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    • 1. 发明申请
    • SEMICONDUCTOR NANOWIRE SENSOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体纳米传感器器件及其制造方法
    • US20100270530A1
    • 2010-10-28
    • US12682571
    • 2008-07-24
    • Chan Woo ParkChang Geun AhnJong Heon YangIn Book BaekChil Seong AhHan Young YuAn Soon KimTae Youb KimMoon Gyu JangMyung Sim Jun
    • Chan Woo ParkChang Geun AhnJong Heon YangIn Book BaekChil Seong AhHan Young YuAn Soon KimTae Youb KimMoon Gyu JangMyung Sim Jun
    • H01L29/775H01L21/336
    • H01L29/0665B82Y10/00B82Y15/00H01L29/0673H01L29/78696
    • A method for manufacturing a biosensor device is provided. The method involves forming a silicon nanowire channel with a line width of several nanometers to several tens of nanometers using a typical photolithography process, and using the channel to manufacture a semiconductor nanowire sensor device. The method includes etching a first conductivity-type single crystalline silicon layer which is a top layer of a Silicon-On-Insulator (SOI) substrate to form a first conductivity-type single crystalline silicon line pattern, doping both sidewalls of the first conductivity-type single crystalline silicon line pattern with impurities of a second conductivity-type opposite to the first conductivity-type to form a second conductivity-type channel, forming second conductivity-type pads for forming electrodes at both ends of the first conductivity-type single crystalline silicon line pattern, forming, in an undoped region of the first conductivity-type single crystalline silicon line pattern, a first electrode for applying a reverse-bias voltage to insulate the first conductivity-type single crystalline silicon line pattern and the second conductivity-type channel from each other, and forming second electrodes for applying a bias voltage across the second conductivity-type channel on the second conductivity-type pad.
    • 提供一种制造生物传感器装置的方法。 该方法包括使用典型的光刻工艺形成线宽为几纳米至几十纳米的硅纳米线通道,并使用该通道制造半导体纳米线传感器装置。 该方法包括蚀刻作为绝缘体上硅(SOI)衬底的顶层的第一导电型单晶硅层,以形成第一导电型单晶硅线图案,掺杂第一导电型单晶硅线阵列的两个侧壁, 形成具有与第一导电类型相反的第二导电类型的杂质的单晶硅线图案,以形成第二导电型沟道,形成用于在第一导电型单晶的两端形成电极的第二导电型焊盘 硅线图案,在第一导电型单晶硅线图案的未掺杂区域中形成第一电极,用于施加反向偏置电压以使第一导电型单晶硅线图案和第二导电型 并且形成用于在第二导通型通道上施加偏置电压的第二电极 导电型垫。
    • 8. 发明申请
    • THERMOELECTRIC ARRAY
    • 热电阵列
    • US20110192439A1
    • 2011-08-11
    • US13022251
    • 2011-02-07
    • Young Sam PARKMoon Gyu JangMyung Sim JunYoung Hoon Hyun
    • Young Sam PARKMoon Gyu JangMyung Sim JunYoung Hoon Hyun
    • H01L35/30
    • H01L35/30
    • Provided is a thermoelectric array including a plurality of thermoelectric elements arranged in m rows and n columns (each of m and n is an integer equal to or more than 1), each thermoelectric element including a heat absorption layer, a first heat sink layer, a second heat sink layer, a first-conductivity-type leg, and a second-conductivity-type leg formed on the same plane. The heat absorption layers of the thermoelectric elements adjacently disposed in a row or column direction are disposed adjacent to each other, and the first and second heat sink layers of the adjacent thermoelectric elements are disposed adjacent to each other. In this case, thermal interference between adjacent thermoelectric elements may be minimized, thereby obtaining a thermoelectric array having a high figure of merit.
    • 本发明提供一种热电阵列,其包括以m行n列(m和n为1以上的整数)排列的多个热电元件,热电元件包括​​吸热层,第1散热层, 第二散热层,第一导电型脚和形成在同一平面上的第二导电型脚。 相邻地配置在行或列方向上的热电元件的吸热层相邻配置,相邻的热电元件的第一和第二散热层相邻配置。 在这种情况下,相邻热电元件之间的热干扰可以最小化,从而获得具有高品质因数的热电阵列。
    • 9. 发明授权
    • Method of manufacturing a Schottky barrier tunnel transistor
    • 制造肖特基势垒隧道晶体管的方法
    • US07981735B2
    • 2011-07-19
    • US12434779
    • 2009-05-04
    • Yark Yeon KimSeong Jae LeeMoon Gyu JangChel Jong ChoiMyung Sim JunByoung Chul Park
    • Yark Yeon KimSeong Jae LeeMoon Gyu JangChel Jong ChoiMyung Sim JunByoung Chul Park
    • H01L21/336
    • H01L29/47H01L29/458H01L29/4908H01L29/66545H01L29/66772H01L29/7839
    • Provided are a Schottky barrier tunnel transistor and a method of manufacturing the same that are capable of minimizing leakage current caused by damage to a gate sidewall of the Schottky barrier tunnel transistor using a Schottky tunnel barrier naturally formed at a semiconductor-metal junction as a tunnel barrier. The method includes the steps of: forming a semiconductor channel layer on an insulating substrate; forming a dummy gate on the semiconductor channel layer; forming a source and a drain at both sides of the dummy gate on the insulating substrate; removing the dummy gate; forming an insulating layer on a sidewall from which the dummy gate is removed; and forming an actual gate in a space from which the dummy gate is removed. In manufacturing the Schottky barrier tunnel transistor using the dummy gate, it is possible to form a high-k dielectric gate insulating layer and a metal gate, and stable characteristics in silicidation of the metal layer having very strong reactivity can be obtained.
    • 提供了一种肖特基势垒隧道晶体管及其制造方法,该晶体管能够使用在半导体 - 金属结上自然形成的肖特基隧道势垒作为隧道来最小化对肖特基势垒隧道晶体管的栅极侧壁的损坏所造成的漏电流 屏障。 该方法包括以下步骤:在绝缘基板上形成半导体沟道层; 在半导体沟道层上形成虚拟栅极; 在绝缘基板上的虚拟栅极的两侧形成源极和漏极; 去除虚拟门; 在去除所述伪栅极的侧壁上形成绝缘层; 并且在从其中去除虚拟栅极的空间中形成实际栅极。 在使用伪栅极制造肖特基势垒隧道晶体管时,可以形成高k电介质栅极绝缘层和金属栅极,并且可以获得具有非常强反应性的金属层的硅化物的稳定特性。
    • 10. 发明授权
    • Schottky barrier tunnel transistor and method of manufacturing the same
    • 肖特基势垒隧道晶体管及其制造方法
    • US07545000B2
    • 2009-06-09
    • US11485837
    • 2006-07-13
    • Yark Yeon KimSeong Jae LeeMoon Gyu JangChel Jong ChoiMyung Sim JunByoung Chul Park
    • Yark Yeon KimSeong Jae LeeMoon Gyu JangChel Jong ChoiMyung Sim JunByoung Chul Park
    • H01L27/01
    • H01L29/47H01L29/458H01L29/4908H01L29/66545H01L29/66772H01L29/7839
    • Provided are a Schottky barrier tunnel transistor and a method of manufacturing the same that are capable of minimizing leakage current caused by damage to a gate sidewall of the Schottky barrier tunnel transistor using a Schottky tunnel barrier naturally formed at a semiconductor-metal junction as a tunnel barrier. The method includes the steps of: forming a semiconductor channel layer on an insulating substrate; forming a dummy gate on the semiconductor channel layer; forming a source and a drain at both sides of the dummy gate on the insulating substrate; removing the dummy gate; forming an insulating layer on a sidewall from which the dummy gate is removed; and forming an actual gate in a space from which the dummy gate is removed. In manufacturing the Schottky barrier tunnel transistor using the dummy gate, it is possible to form a high-k dielectric gate insulating layer and a metal gate, and stable characteristics in silicidation of the metal layer having very strong reactivity can be obtained.
    • 提供了一种肖特基势垒隧道晶体管及其制造方法,该晶体管能够使用在半导体 - 金属结上自然形成的肖特基隧道势垒作为隧道,将肖特基势垒隧道晶体管的栅极侧壁损坏所造成的漏电流减到最小 屏障。 该方法包括以下步骤:在绝缘基板上形成半导体沟道层; 在半导体沟道层上形成虚拟栅极; 在绝缘基板上的虚拟栅极的两侧形成源极和漏极; 去除虚拟门; 在去除所述伪栅极的侧壁上形成绝缘层; 并且在从其中去除虚拟栅极的空间中形成实际栅极。 在使用伪栅极制造肖特基势垒隧道晶体管时,可以形成高k电介质栅极绝缘层和金属栅极,并且可以获得具有非常强反应性的金属层的硅化物的稳定特性。