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    • 6. 发明授权
    • Non-planar surface structures and process for microelectromechanical systems
    • 微机电系统的非平面表面结构和工艺
    • US07623287B2
    • 2009-11-24
    • US11406866
    • 2006-04-19
    • Teruo SasagawaLior KogutMing-Hau Tung
    • Teruo SasagawaLior KogutMing-Hau Tung
    • G02B26/00
    • B81B3/0008G02B26/001
    • Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. A non-planar surface is formed on one or more layers by flowing an etchant through a permeable layer. In one embodiment the non-planar surface is formed on a sacrificial layer. A movable layer formed over the non-planar surface of the sacrificial layer results in a non-planar interface between the sacrificial and movable layers. Removal of the sacrificial layer results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.
    • 制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层,可移动层和牺牲层的各种层。 通过使蚀刻剂流过可渗透层而在一个或多个层上形成非平面表面。 在一个实施例中,非平面表面形成在牺牲层上。 形成在牺牲层的非平面表面上的可移动层导致牺牲层和可移动层之间的非平面界面。 牺牲层的去除导致释放的MEMS器件在MEMS器件致动时具有减小可移动层和固定层之间的接触面积。 减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。 这些方法可用于制造释放和未释放的干涉式调制器。