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    • 3. 发明授权
    • Method for making a printhead
    • 制造打印头的方法
    • US6071427A
    • 2000-06-06
    • US89711
    • 1998-06-03
    • Michael Raulinaitis
    • Michael Raulinaitis
    • B41J2/14B41J2/16B41J2/035G11B5/127H01R34/00
    • B41J2/14072B41J2/14024B41J2/1601B41J2/1623B41J2/1626B41J2/1631B41J2/1634B41J2/1643
    • The invention described in the specification relates to an improved method for making a printhead for an ink jet printer. In the method, one or more semiconductor substrates containing energy imparting devices for ink and electrical conductors for the energy imparting devices are attached to a metal substrate carrier. A conductive layer containing electrical tracing terminating in contact pads is also attached to the carrier using an adhesive. A nozzle plate is attached to the conductive layer and to the semiconductor substrate also using an adhesive. The nozzle plate, conductive layer and adhesive all have openings or windows therein for use in forming wire bonds between the semiconductor substrate and the conductive layer. Once the wire bonds having loops are formed, the wire loops are depressed toward the nozzle plate to reduce the height of the loops above the nozzle plate. The entire wires and bonds are then encapsulated in a elastomeric, insulative material to protect the wires. An advantage of the depressed wire loops is that the encapsulating material layer may be relatively thin so that it does not extend above the exposed surface of the nozzle plate more than about 15 mils thereby providing maximum clearance between the printhead a media to be printed.
    • 本说明书中描述的本发明涉及一种用于制造用于喷墨打印机的打印头的改进方法。 在该方法中,一个或多个含有能量赋予装置的能量赋予装置的半导体基板和能量赋予装置的电导体被附着到金属基板载体上。 包含端接在接触垫中的电迹线的导电层也使用粘合剂附着到载体上。 喷嘴板也使用粘合剂附着到导电层和半导体衬底上。 喷嘴板,导电层和粘合剂都具有用于在半导体衬底和导电层之间形成引线接合的开口或窗口。 一旦形成了具有环的线接合,则线圈朝向喷嘴板压下,以减小喷嘴板上方的环的高度。 然后将整个电线和接合件封装在弹性体绝缘材料中以保护电线。 凹陷的线环的优点在于,封装材料层可以相对较薄,使得其不会在喷嘴板的暴露表面上方超过大约15密耳,从而在打印头之间提供打印头上要打印的介质之间的最大间隙。