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1. 发明申请

WO2010076990A3 COMPOSITIONS FOR AN ANISOTROPIC CONDUCTIVE FILM, AND ANISOTROPIC CONDUCTIVE FILM USING SAME 审中-公开
标题翻译：用于各向异性导电膜的组合物以及使用相同导电膜的各向异性导电膜
公开(公告)号：WO2010076990A3
公开(公告)日：2010-09-23
申请号：PCT/KR2009007519
申请日：2009-12-16
申请人： CHEIL IND INC , HWANG JA YOUNG , UH DONG SEON , PARK JIN SEONG , KANG JEONG KU , LEE TAE HYUN , KIM HYOUN YOUNG , BAE SANG SIK
发明人： HWANG JA YOUNG , UH DONG SEON , PARK JIN SEONG , KANG JEONG KU , LEE TAE HYUN , KIM HYOUN YOUNG , BAE SANG SIK
IPC分类号： C08L67/00 , C08J5/18 , C08K7/16 , C08L83/04
CPC分类号： C08J5/18 , C08G77/445 , C08J2333/06 , C08J2367/00 , C08K3/013 , C08L33/06 , C08L67/00 , C08L83/06 , H05K3/323 , H05K2201/0145 , H05K2201/0162 , C08L2666/04
摘要： Compositions for an anisotropic conductive film of the present invention comprise binder resins, curable ingredients, and conductive particles, wherein said binder resins contain polyester-polysiloxane copolymers. The compositions for an anisotropic conductive film have superior fluidity and initial adhesion, and prevent the film from being peeled off from a variety of objects and thus maintain the initial outer appearance even when the film is used over a long period of time under high temperature/high humidity and thermal impact conditions. The compositions of the present invention have a high reliability against connection resistance. Therefore, the compositions of the present invention improve the reliability of a variety of display devices, and can be widely utilized as compositions for a variety of adhesives.
摘要翻译：本发明的各向异性导电膜的组合物包含粘合剂树脂，可固化成分和导电粒子，其中所述粘合剂树脂含有聚酯 - 聚硅氧烷共聚物。用于各向异性导电膜的组合物具有优异的流动性和初始粘合性，并且防止膜从各种物体上剥离，因此即使在高温/高温下长时间使用膜时也保持初始外观，高湿度和热冲击条件。本发明的组合物具有很高的抗连接电阻可靠性。因此，本发明的组合物提高了各种显示装置的可靠性，并且可以广泛用作各种粘合剂的组合物。

2. 发明公开

KR20070093303A ORGANOSILANE COMPOSITION, HARDMASK COMPOSITION COATED UNDER PHOTORESIST AND PROCESS OF PRODUCING INTEGRATED CIRCUIT DEVICES USING THEREOF 无效
标题翻译：有机组合物，根据光刻胶涂覆的HARDMASK组合物及其制造集成电路装置的方法
公开(公告)号：KR20070093303A
公开(公告)日：2007-09-18
申请号：KR20060025922
申请日：2006-03-22
申请人： CHEIL IND INC
发明人： UH DONG SEON , YUN HUI CHAN , LEE JIN KUK , LIM SANG HAK , KIM SANG KYUN , OH CHANG IL , KIM JONG SEOB
IPC分类号： C08G77/52 , C07F7/00 , C08G77/00
摘要： An organosilane-based composition is provided to form an anti-reflection composition which has high etching selectivity and sufficient multi-etching resistance and minimizes reflectivity between a resist and a lower layer. An organosilane-based composition comprises an organosilane polymer and a hydrolysate produced by reacting at least any one selected from compounds represented by the formula 1: [RO]3Si-(CH2)n-R' and formula 2: [RO]3Si-R' with a compound represented by the following formula 3: R1-Si-(OR2)a(OR3)b(OR4)c. In the formula 1, R is a methyl group or ethyl group, n is 1 to 5, and R' is an aromatic group or substituted aromatic group. In the formula 2, R is a methyl group or ethyl group and R' is an aromatic group or substituted aromatic group. In the formula 3, R1 is a methyl group or ethyl group, each of R2-R4 is a C1-4 alkyl group or phenyl group and is identical to or different from one another, a, b, and c satisfy the relations of 0
摘要翻译：提供了一种基于有机硅烷的组合物以形成具有高蚀刻选择性和足够的多次蚀刻电阻并使抗蚀剂和下层之间的反射率最小化的抗反射组合物。基于有机硅烷的组合物包含有机硅烷聚合物和通过使选自由式1表示的至少一种化合物：[RO] 3Si-（CH2）nR'和式2：[RO] 3Si-R'与式由下式3表示的化合物：R1-Si-（OR2）a（OR3）b（OR4）c。式1中，R为甲基或乙基，n为1〜5，R'为芳香族基团或取代芳香族基团。式2中，R为甲基或乙基，R'为芳香族基团或取代芳香族基团。在式3中，R 1是甲基或乙基，R 2 -R 4各自为C 1-4烷基或苯基，且彼此相同或不同，a，b和c满足关系式0

3. 发明申请

WO2012081842A3 ADHESIVE COMPOSITION FOR SEMICONDUCTORS, ADHESIVE FILM USING SAME, AND USES THEREOF 审中-公开
标题翻译：半导体用粘合剂组合物，使用该粘合剂膜的粘合剂组合物及其用途
公开(公告)号：WO2012081842A3
公开(公告)日：2012-09-07
申请号：PCT/KR2011008775
申请日：2011-11-16
申请人： CHEIL IND INC , PYUN AH RAM , UH DONG SEON , SONG KI TAE , KIM IN HWAN , KIM HYE JIN
发明人： PYUN AH RAM , UH DONG SEON , SONG KI TAE , KIM IN HWAN , KIM HYE JIN
IPC分类号： C09J133/04 , C09J11/06 , C09J163/00 , H01L21/58
CPC分类号： H01L24/29 , C08L63/00 , C09J133/066 , C09J133/18 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/13111 , H01L2224/13147 , H01L2224/16146 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/32145 , H01L2224/73104 , H01L2224/81011 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81447 , H01L2224/8181 , H01L2224/81815 , H01L2224/83191 , H01L2224/83203 , H01L2224/8385 , H01L2224/9211 , H01L2225/06513 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： According to the present invention, the adhesive composition for semiconductors is characterized by comprising an acryl polymer resin, an epoxy resin, and an imidazole compound having a melting point of about 200°C or higher. The present invention relates to a highly fluid adhesive composition for semiconductors, to an adhesive film using the adhesive composition, and to a semiconductor package using same, wherein the adhesive composition for semiconductors ensures electrical connection reliability between bump chips, serves as an adhesive layer between the bump chips to enable fluxing to remove the oxide film of the solder and the Cu bumps, and ensures sufficient contact between the bumps and the solder during chip bonding by thermocompression.
摘要翻译：根据本发明，用于半导体的粘合剂组合物的特征在于包含丙烯酰基聚合物树脂，环氧树脂和熔点为约200℃或更高的咪唑化合物。本发明涉及用于半导体的高流动性粘合剂组合物，涉及使用该粘合剂组合物的粘合剂膜和使用该粘合剂组合物的半导体封装件，其中半导体用粘合剂组合物确保凸块之间的电连接可靠性，该凸块芯片能够通过助焊剂去除焊料和Cu凸块的氧化膜，并且通过热压缩在芯片结合期间确保凸块和焊料之间的充分接触。

4. 发明申请

WO2012091306A2 ADHESIVE COMPOSITION FOR SEMICONDUCTORS, AND ADHESIVE FILM USING SAME 审中-公开
标题翻译：半导体用粘合剂组合物及使用其的粘合剂膜
公开(公告)号：WO2012091306A2
公开(公告)日：2012-07-05
申请号：PCT/KR2011009301
申请日：2011-12-02
申请人： CHEIL IND INC , PARK BAEK SOUNG , SONG KI TAE , UH DONG SEON , KIM IN HWAN
发明人： PARK BAEK SOUNG , SONG KI TAE , UH DONG SEON , KIM IN HWAN
IPC分类号： C09J9/00 , C09J7/02 , C09J11/00 , C09J163/00 , C09J201/00
CPC分类号： C09J163/00 , C08L63/00 , C09J7/00 , C09J7/10 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/27436 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/73215 , H01L2224/83191 , H01L2224/83862 , H01L2224/92165 , H01L2224/94 , H01L2225/06506 , H01L2924/00014 , H01L2924/181 , H01L2224/27 , H01L2924/05442 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： The adhesive composition for semiconductors of the present invention is characterized in that two exothermic peaks appear at 65-350°C, of which a first exothermic peak appears at 65-185°C and a second exothermic peak appears at 155-350°C, wherein less than 10% of the composition, which is cured at 150°C for 10 minutes, cured at 150°C for 30 minutes, and then molded at 175°C for 60 seconds, consists of voids. The adhesive composition for semiconductors is characterized by enabling a reduction in and the skipping of semi-curing steps, which would be necessary to perform after bonding the same type of chips.
摘要翻译：本发明半导体用粘合剂组合物的特征在于，在65〜350℃出现两个放热峰，其中第一个放热峰出现在65-185℃，第二个放热峰出现在155-350℃，其中在150℃下固化10分钟，在150℃下固化30分钟，然后在175℃下模塑60秒的组合物的少于10％由空隙组成。用于半导体的粘合剂组合物的特征在于能够减少和避免半固化步骤，这在键合相同类型的芯片之后执行将是必需的。

5. 发明公开

KR20100036112A Composition for removing color filter ink resin 审中-公开
标题翻译：去除颜色过滤器油墨树脂的组合物
公开(公告)号：KR20100036112A
公开(公告)日：2010-04-07
申请号：KR20080095572
申请日：2008-09-29
申请人： CHEIL IND INC
发明人： LEE IN JAE , PARK JONG SEUNG , UH DONG SEON
IPC分类号： G03F7/32
CPC分类号： G03F7/32 , C09B11/12 , C09B67/0041 , C09D11/30 , C09D11/36 , C09D125/14 , G02F1/133516 , G03F7/0007
摘要： PURPOSE: A composition for removing color filter ink resin is provided to have no resin residue due to excellent solubility to the ink resin and to maximize the effectiveness of rework. CONSTITUTION: A composition for removing color filter ink resin comprises 5-40 weight% basic solution and 60-95 weight% ether group or ester group-containing solvent. The basic solution is selected from the group consisting of an alkali metallic salt aqueous solution, ammonium salt aqueous solution and combinations thereof. The ester group-containing solvent is selected from the group consisting of acetates, propionates, and combinations thereof.
摘要翻译：目的：提供一种用于除去滤色油墨树脂的组合物，由于对油墨树脂的溶解性优异，并且使返工的有效性最大化，因此不会残留树脂。构成：用于除去滤色油墨树脂的组合物包含5-40重量％的碱性溶液和60-95重量％的醚基或含酯基的溶剂。碱性溶液选自碱金属盐水溶液，铵盐水溶液及其组合。含酯基的溶剂选自乙酸盐，丙酸盐及其组合。

6. 发明公开

KR20070095693A ORGANOSILANE COMPOSITION, HARDMASK COMPOSITION COATED UNDER PHOTORESIST AND PROCESS OF PRODUCING INTEGRATED CIRCUIT DEVICES USING THEREOF 无效
标题翻译：有机组合物，根据光刻胶涂覆的HARDMASK组合物及其制造集成电路装置的方法
公开(公告)号：KR20070095693A
公开(公告)日：2007-10-01
申请号：KR20060026204
申请日：2006-03-22
申请人： CHEIL IND INC
发明人： UH DONG SEON , LEE JIN KUK , KIM MIN SOO , YOON KYONG HO , NAM IRINA , OH CHANG IL , KIM JONG SEOB
IPC分类号： C08G77/00 , C08F8/12 , C08G77/06 , G03F7/004
CPC分类号： C08G77/00 , C08F8/12 , C08G77/06 , G03F7/0757 , G03F7/091
摘要： An organosilane-based compound, a hard mask composition for a resist under layer containing the compound, a method for preparing a semiconductor integrated circuit device by using the composition, and a semiconductor integrated circuit device prepared by the method are provided to improve the film characteristics and storage stability of the composition and to enhance the adhesion to a resist and the resistance against a developer. An organosilane-based compound comprises a hydrolyzate obtained by reacting at least one selected from a compound represented by [RO]3Si-(CH2)n-R' (wherein R is a methyl group or an ethyl group; n is 1-5; and R' is an aromatic group or a substituted aromatic group) and a compound represented by [RO]3Si-R' (wherein R is a methyl group or an ethyl group; and R' is an aromatic group or a substituted aromatic group) and at least one selected from a compound represented by R1-Si-(OR2)a(OR3)b(OR4)c (wherein R1 is a methyl group or an ethyl group; R2 to R4 are identical or different one another and are a C1-C4 alkyl group or a phenyl group; 0
摘要翻译：有机硅烷系化合物，含有该化合物的抗蚀剂下层的硬掩模组合物，使用该组合物制备半导体集成电路器件的方法以及通过该方法制备的半导体集成电路器件被提供以提高膜特性和组合物的储存稳定性和增强对抗蚀剂的粘附性和对显影剂的抵抗力。有机硅烷类化合物包含通过使选自由[RO] 3 Sii-（CH 2）n R'（其中R为甲基或乙基; n为1-5; '是由[RO] 3 Si-R'（其中R是甲基或乙基，R'是芳族基团或取代的芳族基团）表示的化合物和选自由R 1-Si-（OR 2）a（OR 3）b（OR 4）c（其中R 1为甲基或乙基; R 2至R 4）彼此相同或不同的化合物表示的化合物中的至少一种， C4烷基或苯基; 0

7. 发明公开

KR20100080143A Photosensitive resin composition for barrier and color filter including barrier fabricated using same 审中-公开
标题翻译：用于遮蔽物和彩色滤光片的光敏树脂组合物，其中包括使用其制造的遮蔽物
公开(公告)号：KR20100080143A
公开(公告)日：2010-07-08
申请号：KR20080138783
申请日：2008-12-31
申请人： CHEIL IND INC
发明人： OH HEE YOUNG , PARK JONG SEUNG , LEE IN JAE , JO GUK PYO , UH DONG SEON
IPC分类号： G03F7/027 , G02B5/20 , G03F7/028
CPC分类号： G03F7/027 , C08K5/3432 , G02B5/20 , G02B5/223 , G03F7/0007 , G03F7/0233 , G03F7/031 , G03F7/033 , G03F7/0388
摘要： PURPOSE: A photosensitive resin composition for forming a partition of a color filter and the color filter using the same are provided to ensure repulsive power, photosensitivity, development, adhesive property, printability, and a taper property. CONSTITUTION: A photosensitive resin composition for forming partition of a color filter contains an organic binder resin, a reactive unsaturated compound, a polymerization initiator, hardening fluorosurfactant, and a solvent. The organic binder resin is cardo resins, acryl resins, an epoxy resin, or a mixture thereof. The cardo resin is denoted by chemical formula 1.
摘要翻译：目的：提供一种用于形成滤色器分隔物的感光性树脂组合物和使用其的滤色器，以确保排斥力，光敏性，显影性，粘合性，印刷性和锥度性。构成：用于形成滤色器分隔的感光性树脂组合物含有有机粘合剂树脂，反应性不饱和化合物，聚合引发剂，硬化含氟表面活性剂和溶剂。有机粘合剂树脂是cardo树脂，丙烯酸树脂，环氧树脂或它们的混合物。卡诺树脂由化学式1表示。

8. 发明公开

KR20070095736A HARDMASK COMPOSITION COATED UNDER PHOTORESIST COMPRISING ORGANOSILANE POLYMER AND PROCESS OF PRODUCING INTEGRATED CIRCUIT DEVICES USING THEREOF 审中-公开
标题翻译：包含有机聚合物的光电复合材料的硬聚合物组合物及其制造集成电路装置的方法
公开(公告)号：KR20070095736A
公开(公告)日：2007-10-01
申请号：KR20060049341
申请日：2006-06-01
申请人： CHEIL IND INC
发明人： UH DONG SEON , YUN HUI CHAN , LEE JIN KUK , LIM SANG HAK , KIM SANG KYUN , OH CHANG IL , KIM JONG SEOB
IPC分类号： G03F7/11 , C08G77/00 , G03F7/004
CPC分类号： G03F7/091 , C08G77/00 , G03F7/11
摘要： A hard mask composition for a resist under layer, a method for preparing a semiconductor integrated circuit device by using the composition, and a semiconductor integrated circuit device prepared by the method are provided to improve the reproducibility of pattern, the adhesion to a resist, the resistance against a developing layer and storage stability. A hard mask composition comprises an organosilane-based polymer which is prepared by the reaction of at least one kind of compound represented by [R1O]3Si-R2 and has a polydispersity of 1.1-2; a solvent; and optionally an acid catalyst, wherein R1 is a C1-C5 alkyl group, an acetoxy group, or an oxime group; and R2 is H, a C1-C5 alkyl group, an aryl group, or an aralkyl group. Preferably the organosilane-based polymer is represented by the formula 2, wherein R2 is H, a C1-C5 alkyl group, an aryl group, or an aralkyl group.
摘要翻译：用于抗蚀剂层的硬掩模组合物，通过使用该组合物制备半导体集成电路器件的方法以及通过该方法制备的半导体集成电路器件被提供以提高图案的再现性，对抗蚀剂的粘附性，对显影层的抵抗力和储存稳定性。硬掩模组合物包含通过由[R 1 O] 3 Si-R 2表示的至少一种化合物与多分散性为1.1-2的反应制备的有机硅烷系聚合物; 溶剂; 和任选的酸催化剂，其中R1是C1-C5烷基，乙酰氧基或肟基; R2为H，C1-C5烷基，芳基或芳烷基。优选地，有机硅烷基聚合物由式2表示，其中R 2是H，C 1 -C 5烷基，芳基或芳烷基。

9. 发明专利

DE112008004068B4 Hartmaskenzusammensetzung mit verbesserter Lagerstabilität zum Bilden eines Resist-Unterschichtsfilms 未知
公开(公告)号：DE112008004068B4
公开(公告)日：2019-11-14
申请号：DE112008004068
申请日：2008-12-31
申请人： CHEIL IND INC
发明人： KOH SANG-RAN , KIM SANG KYUN , LIM SANG HAK , KIM MI YOUNG , YUN HUI CHAN , KIM DO HYEON , UH DONG SEON , KIM JONG SEOB
IPC分类号： G03F7/075
摘要： Hartmaskenzusammensetzung zum Bilden eines Resist-Unterschichtsfilms, umfassend(A) ein Organosilanpolymer, wobei das Organosilanpolymer (A) ein Polykondensat von Hydrolysaten von Verbindungen ist, die durch Formel 1 und 2 dargestellt sind:worin Ar eine funktionelle C-C-Gruppe ist, die mindestens einen substituierten oder nichtsubstituierten aromatischen Ring enthält, und Reine C-C-Alkylgruppe ist; undworin Reine C-C-Alkylgruppe ist und Reine C-C-Alkylgruppe oder ein Wasserstoffatom ist, und(B) mindestens einen Stabilisator, der ausgewählt ist aus der Gruppe, bestehend aus Essigsäureanhydrid, Methylacetoacetat, Propionsäureanhydrid, Ethyl-2-ethylacetoacetat, Buttersäureanhydrid, Valeriansäureanhydrid, 2-Methylbuttersäureanhydrid, Nonanol, Decanol, Undecanol, Dodecanol, Propylenglykolpropylether, Propylenglykolethylether, Propylenglykolmethylether, Propylenglykol, Phenyltrimethoxysilan, Diphenylhexamethoxydisiloxan, Diphenylhexaethoxydisiloxan, Dioctyltetramethyldisiloxan, Hexamethyltri siloxan, Tetramethyldisiloxan, Decamethyltetrasiloxan, Dodecamethylpentasiloxan und Hexamethyldisiloxan, und wobei der Stabilisatoranteil 1 bis 30 Gewichtsteile, bezogen auf 100 Gewichtsteile des Organosilanpolymer, ausmacht.

10. 发明专利

DE112008004068T5 Hartmaskenzusammensetzung mit verbesserter Lagerstabilität zum Bilden eines Resist-Unterschichtsfilms 未知
公开(公告)号：DE112008004068T5
公开(公告)日：2013-03-07
申请号：DE112008004068
申请日：2008-12-31
申请人： CHEIL IND INC
发明人： KOH SANG-RAN , KIM SANG KYUN , LIM SANG HAK , KIM MI YOUNG , YUN HUI CHAN , KIM DO HYEON , UH DONG SEON , KIM JONG SEOB
IPC分类号： G03F7/075
摘要： Offenbart wird eine Hartmaskenzusammensetzung zum Bilden eines Resist-Unterschichtsfilms. Die Hartmaskenzusammensetzung umfasst (A) ein Organosilanpolymer und (B) mindestens einen Stabilisator. Die Hartmaskenzusammensetzung ist während der Lagerung sehr stabil und ermöglicht dank ihrer ausgezeichneten Hartmaskeneigenschaften die Übertragung eines guten Musters auf eine Materialschicht.

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