IPC分类号： H01L2334
CPC分类号： H01L24/73 , H01L23/3107 , H01L23/3128 , H01L23/4334 , H01L23/49503 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73221 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： A semiconductor package with an embedded heat-dissipating device is proposed. The heat-dissipating device including a heat sink and a plurality of connecting bumps attached to connecting pads formed on the heat sink is mounted on a substrate by reflowing the connecting bumps to ball pads of the substrate. The connecting bumps and the ball pads help buffer a clamping force generated during the molding process, so as to prevent a packaged semiconductor chip from being cracked. Moreover, the reflowing process allows the connecting bumps to be self-aligned on the substrate, so as to assure the toning and planarity of the heat sink mounted thereon. Accordingly, during molding, the precisely-positioned beat sink can have its upper side closely abutting an upper mold, allowing a molding resin to be prevented from flashing on the upper side thereof i.e. an exposed side of the heat sink to the atmosphere, so that the heat-dissipating efficiency is increase and the semiconductor package is more cost-effective to fabricate.
摘要翻译：提出了一种具有嵌入式散热装置的半导体封装。包括散热器和附接到形成在散热器上的连接焊盘的多个连接凸块的散热装置通过将连接凸块回流到衬底的球垫而安装在衬底上。连接凸块和球垫有助于缓冲在模制过程中产生的夹紧力，以防止封装的半导体芯片破裂。此外，回流工艺允许连接凸块在基板上自对准，以确保安装在其上的散热器的调色和平面性。因此，在成型期间，精确定位的打纬槽可以使其上侧紧贴在上模上，从而防止模塑树脂在其上侧即散热片暴露的一面到大气中闪烁，使得散热效率提高，制造半导体封装更具成本效益。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式