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    • 2. 发明申请
    • COMPOUND TUNNELING FIELD EFFECT TRANSISTOR INTEGRATED ON SILICON SUBSTRATE AND METHOD FOR FABRICATING THE SAME
    • 集成在硅基板上的复合隧道场效应晶体管及其制造方法
    • US20140291616A1
    • 2014-10-02
    • US14357685
    • 2011-12-30
    • Byung-Gook ParkSeongjae ChoIn Man Kang
    • Byung-Gook ParkSeongjae ChoIn Man Kang
    • H01L29/775H01L29/66
    • H01L29/775H01L29/0657H01L29/267H01L29/42312H01L29/66356H01L29/66439H01L29/7391
    • Compound tunneling field effect transistors integrated on a silicon substrate are provided with increased tunneling efficiency and an abrupt band slope by forming a source region with a material having a bandgap at least 0.4 electron volts (eV) narrower than that of silicon to increase a driving current (ON current) by forming a channel region with a material having almost no difference in lattice constant from a source region and having a high electron mobility at least 5 times higher than silicon. ON/OFF current ratio simultaneously is increased by forming a drain region with a material having a bandgap at least as wide as a channel region material to restrain OFF current. Tunneling field effect transistors having various threshold voltages according to circuit designs are formed easily by adding a specific material with an electron affinity less than a source region material when forming a channel region.
    • 集成在硅衬底上的复合隧道场效应晶体管具有增加的隧穿效率和突变带斜率,通过形成具有比硅的带隙更小的至少0.4电子伏(eV)的带隙的材料的源极区,以增加驱动电流 (导通电流)通过形成具有与源极区域的晶格常数几乎没有差异的材料的沟道区域,并且具有比硅高至少5倍的高电子迁移率。 通过用具有至少与沟道区域材料一样宽的带隙的材料形成漏极区域来同时增加ON / OFF电流比,以限制关断电流。 通过在形成沟道区域时,通过添加小于源区材料的电子亲和力的特定材料,容易地形成具有根据电路设计的各种阈值电压的隧穿场效应晶体管。
    • 3. 发明授权
    • 3D stacked array having cut-off gate line and fabrication method thereof
    • 具有截止栅极线的3D堆叠阵列及其制造方法
    • US08786004B2
    • 2014-07-22
    • US13023646
    • 2011-02-09
    • Byung-Gook ParkSeongjae ChoWon Bo Shim
    • Byung-Gook ParkSeongjae ChoWon Bo Shim
    • H01L29/792
    • H01L27/11565H01L27/11578
    • A three-dimensional stacked flash memory array having cut-off gate line and a fabricating method of the same are provided. The flash memory array enables to operate two memory cells by each word line, to produce a high integrity without limitation by vertical stacks of word lines, to increase operating speed and uniformity of electrical property between cells by using a single crystal substrate as a channel region, and to reduce a fabricating cost to a great amount by a fabricating method which is including steps of forming a plurality of trenches in a semiconductor substrate and stacking repeatedly a conductive material interlaid with an insulating layer from bottom of each trench to form a cut-off gate line and a plurality of word lines.
    • 提供具有截止栅极线的三维堆叠式闪存阵列及其制造方法。 闪存阵列使得能够通过每个字线操作两个存储器单元,以产生高完整性而不受字线的垂直堆叠的限制,以通过使用单晶衬底作为沟道区域来增加单元之间的电性能的操作速度和均匀性 并且通过包括在半导体衬底中形成多个沟槽并在每个沟槽的底部重叠层叠有绝缘层的导电材料的步骤的制造方法来大大减少制造成本, 关门线和多条字线。
    • 4. 发明申请
    • NAND FLASH MEMORY ARRAY WITH CUT-OFF GATE LINE AND METHODS FOR OPERATING AND FABRICATING THE SAME
    • 具有切断栅极线的NAND闪存阵列及其操作和制造方法
    • US20110256680A1
    • 2011-10-20
    • US13170533
    • 2011-06-28
    • Byung-Gook ParkSeongjae Cho
    • Byung-Gook ParkSeongjae Cho
    • H01L21/8247
    • G11C8/14G11C16/0483H01L21/26586H01L27/11565H01L27/11568H01L27/11582H01L29/66833
    • A NAND flash memory array, an operating method and a fabricating method of the same are provided. The NAND flash memory array has a cut-off gate line under a control gate in order to operate two cells having vertical channels independently with one control gate (i.e., a shared word line). The memory cell area is reduced considerably compared to the conventional vertical channel structure, and is better for high integration. A shared cut-off gate turn off is made during a programming operation and prevents programming the opposite cell by a self-boosting effect. It is possible to shield electrically with a shared word line (a control gate) during a reading operation, and minimizes the effect of storage condition of the opposite cell. Also, the NAND flash memory array can be fabricated by using the conventional CMOS process.
    • 提供NAND闪存阵列,其操作方法及其制造方法。 NAND闪速存储器阵列在控制栅极下方具有截止栅极线,以便利用一个控制栅极(即共享字线)独立地操作具有垂直沟道的两个单元。 与传统的垂直通道结构相比,存储单元面积显着减小,并且更好地用于高集成度。 共享截止门在编程操作期间关闭,并防止通过自增强效应对相对的单元进行编程。 在读取操作期间可以用共享字线(控制门)进行电屏蔽,并且使对置单元的存储条件的影响最小化。 而且,NAND闪存阵列可以通过使用传统的CMOS工艺来制造。
    • 8. 发明授权
    • Semiconductor devices having vertical device and non-vertical device and methods of forming the same
    • 具有垂直装置和非垂直装置的半导体装置及其形成方法
    • US09087922B2
    • 2015-07-21
    • US13412760
    • 2012-03-06
    • Min-Chul SunByung-Gook Park
    • Min-Chul SunByung-Gook Park
    • H01L29/78H01L21/8238H01L21/8234H01L27/092H01L27/11
    • H01L27/1104H01L21/823487H01L21/823885H01L27/092H01L29/7827
    • In a semiconductor device, a vertical transistor comprises: a first diffusion region on a substrate; a channel region on the first diffusion region and extending in a vertical direction; a second diffusion region on the channel region; and a gate electrode at a sidewall of, and insulated from, the channel region. A horizontal transistor is positioned on the substrate, the horizontal transistor comprising: a first diffusion region and a second diffusion region on the substrate and spaced apart from each other; a channel region on the substrate between the first diffusion region and the second diffusion region; and a gate electrode on the channel region and isolated from the channel region. A portion of a gate electrode of the vertical transistor and a portion of the gate electrode of the horizontal transistor are at a same vertical position in the vertical direction relative to the substrate.
    • 在半导体器件中,垂直晶体管包括:衬底上的第一扩散区; 在所述第一扩散区域上的沿垂直方向延伸的沟道区域; 沟道区上的第二扩散区; 以及在沟道区的侧壁处和绝缘的栅电极。 水平晶体管位于衬底上,水平晶体管包括:在衬底上的第一扩散区和第二扩散区,彼此间隔开; 在所述第一扩散区域和所述第二扩散区域之间的衬底上的沟道区域; 以及沟道区上的栅极,并与沟道区隔离。 垂直晶体管的栅电极的一部分和水平晶体管的栅电极的一部分在垂直方向上相对于衬底处于相同的垂直位置。
    • 9. 发明授权
    • Method for manufacturing a semiconductor device
    • 半导体器件的制造方法
    • US08455309B2
    • 2013-06-04
    • US13347361
    • 2012-01-10
    • Song-Ju LeeJeong Soo ParkByung-Gook ParkHyun Woo Kim
    • Song-Ju LeeJeong Soo ParkByung-Gook ParkHyun Woo Kim
    • H01L33/08
    • H01L29/66356H01L29/7391
    • A technology is capable of simplifying a process of manufacturing an asymmetric device in forming a Tunneling Field Effect Transistor (TFET) structure. A method for manufacturing a semiconductor device comprises forming a conductive pattern over a semiconductor substrate, implanting impurity ions with the conductive pattern as a mask to form a first junction region in the semiconductor substrate, forming a first insulating film planarized with the conductive pattern over the first junction region, etching the top of the conductive pattern to expose a sidewall of the first insulating film, forming a spacer at the sidewall of the first insulating film disposed over the conductive pattern, etching the conductive pattern with the spacer as an etching mask to form a gate pattern, and forming a second junction region in the semiconductor substrate with the gate pattern as a mask.
    • 一种技术能够简化在形成隧道场效应晶体管(TFET)结构中制造非对称器件的工艺。 一种制造半导体器件的方法,包括在半导体衬底上形成导电图案,将导电图案作为掩模注入杂质离子,以在半导体衬底中形成第一结区,在导电图案上形成平坦化的第一绝缘膜, 第一接合区域,蚀刻导电图案的顶部以暴露第一绝缘膜的侧壁,在布置在导电图案上的第一绝缘膜的侧壁处形成间隔物,用间隔物蚀刻导电图案作为蚀刻掩模, 形成栅极图案,并且以栅极图案作为掩模在半导体衬底中形成第二结区域。