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    • 3. 发明授权
    • Ink jet printer nozzle plate and process therefor
    • 喷墨打印机喷嘴板及其工艺
    • US06409312B1
    • 2002-06-25
    • US09818736
    • 2001-03-27
    • James Michael MrvosCarl Edmond SullivanGary Raymond Williams
    • James Michael MrvosCarl Edmond SullivanGary Raymond Williams
    • B41J204
    • B41J2/1628B41J2/1433B41J2/162B41J2/1623B41J2/1631B41J2/1632B41J2/1634B41J2/1635B41J2/1639B41J2/1645
    • The invention provides a printhead for an ink jet printer and a method for making a printhead for an ink jet printer. The printhead includes a semiconductor substrate containing ink ejection devices and a dry-etched ink via therein. A first photo-imaged polymer layer is applied to the semiconductor substrate, the first photo-imaged polymer layer being patterned and developed to contain ink flow chambers and ink flow channels corresponding to the ink ejection devices on the semiconductor substrate. A second photo-imaged polymer layer is applied to the first photo-imaged polymer layer. The second photo-imaged polymer layer is patterned and developed to contain nozzle holes corresponding to the ink chambers in the first photo-imaged polymer layer and corresponding to the ink ejection devices on the semiconductor substrate. The invention provides increased printhead manufacturing accuracy and elimination of alignment and adhesive attachment of a separate nozzle plate to an ink jet heater chip.
    • 本发明提供了一种用于喷墨打印机的打印头和一种用于制造用于喷墨打印机的打印头的方法。 打印头包括含有喷墨装置的半导体基板和其中经过干蚀刻的墨水通道。 将第一光成像聚合物层施加到半导体衬底上,第一光成像聚合物层被图案化和显影以包含对应于半导体衬底上的喷墨装置的墨流动室和墨流动通道。 将第二光成像聚合物层施加到第一光成像聚合物层。 第二光成像聚合物层被图案化和显影以包含对应于第一光成像聚合物层中的墨室的喷嘴孔,并对应于半导体衬底上的喷墨装置。 本发明提供了增加的打印头制造精度并消除了单独的喷嘴板对喷墨加热器芯片的对准和粘合附着。
    • 5. 发明授权
    • Printhead corrosion protection
    • 打印头防腐蚀
    • US06834937B2
    • 2004-12-28
    • US10218063
    • 2002-08-13
    • Eric Louis KillmeierPaul Timothy SpiveySean Terrence WeaverGary Raymond Williams
    • Eric Louis KillmeierPaul Timothy SpiveySean Terrence WeaverGary Raymond Williams
    • B41J214
    • B41J2/1753B41J2/14072H05K3/28H05K3/361
    • A method for encapsulating electrical traces on a flexible circuit or TAB circuit and electrical connections between the flexible circuit or TAB circuit and a printhead substrate to inhibit ink corrosion thereof. The method includes applying a first adhesive to a first surface of the flexible circuit or TAB circuit. A second adhesive is applied to first surface of the flexible circuit or TAB circuit whereby the first and second adhesives effectively coat exposed portions of the traces and connections. The first and second adhesives are thermally curable epoxy compositions that are miscible with each other and the first adhesive has a first viscosity and first thixotropy index that is lower than a second viscosity second thixotropy index of the second adhesive. After applying the adhesive, the first and second adhesives are cured.
    • 一种用于将电迹线封装在柔性电路或TAB电路上的方法,以及柔性电路或TAB电路与打印头基板之间的电连接以抑制其油墨腐蚀的方法。 该方法包括将第一粘合剂施加到柔性电路或TAB电路的第一表面。 将第二粘合剂施加到柔性电路或TAB电路的第一表面,由此第一和第二粘合剂有效地涂覆迹线和连接的暴露部分。 第一和第二粘合剂是可热固化的环氧组合物,其彼此可混溶,并且第一粘合剂具有低于第二粘合剂的第二粘度秒触变指数的第一粘度和第一触变指数。 在施加粘合剂之后,第一和第二粘合剂被固化。
    • 6. 发明授权
    • Ink jet print head containing a radiation curable resin layer
    • 含有可辐射固化树脂层的喷墨打印头
    • US06193359B1
    • 2001-02-27
    • US09064019
    • 1998-04-21
    • Girish Shivaji PatilPaul Timothy SpiveyGary Raymond Williams
    • Girish Shivaji PatilPaul Timothy SpiveyGary Raymond Williams
    • B41J205
    • B41J2/1603B41J2/1631B41J2/1645B41J2202/03
    • An ink jet print head having ink passage ways formed in a radiation cured resin layer which is attached to a substrate and to a phenoxy butryal surface of a nozzle plate. The passageways are connected in fluid flow communication to an ink discharging outlet provided by an orifice plate. In order to form the passage ways in the resin layer, a resin composition is exposed to a radiation source in a predetermined pattern to cure certain regions of resin layer while other regions which provide the passage ways remain uncured. The uncured regions are removed from the resin layer leaving the desired passage ways. The resin composition to be used for forming the radiation curable layers is a resin composition including: a first difunctional epoxy compound; a second multifunctional crosslinking epoxy compound; a photoinitiator; a reactive silane, and a non-photoreactive.
    • 一种喷墨打印头,其具有形成在辐射固化树脂层中的油墨通道,该辐射固化树脂层附接到基板和喷嘴板的苯氧基丁醛表面。 通道以流体流动连通的方式连接到由孔板提供的排墨口。 为了在树脂层中形成通道,树脂组合物以预定图案暴露于辐射源,以固化树脂层的某些区域,而提供通道的其它区域保持未固化。 从树脂层除去未固化的区域,留下所需的通道。 用于形成可辐射固化层的树脂组合物是一种树脂组合物,其包括:第一双官能环氧化合物; 第二多功能交联环氧化合物; 光引发剂; 反应性硅烷和非光反应性。
    • 9. 发明授权
    • Method for making ink jet printheads
    • 制造喷墨打印头的方法
    • US06852241B2
    • 2005-02-08
    • US09929849
    • 2001-08-14
    • Brian Christopher HartShauna Marie LeisGary Raymond Williams
    • Brian Christopher HartShauna Marie LeisGary Raymond Williams
    • B41J2/16B21D53/76B23P17/00G01D15/00G11B5/127
    • B41J2/1645B41J2/1601B41J2/1623B41J2/1631B41J2/1632B41J2/1635Y10T29/49401
    • The invention provides an improved method for grit blasting slots in a silicon wafer. The method includes, providing a silicon wafer having a first surface and a second surface, the first surface containing resistive, conductive and insulative layers defining individual semiconductor components, applying a first substantially permanent non-water soluble layer selected from silane, photoresist materials and a combination of a silane layer and a photoresist layer to the first surface of the wafer to provide a first substantially permanent layer thereon, applying a water-soluble protective material to the first layer to provide a second layer, grit blasting slots in the wafer corresponding to the individual semiconductor components, and subsequently, removing the water-soluble protective layer from the wafer. The protective layer provides enhanced protection for the electrical components on a silicon wafer during a grit blasting process so that a higher yield of useable semiconductor chips may be made.
    • 本发明提供了一种用于硅晶片中的喷砂槽的改进方法。 该方法包括:提供具有第一表面和第二表面的硅晶片,所述第一表面包含限定各个半导体部件的电阻,导电和绝缘层,施加选自硅烷,光致抗蚀剂材料的第一基本上永久的非水溶性层,以及 将硅烷层和光致抗蚀剂层组合到晶片的第一表面上以在其上提供第一基本上永久的层,向第一层施加水溶性保护材料以提供第二层,在晶片中的喷砂槽对应于 单独的半导体组件,随后从晶片上去除水溶性保护层。 保护层在喷砂处理过程中为硅晶片上的电气部件提供增强的保护,从而可以制造更高的可用半导体芯片的产量。