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    • 4. 发明申请
    • MENISCUS PROXIMITY SYSTEM FOR CLEANING SEMICONDUCTOR SUBSTRATE SURFACES
    • 用于清洁半导体基板表面的MENISCUS接近系统
    • US20070107756A1
    • 2007-05-17
    • US11619599
    • 2007-01-03
    • Carl WoodsJames GarciaJohn de Larios
    • Carl WoodsJames GarciaJohn de Larios
    • B08B3/00B08B3/12
    • H01L21/67051C25D5/22C25D17/001H01L21/02041H01L21/02052H01L21/67028H01L21/67034H01L21/67046Y10S134/902
    • A system and apparatus for cleaning a substrate is provided. The system includes a first head configured as a bar shape that extends approximately a diameter of the substrate. The first head is configured for placement on a first side of the substrate. A second head is also provided, and is configured as a bar shape that extends approximately the diameter of the wafer, and the second head is configured for placement on a second side of the substrate, such that the second side is opposite the first side. In this example, each of the first head and the second head have conduits formed therein along the diameter of the substrate for delivering and removing fluids so that a meniscus is capable of being contained between each of the first head and a substrate surface of the first side of the substrate and the second head and a substrate surface of the second side of the substrate.
    • 提供了一种清洁基板的系统和装置。 该系统包括构造为棒状的第一头部,其大致延伸到基底的直径。 第一头被配置为放置在基底的第一侧上。 还提供了第二头,并且被配置为大致延伸晶片的直径的棒状,并且第二头构造成用于放置在衬底的第二侧上,使得第二侧与第一侧相对。 在该示例中,第一头部和第二头部中的每一个具有沿着基底的直径形成在其中的导管,用于输送和移除流体,使得弯液面能够容纳在第一头部和第一头部的基底表面之间 基板和第二头部的一侧以及基板的第二侧的基板表面。
    • 5. 发明申请
    • Meniscus, vacuum, IPA vapor, drying manifold
    • 半月板,真空,IPA蒸气,干燥歧管
    • US20070023070A1
    • 2007-02-01
    • US11542700
    • 2006-10-03
    • Carl WoodsJames GarciaJohn de Larios
    • Carl WoodsJames GarciaJohn de Larios
    • B08B5/04B08B3/00
    • H01L21/67051C25D5/22C25D17/001H01L21/02041H01L21/02052H01L21/67028H01L21/67034H01L21/67046Y10S134/902
    • A head is provided which includes a first surface of the head capable of being in close proximity to the wafer surface, and includes a first conduit region on the head where the first conduit region is defined for delivery of a first fluid to wafer of the surface and the first conduit region is defined in a center portion of the head. The head further includes a second conduit region on the head which surrounds the first conduit region, and includes a third conduit region on the head which is defined for delivery of a second fluid to the wafer surface. The third conduit region semi-encloses the first conduit region and the second conduit region. The second conduit region enables a removal of the first fluid and the second fluid. The delivery of the first fluid and the second fluid combined with the removal by the third conduit region of the head defines a controllable meniscus.
    • 提供了一种头部,其包括能够靠近晶片表面的头部的第一表面,并且包括头部上的第一导管区域,其中限定第一导管区域以将第一流体输送到表面的晶片 并且第一管道区域被限定在头部的中心部分中。 头部还包括在头部上的围绕第一管道区域的第二管道区域,并且包括头部上的第三管道区域,其被限定用于将第二流体输送到晶片表面。 第三管道区域半封闭第一管道区域和第二管道区域。 第二管道区域能够移除第一流体和第二流体。 第一流体和第二流体的输送与头部的第三导管区域的移除相结合,限定了可控弯液面。