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1. 发明申请

WO2007117446A3 INTEGRATED FLUID PUMP AND RADIATOR RESERVOIR 审中-公开
公开(公告)号：WO2007117446A3
公开(公告)日：2007-10-18
申请号：PCT/US2007/008277
申请日：2007-03-30
申请人： COOLIGY, INC. , CONWAY, Bruce, R. , TSAO, Paul , LIN, Eric , CHOW, Norman
发明人： CONWAY, Bruce, R. , TSAO, Paul , LIN, Eric , CHOW, Norman
IPC分类号： F28F7/00
摘要： An integrated pumping assembly includes a pump coupled to a heat exchanging device via a mounting plate. The mounting plate is sealed to the heat exchanging device. The heat exchanging device is any fluid-based heat exchanging device, such as a fluid radiator configured to operate as a heat rejector or a heat exchanger configured to remove heat from a heat generating device. The pump is mounted directly to the mounting plate. A mounting mechanism compresses the pump housing and the mounting plate. One or more sealing washers, such as o-rings, are positioned between the pump housing and the mounting plate. The pump, mounting plate, and the heat exchanging device are aligned such that an opening in the pump housing, an opening in the mounting plate, and an opening in the housing of the heat exchanging device are aligned to form a sealed fluid path through which fluid is exchanged between the pump and the heat exchanging device.

2. 发明申请

WO2007098077A2 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
标题翻译：液体冷却液用于服务器应用
公开(公告)号：WO2007098077A2
公开(公告)日：2007-08-30
申请号：PCT/US2007/004236
申请日：2007-02-16
申请人： COOLIGY, INC. , UPADHYA, Girish , MUNCH, Mark , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
发明人： UPADHYA, Girish , MUNCH, Mark , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

3. 发明申请

WO2007098078A3 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
公开(公告)号：WO2007098078A3
公开(公告)日：2007-08-30
申请号：PCT/US2007/004237
申请日：2007-02-16
申请人： COOLIGY, INC. , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , UPADHYA, Girish , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
发明人： CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , UPADHYA, Girish , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
IPC分类号： H05K7/20 , H05K5/00
摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

4. 发明申请

WO2006074353A2 FABRICATION OF HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATIONS IN MICROHEAT EXCHANGERS FOR LIQUID COOLING SYSTEMS 审中-公开
标题翻译：制造高表面量的比例结构及其在液体冷却系统的微波炉交换器中的集成
公开(公告)号：WO2006074353A2
公开(公告)日：2006-07-13
申请号：PCT/US2006/000434
申请日：2006-01-06
申请人： COOLIGY, INC. , DATTA, Madhav , MCMASTER, Mark , BREWER, Rick , ZHOU, Peng , TSAO, Paul , UPADHAYA, Girish , MUNCH, Mark
发明人： DATTA, Madhav , MCMASTER, Mark , BREWER, Rick , ZHOU, Peng , TSAO, Paul , UPADHAYA, Girish , MUNCH, Mark
IPC分类号： F28F7/00
CPC分类号： F28F7/02 , F28F3/086 , F28F2260/02
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

5. 发明申请

WO2005122662A3 SEMI-COMPLIANT JOINING MECHANISM FOR SEMICONDUCTOR COOLING APPLICATIONS 审中-公开
公开(公告)号：WO2005122662A3
公开(公告)日：2005-12-22
申请号：PCT/US2005/016879
申请日：2005-05-12
申请人： COOLIGY, INC. , BREWER, Richard, G. , TSAO, Paul , HERMS, Richard , MUNCH, Mark , MCMASTER, Mark , CORBIN, Dave
发明人： BREWER, Richard, G. , TSAO, Paul , HERMS, Richard , MUNCH, Mark , MCMASTER, Mark , CORBIN, Dave
IPC分类号： H05K7/20
摘要： A heat coolection apparatus (100) is mounted to the heat source (20) using a gimbal plate (150) which includes a gimbal joint (301).

6. 发明申请

WO2005122661A3 APPARATUS AND METHOD OF EFFICIENT FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE 审中-公开
公开(公告)号：WO2005122661A3
公开(公告)日：2005-12-22
申请号：PCT/US2005/016680
申请日：2005-05-12
申请人： COOLIGY, INC. , BREWER, Richard, G. , UPADHYA, Ginsh , ZHOU, Peng , MCMASTER, Mark , TSAO, Paul
发明人： BREWER, Richard, G. , UPADHYA, Ginsh , ZHOU, Peng , MCMASTER, Mark , TSAO, Paul
IPC分类号： F28F7/00
摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.

7. 发明申请

WO2007130557A2 METHODOLOGY FOR THE LIQUID COOLING OF HEAT GENERATING COMPONENTS MOUNTED ON A DAUGHTER CARD/EXPANSION CARD IN A PERSONAL COMPUTER THROUGH THE USE OF A REMOTE DRIVE BAY HEAT EXCHANGER WITH A FLEXIBLE FLUID INTERCONNECT 审中-公开
标题翻译：通过使用带有灵活流体互连的远程驱动槽热交换器在个人计算机上安装的热量卡片/扩展卡上的热发生部件的液体冷却方法
公开(公告)号：WO2007130557A2
公开(公告)日：2007-11-15
申请号：PCT/US2007/010807
申请日：2007-05-04
申请人： COOLIGY INC. , CONWAY, Bruce , BREWER, Richard, Grant , TSAO, Paul , HOM, James , WERNER, Douglas, E. , ZHOU, Peng , UPADHYA, Girish , DATTA, Madhav , FIROUZI, Ali , LANDRY, Fredric
发明人： CONWAY, Bruce , BREWER, Richard, Grant , TSAO, Paul , HOM, James , WERNER, Douglas, E. , ZHOU, Peng , UPADHYA, Girish , DATTA, Madhav , FIROUZI, Ali , LANDRY, Fredric
IPC分类号： G05D23/00 , H01L23/467
CPC分类号： G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A cooling system includes a cooling unit configured to fit within a single drive bay of a personal computer. The cooling unit includes a fluid-to-air heat exchanger, an air mover, a pump, fluid lines, and control circuitry. The cooling system also includes a cooling loop configured to be coupled to one or more heat generating devices. The cooling loop includes the pump and the fluid-to-air heat exchanger from the cooling unit, and at least one heat exchanger coupled together via flexible fluid lines. The heat exchanger is thermally coupled to the heat generating device. The cooling unit is configured to maintain noise below a specified acoustical specification. To meet this acoustical specification, the size, position, and type of the components within the cooling unit are specifically configured.
摘要翻译：冷却系统包括被配置为装配在个人计算机的单个驱动器托架内的冷却单元。冷却单元包括流体对空气热交换器，鼓风机，泵，流体管线和控制电路。冷却系统还包括被配置为联接到一个或多个发热装置的冷却回路。冷却回路包括来自冷却单元的泵和流体对空气热交换器，以及通过柔性流体管线连接在一起的至少一个热交换器。热交换器热耦合到发热装置。冷却单元被配置为将噪声保持在低于规定声学规范的范围内。为了达到这种声学规格，冷却装置内的部件的尺寸，位置和类型被特别地配置。

8. 发明申请

WO2007120530A2 INTEGRATED LIQUID TO AIR CONDUCTION MODULE 审中-公开
标题翻译：集成液体到空气导流模块
公开(公告)号：WO2007120530A2
公开(公告)日：2007-10-25
申请号：PCT/US2007/008190
申请日：2007-03-30
申请人： COOLIGY, INC. , HOM, James , UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark , TSAO, Paul , CONWAY, Bruce , ZHOU, Peng , BREWER, Richard
发明人： HOM, James , UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark , TSAO, Paul , CONWAY, Bruce , ZHOU, Peng , BREWER, Richard
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。储存器可以连接到流体路径。

9. 发明申请

WO2008137143A1 MICRO-TUBE/MULTI-PORT COUNTER FLOW RADIATOR DESIGN FOR ELECTRONIC COOLING APPLICATIONS 审中-公开
标题翻译：用于电子冷却应用的微管/多端口对流式散热器设计
公开(公告)号：WO2008137143A1
公开(公告)日：2008-11-13
申请号：PCT/US2008/005781
申请日：2008-05-02
申请人： COOLIGY INC. , HOM, James , UPADHYA, Girish , ZHOU, Peng , TSAO, Paul , LANDRY, Frederic
发明人： HOM, James , UPADHYA, Girish , ZHOU, Peng , TSAO, Paul , LANDRY, Frederic
IPC分类号： F28D1/04
CPC分类号： F28D1/05391 , F28D1/0435
摘要： A counter flow radiator includes multiple layered cooling cores configured in series along a first direction that is the same as the direction of airflow used to cool fluid flowing through the counter flow radiator. Heated fluid inputs the counter flow radiator at a first end and flows through each cooling core in a serpentine-like path to the second end of the counter flow radiator, effectively progressing in a direction opposite that of the airflow.
摘要翻译：逆流式散热器包括沿着第一方向串联构造的多层冷却芯，其与用于冷却流过逆流式散热器的流体的冷却方向相同。加热流体在第一端处输入逆流式散热器，并且以对应流动式散热器的第二端的蛇形状路径流过每个冷却芯，有效地沿与气流相反的方向前进。

10. 发明申请

WO2012061323A1 THERMAL INTERLOCK FOR BATTERY PACK, DEVICE, SYSTEM AND METHOD 审中-公开
标题翻译：用于电池组，装置，系统和方法的热互锁
公开(公告)号：WO2012061323A1
公开(公告)日：2012-05-10
申请号：PCT/US2011/058659
申请日：2011-10-31
申请人： SINOELECTRIC POWERTRAIN CORPORATION , ZHOU, Peng , TSAO, Paul , PARISEAU, David Kevin
发明人： ZHOU, Peng , TSAO, Paul , PARISEAU, David Kevin
IPC分类号： H01M10/48
CPC分类号： H01M10/486 , H01M2200/105 , H01M2200/106
摘要： Faulty battery detecting and locating devices and methods are able to detect and locate a faulty battery cell. The device applies an energy to a sensing member, such as a polymeric tube containing at least two polymer-coated and twisted electric wires. Heat that is generated by a faulty battery triggers an electric communication between the two electric wires by melting at least a portion of the polymer. The resulting change in resistance between the two electric wires is used to detect and locate a faulty battery.
摘要翻译：电池检测和定位装置和方法有故障的电池单元能够检测和定位故障。该装置将能量施加到感测构件，例如包含至少两个聚合物涂覆和扭曲的电线的聚合物管。由故障电池产生的热量通过熔化聚合物的至少一部分而触发两条电线之间的电连通。由此产生的两根电线之间的电阻变化用于检测和定位故障电池。

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