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1. 发明申请

WO2008137143A1 MICRO-TUBE/MULTI-PORT COUNTER FLOW RADIATOR DESIGN FOR ELECTRONIC COOLING APPLICATIONS 审中-公开
标题翻译：用于电子冷却应用的微管/多端口对流式散热器设计
公开(公告)号：WO2008137143A1
公开(公告)日：2008-11-13
申请号：PCT/US2008/005781
申请日：2008-05-02
申请人： COOLIGY INC. , HOM, James , UPADHYA, Girish , ZHOU, Peng , TSAO, Paul , LANDRY, Frederic
发明人： HOM, James , UPADHYA, Girish , ZHOU, Peng , TSAO, Paul , LANDRY, Frederic
IPC分类号： F28D1/04
CPC分类号： F28D1/05391 , F28D1/0435
摘要： A counter flow radiator includes multiple layered cooling cores configured in series along a first direction that is the same as the direction of airflow used to cool fluid flowing through the counter flow radiator. Heated fluid inputs the counter flow radiator at a first end and flows through each cooling core in a serpentine-like path to the second end of the counter flow radiator, effectively progressing in a direction opposite that of the airflow.
摘要翻译：逆流式散热器包括沿着第一方向串联构造的多层冷却芯，其与用于冷却流过逆流式散热器的流体的冷却方向相同。加热流体在第一端处输入逆流式散热器，并且以对应流动式散热器的第二端的蛇形状路径流过每个冷却芯，有效地沿与气流相反的方向前进。

2. 发明申请

WO2007098077A2 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
标题翻译：液体冷却液用于服务器应用
公开(公告)号：WO2007098077A2
公开(公告)日：2007-08-30
申请号：PCT/US2007/004236
申请日：2007-02-16
申请人： COOLIGY, INC. , UPADHYA, Girish , MUNCH, Mark , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
发明人： UPADHYA, Girish , MUNCH, Mark , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

3. 发明申请

WO2007098078A3 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
公开(公告)号：WO2007098078A3
公开(公告)日：2007-08-30
申请号：PCT/US2007/004237
申请日：2007-02-16
申请人： COOLIGY, INC. , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , UPADHYA, Girish , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
发明人： CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , UPADHYA, Girish , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
IPC分类号： H05K7/20 , H05K5/00
摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

4. 发明公开

EP1989935A2 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
标题翻译：液体冷却回路的服务器应用程序
公开(公告)号：EP1989935A2
公开(公告)日：2008-11-12
申请号：EP07751026.1
申请日：2007-02-16
申请人： Cooligy, Inc.
发明人： UPADHYA, Girish , MUNCH, Mark , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

5. 发明授权

EP1987309B1 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 有权转让
标题翻译：液体冷却回路的服务器应用程序
公开(公告)号：EP1987309B1
公开(公告)日：2014-04-16
申请号：EP07751027.9
申请日：2007-02-16
申请人： Cooligy, Inc.
发明人： CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , UPADHYA, Girish , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00

6. 发明公开

EP1987309A2 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 有权转让
标题翻译：用于服务器应用的液体冷却回路
公开(公告)号：EP1987309A2
公开(公告)日：2008-11-05
申请号：EP07751027.9
申请日：2007-02-16
申请人： Cooligy, Inc.
发明人： CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , UPADHYA, Girish , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
IPC分类号： F28F1/08
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.
摘要翻译：安装系统提供了一种机制和形式因素，用于将来自服务器机架的热交换器与来自电子服务器的热交换器热接触。为确保良好的热接触，在两个热交换器，排除板和机箱冷板之间施加压力。用于接合和脱离热交换器的安装机构被配置为隔离施加到两个热交换器的力。安装机构包括联锁机构，该联锁机构防止所施加的力传递到电子服务器的其余部分。在不隔离该力的情况下，该力被施加到电子服务器和/或机架底盘，可能断开电子服务器和机架之间的电连接，并且向电子服务器和机架底盘提供机械应力。安装机构也耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。这是一个故障安全程序，因为不需要单独的过程来启用电子服务器冷却回路。

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