专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070218653A1 METHODS FOR DRYING SEMICONDUCTOR WAFER SURFACES USING A PLURALITY OF INLETS AND OUTLETS HELD IN CLOSE PROXIMITY TO THE WAFER SURFACES 失效
标题翻译：使用大量入口和出口将半导体波形表面干燥的方法保持在接近于波长表面的距离
公开(公告)号：US20070218653A1
公开(公告)日：2007-09-20
申请号：US11750960
申请日：2007-05-18
申请人： John de Larios , Mike Ravkin , Carl Woods , Fritz Redeker , James Garcia
发明人： John de Larios , Mike Ravkin , Carl Woods , Fritz Redeker , James Garcia
IPC分类号： H01L21/02
CPC分类号： H01L21/67051 , B08B3/04 , G03F7/30 , H01L21/67028 , H01L21/67034 , Y10S134/902
摘要： Methods for processing substrate through a head that is configured to be placed in close non-contact proximity to a surface of a substrate are provided. One method includes applying a first fluid onto the surface of the substrate from conduits in the head when the head is in close proximity to the surface of the substrate and removing the first fluid from the surface of the substrate. The removing is processed just as first fluid is applied to the surface of the substrate, and the removing ensures that the applied first fluid is contained between a surface of the head and the surface of the substrate and the first fluid being applied and removed defines a controlled meniscus. The method further includes moving the controlled meniscus over different regions of the surface of the substrate when movement of the head or the substrate is dictated. The moving of the controlled meniscus enables processing of part or all of the surface of the substrate using the first fluid.
摘要翻译：提供了通过头部处理基板的方法，该头被配置为与基板的表面紧密非接触地放置。一种方法包括当头部紧邻衬底的表面并从衬底的表面去除第一流体时，将第一流体施加到衬底表面上的管道中。当第一流体被施加到基板的表面上时，移除被处理，并且移除确保所施加的第一流体被包含在头部的表面和基底的表面之间，并且被施加和移除的第一流体限定了受控半月板所述方法还包括当限制头部或基底的运动时，将受控弯液面移动到衬底的表面的不同区域上。受控弯液面的移动使得能够使用第一流体处理基板的部分或全部表面。

2. 发明申请

US20060207636A1 Multi-menisci processing apparatus 失效
标题翻译：多功能加工设备
公开(公告)号：US20060207636A1
公开(公告)日：2006-09-21
申请号：US11437891
申请日：2006-05-18
申请人： James Garcia , Mike Ravkin , Carl Woods , Fred Redeker , John de Larios
发明人： James Garcia , Mike Ravkin , Carl Woods , Fred Redeker , John de Larios
IPC分类号： B08B3/00 , B08B3/12
CPC分类号： C25D5/22 , B08B3/04 , C25D17/001 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A substrate preparation apparatus is provided. The apparatus includes a housing configured to be installed in a substrate fabrication facility. The housing includes a manifold for use in preparing a wafer surface. The manifold is configured to include a first process window in a first portion of the manifold. A first fluid meniscus is capable of being defined within the first process window. Further included is a second process window in a second portion of the manifold. A second fluid meniscus is capable of being defined within the second process window. An arm is integrated with the housing, and the arm is coupled to the manifold, such that the arm is capable of positioning the manifold in proximity with the substrate during operation. The apparatus therefore provides for the formation of multi-menisci over the surface of a substrate using a single manifold.
摘要翻译：提供了基板制备装置。该装置包括构造成安装在基板制造设备中的壳体。壳体包括用于制备晶片表面的歧管。歧管被配置为在歧管的第一部分中包括第一过程窗口。第一流体弯液面能够在第一过程窗口内被定义。还包括在歧管的第二部分中的第二处理窗口。能够在第二过程窗口内限定第二流体弯月面。臂与壳体一体化，并且臂联接到歧管，使得臂在操作期间能够将歧管定位在基板附近。因此，该装置提供了使用单个歧管在基板的表面上形成多重半月板。

3. 发明申请

US20060081270A1 Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus 失效
标题翻译：使用动态液体弯月面处理衬底的斜边缘的方法和系统
公开(公告)号：US20060081270A1
公开(公告)日：2006-04-20
申请号：US11292490
申请日：2005-12-01
申请人： Carl Woods , James Garcia , John de Larios
发明人： Carl Woods , James Garcia , John de Larios
IPC分类号： C23G1/00 , B08B3/00
CPC分类号： B08B3/04 , H01L21/67028 , H01L21/67034 , H01L21/67051 , Y10S134/902
摘要： A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the concave portion. The concave portion being capable of receiving an edge of a substrate and the ports including at least one process liquid injection port, at least one vacuum port and at least one surface tension control port.
摘要翻译：用于处理衬底的边缘的系统和方法包括边缘辊和第一邻近头。第一接近头安装在边缘辊上。第一接近头部能够形成弯液面并且包括凹入部分和通向凹部的多个端口。所述凹部能够容纳衬底的边缘，并且所述端口包括至少一个处理液体注入端口，至少一个真空端口和至少一个表面张力控制端口。

4. 发明申请

US20070023070A1 Meniscus, vacuum, IPA vapor, drying manifold 失效
标题翻译：半月板，真空，IPA蒸气，干燥歧管
公开(公告)号：US20070023070A1
公开(公告)日：2007-02-01
申请号：US11542700
申请日：2006-10-03
申请人： Carl Woods , James Garcia , John de Larios
发明人： Carl Woods , James Garcia , John de Larios
IPC分类号： B08B5/04 , B08B3/00
CPC分类号： H01L21/67051 , C25D5/22 , C25D17/001 , H01L21/02041 , H01L21/02052 , H01L21/67028 , H01L21/67034 , H01L21/67046 , Y10S134/902
摘要： A head is provided which includes a first surface of the head capable of being in close proximity to the wafer surface, and includes a first conduit region on the head where the first conduit region is defined for delivery of a first fluid to wafer of the surface and the first conduit region is defined in a center portion of the head. The head further includes a second conduit region on the head which surrounds the first conduit region, and includes a third conduit region on the head which is defined for delivery of a second fluid to the wafer surface. The third conduit region semi-encloses the first conduit region and the second conduit region. The second conduit region enables a removal of the first fluid and the second fluid. The delivery of the first fluid and the second fluid combined with the removal by the third conduit region of the head defines a controllable meniscus.
摘要翻译：提供了一种头部，其包括能够靠近晶片表面的头部的第一表面，并且包括头部上的第一导管区域，其中限定第一导管区域以将第一流体输送到表面的晶片并且第一管道区域被限定在头部的中心部分中。头部还包括在头部上的围绕第一管道区域的第二管道区域，并且包括头部上的第三管道区域，其被限定用于将第二流体输送到晶片表面。第三管道区域半封闭第一管道区域和第二管道区域。第二管道区域能够移除第一流体和第二流体。第一流体和第二流体的输送与头部的第三导管区域的移除相结合，限定了可控弯液面。

5. 发明申请

US20050139318A1 Proximity meniscus manifold 失效
标题翻译：近似弯液面歧管
公开(公告)号：US20050139318A1
公开(公告)日：2005-06-30
申请号：US10817133
申请日：2004-04-01
申请人： Carl Woods , Michael Smith , John Parks , James Garcia , John de Larios
发明人： Carl Woods , Michael Smith , John Parks , James Garcia , John de Larios
IPC分类号： B05C9/02 , B05D1/00 , B05D3/12 , H01L21/00 , H01L21/02 , H01L21/027 , H01L21/304 , H01L21/306
CPC分类号： H01L21/67063 , B05C9/02 , H01L21/02052 , H01L21/67023 , H01L21/67028 , H01L21/67034 , H01L21/6704 , H01L21/67051 , H01L21/6708 , Y10S134/902
摘要： An apparatus for processing a substrate is provided which includes a first manifold module to generate a fluid meniscus on a substrate surface. The apparatus also includes a second manifold module to connect with the first manifold module and also to move the first manifold module into close proximity to the substrate surface to generate the fluid meniscus.
摘要翻译：提供了一种用于处理衬底的设备，其包括用于在衬底表面上产生流体弯液面的第一歧管模块。该装置还包括与第一歧管模块连接并且还将第一歧管模块移动到靠近衬底表面以产生流体弯液面的第二歧管模块。

6. 发明申请

US20070107756A1 MENISCUS PROXIMITY SYSTEM FOR CLEANING SEMICONDUCTOR SUBSTRATE SURFACES 有权
标题翻译：用于清洁半导体基板表面的MENISCUS接近系统
公开(公告)号：US20070107756A1
公开(公告)日：2007-05-17
申请号：US11619599
申请日：2007-01-03
申请人： Carl Woods , James Garcia , John de Larios
发明人： Carl Woods , James Garcia , John de Larios
IPC分类号： B08B3/00 , B08B3/12
CPC分类号： H01L21/67051 , C25D5/22 , C25D17/001 , H01L21/02041 , H01L21/02052 , H01L21/67028 , H01L21/67034 , H01L21/67046 , Y10S134/902
摘要： A system and apparatus for cleaning a substrate is provided. The system includes a first head configured as a bar shape that extends approximately a diameter of the substrate. The first head is configured for placement on a first side of the substrate. A second head is also provided, and is configured as a bar shape that extends approximately the diameter of the wafer, and the second head is configured for placement on a second side of the substrate, such that the second side is opposite the first side. In this example, each of the first head and the second head have conduits formed therein along the diameter of the substrate for delivering and removing fluids so that a meniscus is capable of being contained between each of the first head and a substrate surface of the first side of the substrate and the second head and a substrate surface of the second side of the substrate.
摘要翻译：提供了一种清洁基板的系统和装置。该系统包括构造为棒状的第一头部，其大致延伸到基底的直径。第一头被配置为放置在基底的第一侧上。还提供了第二头，并且被配置为大致延伸晶片的直径的棒状，并且第二头构造成用于放置在衬底的第二侧上，使得第二侧与第一侧相对。在该示例中，第一头部和第二头部中的每一个具有沿着基底的直径形成在其中的导管，用于输送和移除流体，使得弯液面能够容纳在第一头部和第一头部的基底表面之间基板和第二头部的一侧以及基板的第二侧的基板表面。

7. 发明申请

US20070011905A1 Methods and systems for processing a substrate using a dynamic liquid meniscus 失效
标题翻译：使用动态液体弯月面处理衬底的方法和系统
公开(公告)号：US20070011905A1
公开(公告)日：2007-01-18
申请号：US11525278
申请日：2006-09-21
申请人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
发明人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
IPC分类号： F26B7/00 , F26B5/04
CPC分类号： C25D5/22 , C25D7/12 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.
摘要翻译：将弯液面从第一表面移动到第二表面的系统和方法包括在头部和第一表面之间形成弯液面。弯液面可以从第一表面移动到相邻的第二表面，相邻的第二表面平行于第一表面。移动弯液面的系统和方法也可以用于沿着基板的边缘移动弯月面。

8. 发明申请

US20060150435A1 Methods and systems for processing a substrate using a dynamic liquid meniscus 有权
公开(公告)号：US20060150435A1
公开(公告)日：2006-07-13
申请号：US11318019
申请日：2005-12-22
申请人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
发明人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
IPC分类号： F26B7/00 , F26B17/30 , F26B5/04
CPC分类号： C25D5/22 , C25D7/12 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

9. 发明授权

US07464719B2 Multi-menisci processing apparatus 失效
标题翻译：多功能加工设备
公开(公告)号：US07464719B2
公开(公告)日：2008-12-16
申请号：US11437891
申请日：2006-05-18
申请人： James P. Garcia , Mike Ravkin , Carl Woods , Fred C. Redeker , John de Larios
发明人： James P. Garcia , Mike Ravkin , Carl Woods , Fred C. Redeker , John de Larios
IPC分类号： B08B3/00 , B08B7/04
CPC分类号： C25D5/22 , B08B3/04 , C25D17/001 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A substrate preparation apparatus is provided. The apparatus includes a housing configured to be installed in a substrate fabrication facility. The housing includes a manifold for use in preparing a wafer surface. The manifold is configured to include a first process window in a first portion of the manifold. A first fluid meniscus is capable of being defined within the first process windowl. Further included is a second process window in a second portion of the manifold. A second fluid meniscus is capable of being defined within the second process window. An arm is integrated with the housing, and the arm is coupled to the manifold, such that the arm is capable of positioning the manifold in proximity with the substrate during operation. The apparatus therefore provides for the formation of multi-menisci over the surface of a substrate using a single manifold.
摘要翻译：提供了基板制备装置。该装置包括构造成安装在基板制造设备中的壳体。壳体包括用于制备晶片表面的歧管。歧管被配置为在歧管的第一部分中包括第一过程窗口。第一流体弯液面能够在第一过程窗口内被定义。还包括在歧管的第二部分中的第二处理窗口。能够在第二过程窗口内限定第二流体弯月面。臂与壳体一体化，并且臂联接到歧管，使得臂在操作期间能够将歧管定位在基板附近。因此，该装置提供了使用单个歧管在基板的表面上形成多重半月板。

10. 发明申请

US20050158473A1 Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same 有权
标题翻译：接近底物制备顺序及其实施方法，装置和系统
公开(公告)号：US20050158473A1
公开(公告)日：2005-07-21
申请号：US10882716
申请日：2004-06-30
申请人： Michael Raykin , John de Larios , Mikhail Korolik , Michael Smith , Carl Woods
发明人： Michael Raykin , John de Larios , Mikhail Korolik , Michael Smith , Carl Woods
IPC分类号： A47L15/00 , A47L25/00 , B08B1/02 , B08B1/04 , B08B3/00 , B08B3/04 , B08B7/00 , B08B7/04 , H01L21/00 , B05D3/00
CPC分类号： H01L21/67046 , B08B1/04 , B08B3/04 , H01L21/67028 , H01L21/67034 , H01L21/67051
摘要： A method for preparing a surface of a substrate is provided. The method includes scanning the surface of the substrate by a meniscus, preparing the surface of the substrate using the meniscus, and performing a next preparation operation on the surface of the substrate that was prepared without performing a rinsing operation.
摘要翻译：提供了制备基板表面的方法。该方法包括通过弯液面扫描基板的表面，使用弯月面准备基板的表面，并且在不执行漂洗操作的情况下对基板的表面进行下一个准备操作。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式