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1. 发明专利

JP2006049861A Interwoven manifold for pressure drop reduction in microchannel heat exchanger 审中-公开
标题翻译：用于微通道热交换器中压降减压的INTERWOVEN MANIFOLD
公开(公告)号：JP2006049861A
公开(公告)日：2006-02-16
申请号：JP2005190794
申请日：2005-06-29
申请人： Cooligy Inc , クーリギーインコーポレイテッド
发明人： KENNY THOMAS W , MUNCH MARK , ZHOU PENG , SHOOK JAMES G , UPADHYA GIRISH , GOODSON KENNETH , CORBIN DAVID
IPC分类号： H01L23/36 , F04B19/00 , F28D15/02 , F28F3/12 , H01L23/473
CPC分类号： H01L23/473 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F13/185 , F28F2260/02 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a microchannel heat exchanger which realizes appropriate temperature uniformity in a heat source, in particular a heat exchanger capable of reducing the pressure drop between inlet and outlet fluid ports. SOLUTION: The microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprises a first set of fingers 118B, 118C for feeding fluid of a first temperature to a heat exchange region. The fluid in the heat exchange region flows toward a second set of fingers 118E, 118F, and exits from the heat exchanger at a second temperature. Each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and is arranged in parallel. A manifold layer 106 includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. The configuration and dimensions of the fingers 118 are determined depending on the hot spots of the heat source which is an electron device 99 which needs to be cooled. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种微通道热交换器，其在热源中实现适当的温度均匀性，特别是能够减少入口和出口流体端口之间的压降的热交换器。解决方案：耦合到热源并被配置用于冷却热源的微通道热交换器包括用于将第一温度的流体供给到热交换区域的第一组指状物118B，118C。热交换区中的流体流向第二组指状物118E，118F，并在第二温度从热交换器排出。每个手指与相邻的手指分开适当的尺寸以最小化热交换器中的压降并平行布置。歧管层106包括第一组指状物，第二组指状物构造成用于冷却热源中的热点。指状物118的构造和尺寸取决于作为需要冷却的电子器件99的热源的热点。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2009170877A Apparatus and method for preventing cracking, and proof-freezing heat exchange apparatus 审中-公开
标题翻译：用于防止破裂的装置和方法和防冻冷热交换装置
公开(公告)号：JP2009170877A
公开(公告)日：2009-07-30
申请号：JP2008275611
申请日：2008-10-27
申请人： Cooligy Inc , クーリギーインコーポレイテッド
发明人： UPADHYA GIRISH , BREWER RICHARD GRANT , MCMASTER MARK
IPC分类号： H05K7/20
CPC分类号： F28F19/006 , F28D15/00 , F28F3/12 , F28F2265/14 , H01L23/473 , H01L2924/0002 , H05K7/20272 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent cracking in a liquid system. SOLUTION: A cracking preventing apparatus includes an enclosure and a compressible object immersed in the enclosure. The enclosure includes a plurality of zones having different frozenness. The enclosure is configured such that freezing begins at a high frozenness zone, and then the leading edge of freezing advances toward a low frozenness zone via one or more zones through which the freezing speed decreases gradually. A fluid begins to freeze at the high frozenness zone, and advances towards the one or more compressible objects. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了防止液体系统中的开裂。解决方案：防裂装置包括外壳和浸在外壳中的可压缩物体。外壳包括具有不同冷冻度的多个区域。外壳被配置为使得在高度冻结区域开始冷冻，然后冷冻前缘经由一个或多个冷冻速度逐渐降低的区域朝向低冷冻区域前进。流体开始在高度冻结区冻结，并向着一个或多个可压缩物体前进。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008111653A Cooler 审中-公开
标题翻译： COOLER
公开(公告)号：JP2008111653A
公开(公告)日：2008-05-15
申请号：JP2007270407
申请日：2007-10-17
申请人： Cooligy Inc , クーリギーインコーポレイテッド
发明人： KENNY THOMAS W , MUNCH MARK , ZHOU PENG , SHOOK JAMES G , GOODSON KENNETH , CORBIN DAVID , MCMASTER MARK , LOVETTE JAMES
IPC分类号： F25B21/02 , H01L35/30
CPC分类号： F28F2260/02
摘要： PROBLEM TO BE SOLVED: To provide a cooling method and a cooler for cooling a heat source. SOLUTION: This cooler is provided with a fluid heat exchanger, a pump, a thermoelectric device having a cooling portion and a heating portion, and a heat removing device contacting thermally with at least a portion of the heating portion of the thermoelectric device. The pump is connected to the fluid heat exchanger to make a fluid flow therethrough. The thermoelectric device is cooperated with the heat exchanger in the cooler to enhance the cooling efficiency of a cooling system. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于冷却热源的冷却方法和冷却器。解决方案：该冷却器设置有流体热交换器，泵，具有冷却部分和加热部分的热电装置，以及与热电装置的加热部分的至少一部分热接触的散热装置。泵连接到流体热交换器以使流体流过其中。热电装置与冷却器中的热交换器配合以提高冷却系统的冷却效率。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2006086503A Method and equipment for efficient perpendicular fluid transfer for cooling exoergic device 审中-公开
标题翻译：用于冷却外部设备的高效液相转移的方法和设备
公开(公告)号：JP2006086503A
公开(公告)日：2006-03-30
申请号：JP2005190796
申请日：2005-06-29
申请人： Cooligy Inc , クーリギーインコーポレイテッド
发明人： KENNY THOMAS W , MUNCH MARK , ZHOU PENG , SHOOK JAMES G , UPADHYA GIRISH , GOODSON KENNETH , CORBIN DAVID , MCMASTER MARK , LOVETTE JAMES
IPC分类号： H01L23/427 , F04B17/00 , F04B19/00 , F28D15/00 , F28D15/02 , F28F3/02 , F28F3/08 , F28F3/12 , F28F13/18 , G06Q20/00 , H01L23/473 , H04L29/06 , H05K7/20
CPC分类号： H01L23/4735 , F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F7/02 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2260/02 , G06F1/20 , G06Q20/20 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat exchanger capable of reducing pressure drop between an inlet port and an outlet port. SOLUTION: A heat exchanger and the method of manufacturing the same comprise a contact layer 102 for cooling a heat source. The contact layer is connected with a heat source 99. The contact layer is structured such that fluid can be flown. Further, the heat exchanger comprises a manifold layer 106 connected with the contact layer. The manifold layer is connected with the first group of individualized holes. The manifold layer comprises at least one first port 108 for circulating fluid via the first group. Further, the manifold layer is connected with the second group of individualized holes. The manifold layer comprises at least one second port 109 for circulating fluid via the second group. The holes of the first and second groups are arranged such that the shortest flow path between the first and second ports is realized in order to cool the heat source appropriately. Each of the holes of the first group is desirably arranged at the smallest optimal interval with respect to each of the holes of the second group. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够减少入口和出口之间的压降的热交换器。解决方案：热交换器及其制造方法包括用于冷却热源的接触层102。接触层与热源99连接。接触层的结构使得可以流动流体。此外，热交换器包括与接触层连接的歧管层106。歧管层与第一组个体化孔连接。歧管层包括用于使流体经由第一组循环的至少一个第一端口108。此外，歧管层与第二组个体化孔连接。歧管层包括用于经由第二组循环流体的至少一个第二端口109。第一组和第二组的孔布置成使得第一和第二端口之间的最短流动路径被实现以适当地冷却热源。第一组的每个孔期望地相对于第二组的每个孔布置在最小的最佳间隔。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006054434A Method and apparatus for flexibly transferring fluid for cooling desired hot spot in heat generating device 审中-公开
标题翻译：用于冷却热发生装置中所需热点的柔性传输流体的方法和装置
公开(公告)号：JP2006054434A
公开(公告)日：2006-02-23
申请号：JP2005190795
申请日：2005-06-29
申请人： Cooligy Inc , クーリギーインコーポレイテッド
发明人： KENNY THOMAS W , MUNCH MARK , ZHOU PENG , SHOOK JAMES G , UPADHYA GIRISH , GOODSON KENNETH , CORBIN DAVID
IPC分类号： H01L23/473 , F25D9/00 , F28D15/02 , G05D23/00
CPC分类号： F28F3/048 , F28D15/0266 , F28F3/12 , F28F2260/02 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for flexibly transferring fluids that can cool a desired hot spot in an electronic device while maintaining the minimum level of pressure drop in a heat exchanger. SOLUTION: As for the heat exchanger and its manufacturing method, there are a contact layer which has been connected to a heat source and configured in a way that fluids can be flowed, a contact layer with an adequate thermal conductivity, and a manifold layer that provides the fluids to the contact layers. It is preferable to configure the manifold in a way that the temperature of the heat source can be evened by cooling the hot spot area of the contact layer. For example, the heat exchanger is provided with multiple fluid ports such as the inlet port and outlet port and the fluid ports are configured vertically and horizontally. The manifold layer circulates the fluids to the hot spot area of a predetermined contact layer of the host spot related contact layers. It is preferable not only to place the heat exchanger between the contact and manifold layers but also to have an intermediate layer for optimally transferring the fluids to the hot spot of the contact layer. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于柔性转移流体的方法和装置，其可以冷却电子设备中的期望热点，同时保持热交换器中的最小压降水平。解决方案：对于热交换器及其制造方法，存在已经连接到热源并且以流体流动的方式配置的接触层，具有足够导热性的接触层，以及将流体提供给接触层的歧管层。优选的是，通过冷却接触层的热点区域，可以使得热源的温度能够均匀化。例如，热交换器设置有多个流体端口，例如入口和出口，并且流体端口被垂直和水平地配置。歧管层将流体循环到主体点相关接触层的预定接触层的热点区域。优选地，不仅将热交换器放置在接触层和歧管层之间，而且还具有用于将流体最佳地转移到接触层的热点的中间层。版权所有（C）2006，JPO＆NCIPI

6. 发明申请

US20040188064A1 Channeled flat plate fin heat exchange system, device and method 有权
标题翻译：通风平板翅片换热系统，装置及方法
公开(公告)号：US20040188064A1
公开(公告)日：2004-09-30
申请号：US10699505
申请日：2003-10-30
申请人： Cooligy Inc.
发明人： Girish Upadhya , Richard Herms , Peng Zhou , Kenneth Goodson
IPC分类号： H05K007/20
CPC分类号： F28F3/02 , F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F2210/10 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfer area per unit volume. The device comprises a highly thermally conductive material, preferably with less than 200 W/m-K. The preferred channel heat exchanger comprises two coupled flat plates and a plurality of fins coupled to the flat plates. At least one of the plates preferably to receive flow of a fluid in a heated state. The fluid preferably carries heat from a heat source (such as a CPU, for example). Specifically, at least one of the plates preferably comprises a plurality of condenser channels configured to receive, to condense, and to cool the fluid in the heated state. The fluid in a cooler state is preferably carried from the device to the heat source, thereby cooling the heat source.
摘要翻译：公开了一种用于流体冷却通道式热交换装置的装置，方法和系统。流体冷却通道热交换装置利用通过通道热交换器循环的流体，用于高散热和每单位体积的传递面积。该装置包括高导热性材料，优选小于200W / m-K。优选的通道热交换器包括两个联接的平板和耦合到平板的多个翅片。至少一个板优选地接收处于加热状态的流体的流动。流体优选地承载来自热源（例如CPU）的热量。具体地，至少一个板优选地包括多个冷凝器通道，其构造成在加热状态下接收，冷凝和冷却流体。处于较冷状态的流体优选从装置运送到热源，从而冷却热源。

7. 发明申请

US20040252535A1 Apparatus for conditioning power and managing thermal energy in an electronic device 有权
标题翻译：用于调节电力和管理电子设备中的热能的装置
公开(公告)号：US20040252535A1
公开(公告)日：2004-12-16
申请号：US10882475
申请日：2004-06-30
申请人： Cooligy, Inc.
发明人： Thomas William Kenny JR. , Kenneth E. Goodson , Juan G. Santiago , George Carl Everett JR.
IPC分类号： H02M001/00
CPC分类号： G06F1/26 , H01L23/34 , H01L23/473 , H01L23/49827 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13025 , H01L2224/16 , H01L2924/19105 , H01L2924/00014
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.
摘要翻译：一方面，本发明是一种用于调节消耗装置的功率的技术和系统。在这方面，固定到集成电路装置的功率调节模块调节要施加到集成电路装置的功率。功率调节模块包括具有第一接口和第二接口的半导体衬底，其中第一接口与第二接口相对。所述功率调节模块还包括多个接口通路，以在所述第一接口和所述第二接口之间提供电连接，以及设置在所述第一接口上的第一组焊盘以及设置在所述第二接口上的第二组焊盘。每个焊盘连接到第一或第二接口上的对应的一个接口通孔。功率调节模块还包括设置在半导体衬底内的电路，以调节要施加到集成电路器件的功率。电路可以设置在第一接口，第二接口或两个接口上。此外，电路包括至少一个电压调节器和至少一个电容器。

8. 发明申请

US20040244950A1 Optimized multiple heat pipe blocks for electronics cooling 有权
标题翻译：优化多个热管块用于电子冷却
公开(公告)号：US20040244950A1
公开(公告)日：2004-12-09
申请号：US10440363
申请日：2003-05-16
申请人： Cooligy, Inc.
发明人： Peng Zhou , Dolf van Der Heide , Kenneth Goodson , Girish Upadhya
IPC分类号： F28D015/00
CPC分类号： F04B17/00 , F28D15/0266 , F28D20/026 , F28F23/00 , F28F2210/08 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for removing heat from a heat generating device is disclosed. The apparatus comprises a plate thermally coupled to the heat generating device and thermally coupled to two beat pipes wherein each heat pipe is configured to have a predetermined boiling point temperature selected according to design criteria. The apparatus can include one or more additional heat pipes coupled to the plate. The apparatus can include a heat spreader, wherein the heat spreader is in thermal contact with the heat generating device and with at least one of the heat pipes. The heat pipes can differ in outer cross-sectional dimensions depending on thermal distance position relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.
摘要翻译：公开了一种用于从发热装置中除热的装置。该装置包括热耦合到发热装置并热耦合到两个打浆管的板，其中每个热管被配置成具有根据设计标准选择的预定沸点温度。该装置可以包括耦合到该板的一个或多个附加热管。该装置可以包括散热器，其中散热器与发热装置和至少一个热管热接触。热管可以根据相对于发热装置的热距离位置的外截面尺寸不同，使得位于与发热装置更远的热距离的热管具有比位于的热管更小的外横截面尺寸距离发热装置的热距离更短。

9. 发明申请

US20040206477A1 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device 有权
标题翻译：用于冷却发热装置的有效的垂直流体输送的方法和装置
公开(公告)号：US20040206477A1
公开(公告)日：2004-10-21
申请号：US10680584
申请日：2003-10-06
申请人： Cooligy, Inc.
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： F28F007/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
摘要翻译：热交换器及其制造方法包括用于冷却热源的界面层。界面层耦合到热源并被配置成使流体从中流过。热交换器还包括耦合到界面层的歧管层。歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

10. 发明申请

US20040112571A1 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device 审中-公开
标题翻译：用于冷却发热装置的有效的垂直流体输送的方法和装置
公开(公告)号：US20040112571A1
公开(公告)日：2004-06-17
申请号：US10698179
申请日：2003-10-30
申请人： Cooligy, Inc.
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette , James Hom
IPC分类号： F28F007/00 , F28F013/18 , F28F019/02
CPC分类号： H01L23/473 , F04B17/00 , F04B19/006 , F25B21/02 , F25B2321/0252 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , G06F1/20 , G06F2200/201 , G06Q20/20 , H01L23/38 , H01L23/4735 , H01L35/30 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for cooling a hat source configured along a lane. The heat exchanger comprises an interface layer that perform thermal exchanger with the heat source and configured to pass fluid from a first side to a second side. The manifold layer comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer couple to the first layer and in contact with the second side of the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.
摘要翻译：一种用于冷却沿着车道配置的帽子源的方法和装置。热交换器包括界面层，该界面层与热源一起执行热交换器，并被配置为将流体从第一侧传送到第二侧。歧管层包括与热源接触的第一层，并且具有适当的导热性以将热量传递到界面层。歧管层还包括与第一层耦合并与界面层的第二侧接触的第二层。第一层包括具有与热交换层接触的导热区域的凹部区域。第一层包括至少一个入口和/或出口。第二层包括至少一个入口和/或出口。至少一个入口端口和/或出口端口相对于该平面基本平行或垂直地定位。

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