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1. 发明授权

US08061811B2 Micro-fluid ejection heads with chips in pockets 有权
标题翻译：微型液体喷射头，带有口袋中的芯片
公开(公告)号：US08061811B2
公开(公告)日：2011-11-22
申请号：US11536470
申请日：2006-09-28
申请人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
发明人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
IPC分类号： B41J2/04
CPC分类号： B41J2/14 , B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , Y10T29/49401
摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.
摘要翻译：提供了微流体喷射头和用于制造微流体喷射头的方法，包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。导电材料沉积在衬底的器件表面附近并与芯片电连通。

2. 发明申请

US20080115359A1 High Resistance Heater Material for A Micro-Fluid Ejection Head 审中-公开
标题翻译：微流体喷头的高阻加热材料
公开(公告)号：US20080115359A1
公开(公告)日：2008-05-22
申请号：US11561993
申请日：2006-11-21
申请人： Yimin Guan , Carl Edmond Sullivan
发明人： Yimin Guan , Carl Edmond Sullivan
IPC分类号： B23P17/00 , B41J2/05
CPC分类号： B41J2/14129 , B41J2/1404 , B41J2002/14387 , B41J2202/03 , Y10T29/49401
摘要： A thin film heater for a micro-fluid ejection head and methods for making the thin film heater and for making micro-fluid ejection heads containing the thin film heater. In one embodiment, a thin film heater comprises a tantalum-aluminum-nitride thin film material having a nano-crystalline structure consisting essentially of AlN, TaN, and TaAl alloys. A sheet resistance of the thin film heater ranges from about 100 to about 600 ohms per square. The thin film heater has a thickness ranging from about 100 to about 800 Angstroms and exhibits improved aluminum/silicon diffusion barrier properties.
摘要翻译：用于微流体喷射头的薄膜加热器和用于制造薄膜加热器和用于制造含有薄膜加热器的微流体喷射头的方法。在一个实施例中，薄膜加热器包括具有主要由AlN，TaN和TaAl合金组成的纳米晶体结构的钽 - 氮化铝薄膜材料。薄膜加热器的薄层电阻为约100至约600欧姆/平方。薄膜加热器具有约100至约800埃的厚度，并且具有改善的铝/硅扩散阻挡性能。

3. 发明申请

US20070296767A1 Micro-Fluid Ejection Devices with a Polymeric Layer Having an Embedded Conductive Material 审中-公开
标题翻译：具有嵌入导电材料的聚合物层的微流体喷射装置
公开(公告)号：US20070296767A1
公开(公告)日：2007-12-27
申请号：US11426647
申请日：2006-06-27
申请人： Frank E. Anderson , Yimin Guan , Carl Edmond Sullivan , Timothy Lowell Strunk
发明人： Frank E. Anderson , Yimin Guan , Carl Edmond Sullivan , Timothy Lowell Strunk
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2202/03
摘要： Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.
摘要翻译：微流体喷射装置，用于制造微流体喷射装置的方法以及用于减小用于微流体喷射头的基底的尺寸的方法。一个这样的微流体喷射装置具有邻近基底的聚合物层和嵌入聚合物层中的至少一个导电层。聚合物层包含至少两层聚合材料。

4. 发明授权

US06550893B2 Semiconductor chip for an ink jet printhead and method for making same 有权
公开(公告)号：US06550893B2
公开(公告)日：2003-04-22
申请号：US10047055
申请日：2002-01-14
申请人： James Michael Mrvos , Carl Edmond Sullivan
发明人： James Michael Mrvos , Carl Edmond Sullivan
IPC分类号： B41J2135
CPC分类号： B41J2/1645 , B41J2/14129 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , H01L21/312
摘要： The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.

5. 发明授权

US06449831B1 Process for making a heater chip module 失效
标题翻译：制造加热器芯片模块的过程
公开(公告)号：US06449831B1
公开(公告)日：2002-09-17
申请号：US09099854
申请日：1998-06-19
申请人： Steven Robert Komplin , Ashok Murthy , Carl Edmond Sullivan
发明人： Steven Robert Komplin , Ashok Murthy , Carl Edmond Sullivan
IPC分类号： H05B300
CPC分类号： B41J2/14072 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642 , B41J2/1645 , B41J2/1646 , H01L2224/49171 , H01L2224/8592 , H01L2924/01019 , H01L2924/01021 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , Y10T29/49083 , Y10T29/4913 , Y10T29/49323 , Y10T29/49401 , H01L2924/00
摘要： A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.
摘要翻译：提供了一种用于形成加热器芯片模块的方法，该加热器芯片模块包括适于固定到填充墨水的容器的载体，至少一个加热器芯片，其具有联接到载体的底部，以及耦合到加热器芯片的至少一个喷嘴板。载体包括具有至少一个通道的支撑基板，该通道限定油墨从容器行进到加热器芯片的路径。加热器芯片在其底部固定到支撑基板的一部分。至少所述支撑基板的所述部分由具有与所述加热器芯片基座基本上相同的热膨胀系数的材料形成。柔性电路例如通过TAB键合或引线键合耦合到加热器芯片模块。

6. 发明授权

US06402301B1 Ink jet printheads and methods therefor 有权
标题翻译：喷墨打印头及其方法
公开(公告)号：US06402301B1
公开(公告)日：2002-06-11
申请号：US09698765
申请日：2000-10-27
申请人： James Harold Powers , Carl Edmond Sullivan
发明人： James Harold Powers , Carl Edmond Sullivan
IPC分类号： B41J205
CPC分类号： B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1645 , B41J2/1646
摘要： The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying an etch stop layer to a first surface of the silicon chip having a thickness ranging from about 300 to about 800 microns, dry etching individual ink vias through the thickness of the silicon chip up to the etch stop layer from a surface opposite the first surface and forming holes in the etch stop layer to individually fluidly connect with the ink vias using a mechanical technique. Substantially vertical wall vias are etched through the thickness of the silicon chip using the method. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.
摘要翻译：本发明提供了一种在用于喷墨打印头的半导体硅衬底芯片中制造墨水供给通孔的方法，以及通过该方法制造的含有硅芯片的喷墨打印头。该方法包括将蚀刻停止层施加到厚度范围为约300至约800微米的硅芯片的第一表面上，从相对的表面干燥蚀刻通过硅芯片的厚度直到蚀刻停止层的单个墨通孔第一表面和蚀刻停止层中的形成孔，以使用机械技术单独地与油墨通孔流体连接。使用该方法通过硅芯片的厚度蚀刻基本上垂直的壁通孔。与传统的油墨通孔形成技术相反，该方法显着提高了硅芯片的生产量，并减少了由于断屑和破裂造成的损耗。所得到的芯片对于长期的打印头使用更可靠。

7. 发明授权

US06260957B1 Ink jet printhead with heater chip ink filter 有权
标题翻译：喷墨打印头带加热芯片墨水过滤器
公开(公告)号：US06260957B1
公开(公告)日：2001-07-17
申请号：US09467800
申请日：1999-12-20
申请人： Richard Earl Corley, Jr. , Carl Edmond Sullivan , Paul Timothy Spivey
发明人： Richard Earl Corley, Jr. , Carl Edmond Sullivan , Paul Timothy Spivey
IPC分类号： B41J205
CPC分类号： B41J2/1603 , B41J2/14145 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1634 , B41J2/17563 , B41J2002/14403
摘要： A silicon ink filter for a heater chip of an ink jet printhead is formed by micromachining and laser drilling. The heater chip may contain a plurality of such filters for the plurality of nozzles of the printhead. The filter comprises a via constituting an ink entrance area formed by micromachining and a plurality of bores formed at the exit side of the via produced by laser drilling. Protective layers are preferably disposed over the heater chip substrate prior to micromachining and laser drilling.
摘要翻译：通过微加工和激光钻孔形成用于喷墨打印头的加热器芯片的硅油墨过滤器。加热器芯片可以包含用于打印头的多个喷嘴的多个这样的过滤器。过滤器包括构成通过微加工形成的油墨入口区域的通孔和形成在通过激光钻孔产生的通路的出口侧的多个孔。保护层优选在微加工和激光钻孔之前设置在加热器芯片基板上。

8. 发明授权

US08968527B2 Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters 有权
标题翻译：微流体喷射装置，用于制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头
公开(公告)号：US08968527B2
公开(公告)日：2015-03-03
申请号：US12690955
申请日：2010-02-16
申请人： Yimin Guan , Stuart Jacobsen , Carl Edmond Sullivan
发明人： Yimin Guan , Stuart Jacobsen , Carl Edmond Sullivan
IPC分类号： C23C14/34 , C23C16/00 , B41J2/14
CPC分类号： B41J2/14129 , B41J2202/03 , B41J2202/11 , Y10T29/49401
摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.
摘要翻译：微流体喷射装置，用于制造微流体喷射头的方法和微流体喷射头，包括微流体喷射头。一个这种微流体喷射头具有与基底相邻的相对较高的电阻薄膜加热器。薄膜材料包括硅，金属和碳（SiMC，其中M是金属）。每个薄膜加热器的薄层电阻范围为约100至约600欧姆/平方，厚度范围为约100至约800埃。

9. 发明授权

US08070265B2 Heater stack in a micro-fluid ejection device and method for forming floating electrical heater element in the heater stack 有权
标题翻译：微流体喷射装置中的加热器堆叠和用于在加热器堆叠中形成浮动电加热器元件的方法
公开(公告)号：US08070265B2
公开(公告)日：2011-12-06
申请号：US12345788
申请日：2008-12-30
申请人： Yimin Guan , Zachary Justin Reitmeier , Carl Edmond Sullivan
发明人： Yimin Guan , Zachary Justin Reitmeier , Carl Edmond Sullivan
IPC分类号： B41J2/14 , B41J2/04 , H01L21/3213
CPC分类号： B41J2/1412 , B41J2/1601 , B41J2/1629 , B41J2/1631
摘要： A method for forming a floating heater element includes processing a silicon substrate to form a heater stack having the heater element on the substrate with peripheral edge portions, processing the heater stack by depositing and patterning a layer of photoresist or hard mask thereon to substantially mask the heater stack and form a trench through the photoresist or hard mask exposing a surface area of the substrate extending along the peripheral edge portions of the heater element, and processing the masked heater stack and exposed surface area of the substrate by sequentially removing the photoresist and portions of the substrate at the exposed surface area and that underlie the heater element so as to create a well in the substrate undercutting the heater element and open along the peripheral edge portions thereof, the well being capable of filling with a fluid so as to produce the floating heater element.
摘要翻译：一种用于形成浮动加热元件的方法包括处理硅衬底以形成具有在周边边缘部分的衬底上具有加热器元件的加热器堆叠，通过在其上沉积和图案化一层光致抗蚀剂或硬掩模来对加热器堆叠进行处理以基本上掩盖加热器堆叠并通过光致抗蚀剂或硬掩模形成沟槽，暴露沿着加热器元件的周边边缘部分延伸的衬底的表面区域，并且通过顺序地除去光致抗蚀剂和部分来处理掩模加热器堆叠和暴露的衬底表面区域在基板的暴露的表面区域，并且位于加热器元件的下面，以便在底板上形成一个凹槽，该底板使加热器元件沿其周缘部分开口，并且能够填充流体，从而产生浮动加热元件。

10. 发明授权

US07922297B2 Ink ejection device including a silicon chip having a heater stack positioned over a corresponding power transistor 有权
标题翻译：喷墨装置包括具有位于相应的功率晶体管上的加热器堆的硅芯片
公开(公告)号：US07922297B2
公开(公告)日：2011-04-12
申请号：US11958876
申请日：2007-12-18
申请人： Yimin Guan , Kristi Maggard Rowe , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Yimin Guan , Kristi Maggard Rowe , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1642 , B41J2/1645 , B41J2002/14387 , B41J2202/13
摘要： A silicon chip has a plurality of ink jetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.
摘要翻译：硅芯片具有多个喷墨结构。多个喷墨结构的每个喷墨结构包括具有电加热器元件的加热器堆叠。功率晶体管电连接到电加热元件。平坦化层介于功率晶体管和加热器叠层之间。平坦化层具有形成加热器叠层的平面基面。

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