会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • High-performance CMOS SOI devices on hybrid crystal-oriented substrates
    • 高性能CMOS SOI器件在混合晶体取向衬底上
    • US07713807B2
    • 2010-05-11
    • US11958877
    • 2007-12-18
    • Bruce B. DorisKathryn W. GuariniMeikei IeongShreesh NarasimhaKern RimJeffrey W. SleightMin Yang
    • Bruce B. DorisKathryn W. GuariniMeikei IeongShreesh NarasimhaKern RimJeffrey W. SleightMin Yang
    • H01L21/8238
    • H01L21/76275H01L21/823807H01L21/84
    • An integrated semiconductor structure containing at least one device formed upon a first crystallographic surface that is optimal for that device, while another device is formed upon a second different crystallographic surface that is optimal for the other device is provided. The method of forming the integrated structure includes providing a bonded substrate including at least a first semiconductor layer of a first crystallographic orientation and a second semiconductor layer of a second different crystallographic orientation. A portion of the bonded substrate is protected to define a first device area, while another portion of the bonded substrate is unprotected. The unprotected portion of the bonded substrate is then etched to expose a surface of the second semiconductor layer and a semiconductor material is regrown on the exposed surface. Following planarization, a first semiconductor device is formed in the first device region and a second semiconductor device is formed on the regrown material.
    • 提供包含至少一个器件的集成半导体结构,所述器件形成在对于该器件最佳的第一晶体表面上,而另一器件形成在对于另一器件最佳的第二不同晶体表面上。 形成集成结构的方法包括提供包括至少第一晶体取向的第一半导体层和第二不同晶体取向的第二半导体层的键合衬底。 键合衬底的一部分被保护以限定第一器件区域,而键合衬底的另一部分是未受保护的。 然后蚀刻键合衬底的未保护部分以暴露第二半导体层的表面,并将半导体材料重新生长在暴露表面上。 在平坦化之后,在第一器件区域中形成第一半导体器件,并且在再生长材料上形成第二半导体器件。
    • 2. 发明授权
    • High-performance CMOS devices on hybrid crystal oriented substrates
    • 混合晶体取向基板上的高性能CMOS器件
    • US07329923B2
    • 2008-02-12
    • US10250241
    • 2003-06-17
    • Bruce B. DorisKathryn W. GuariniMeikei IeongShreesh NarasimhaKern RimJeffrey W. SleightMin Yang
    • Bruce B. DorisKathryn W. GuariniMeikei IeongShreesh NarasimhaKern RimJeffrey W. SleightMin Yang
    • H01L27/01
    • H01L21/76275H01L21/823807H01L21/84
    • An integrated semiconductor structure containing at least one device formed upon a first crystallographic surface that is optimal for that device, while another device is formed upon a second different crystallographic surface that is optimal for the other device is provided. The method of forming the integrated structure includes providing a bonded substrate including at least a first semiconductor layer of a first crystallographic orientation and a second semiconductor layer of a second different crystallographic orientation. A portion of the bonded substrate is protected to define a first device area, while another portion of the bonded substrate is unprotected. The unprotected portion of the bonded substrate is then etched to expose a surface of the second semiconductor layer and a semiconductor material is regrown on the exposed surface. Following planarization, a first semiconductor device is formed in the first device region and a second semiconductor device is formed on the regrown material.
    • 提供包含至少一个器件的集成半导体结构,所述器件形成在对于该器件最佳的第一晶体表面上,而另一器件形成在对于另一器件最佳的第二不同晶体表面上。 形成集成结构的方法包括提供包括至少第一晶体取向的第一半导体层和第二不同晶体取向的第二半导体层的键合衬底。 键合衬底的一部分被保护以限定第一器件区域,而键合衬底的另一部分是未受保护的。 然后蚀刻键合衬底的未保护部分以暴露第二半导体层的表面,并将半导体材料重新生长在暴露表面上。 在平坦化之后,在第一器件区域中形成第一半导体器件,并且在再生长材料上形成第二半导体器件。
    • 3. 发明申请
    • HIGH-PERFORMANCE CMOS SOI DEVICES ON HYBRID CRYSTAL-ORIENTED SUBSTRATES
    • 高性能CMOS SOI器件在混合晶体导向衬底上的应用
    • US20080096330A1
    • 2008-04-24
    • US11958877
    • 2007-12-18
    • Bruce DorisKathryn GuariniMeikei IeongShreesh NarasimhaKern RimJeffrey SleightMin Yang
    • Bruce DorisKathryn GuariniMeikei IeongShreesh NarasimhaKern RimJeffrey SleightMin Yang
    • H01L21/84
    • H01L21/76275H01L21/823807H01L21/84
    • An integrated semiconductor structure containing at least one device formed upon a first crystallographic surface that is optimal for that device, while another device is formed upon a second different crystallographic surface that is optimal for the other device is provided. The method of forming the integrated structure includes providing a bonded substrate including at least a first semiconductor layer of a first crystallographic orientation and a second semiconductor layer of a second different crystallographic orientation. A portion of the bonded substrate is protected to define a first device area, while another portion of the bonded substrate is unprotected. The unprotected portion of the bonded substrate is then etched to expose a surface of the second semiconductor layer and a semiconductor material is regrown on the exposed surface. Following planarization, a first semiconductor device is formed in the first device region and a second semiconductor device is formed on the regrown material.
    • 提供包含至少一个器件的集成半导体结构,所述器件形成在对于该器件最佳的第一晶体表面上,而另一器件形成在对于另一器件最佳的第二不同晶体表面上。 形成集成结构的方法包括提供包括至少第一晶体取向的第一半导体层和第二不同晶体取向的第二半导体层的键合衬底。 键合衬底的一部分被保护以限定第一器件区域,而键合衬底的另一部分是未受保护的。 然后蚀刻键合衬底的未保护部分以暴露第二半导体层的表面,并将半导体材料重新生长在暴露表面上。 在平坦化之后,在第一器件区域中形成第一半导体器件,并且在再生长材料上形成第二半导体器件。
    • 8. 发明授权
    • Curved FINFETs
    • 弯曲的FINFET
    • US07538391B2
    • 2009-05-26
    • US11621228
    • 2007-01-09
    • Dureseti ChidambarraoShreesh NarasimhaEdward J. NowakJohn J. PekarikJeffrey W. SleightRichard Q. Williams
    • Dureseti ChidambarraoShreesh NarasimhaEdward J. NowakJohn J. PekarikJeffrey W. SleightRichard Q. Williams
    • H01L29/78H01L21/336
    • H01L29/785H01L29/0649H01L29/66795H01L29/7843
    • A method of forming a transistor patterns a semiconductor fin on a substrate, such that the fin extends from the substrate. Then, the method forms a gate conductor over a central portion of the fin, leaving end portions of the fin exposed. Next, the end portions of the fin are doped with at least one impurity to leave the central portion of the fin as a semiconductor and form the end portions of the fin as conductors. The end portions of the fin are undercut to disconnect the end portions of the fin from the substrate, such that the fin is connected to the substrate along a central portion and is disconnected from the substrate along the end portions and that the end portions are free to move and the central portion is not free to move. A straining layer is formed on a first side of the fin and the straining layer imparts physical pressure on the fin such that the end portions are permanently moved away from a straight-line orientation with the central portion after the forming of the straining layer. Thus, the undercutting in combination with the forming of the straining layer curves the fin such that, when viewed from a top of the substrate, the fin is bowed and has a curved shape.
    • 一种形成晶体管的方法在衬底上形成半导体鳍片,使得鳍片从衬底延伸。 然后,该方法在鳍片的中心部分上形成栅极导体,使翅片的端部部分露出。 接下来,翅片的端部掺杂有至少一种杂质,以使翅片的中心部分作为半导体,并将翅片的端部形成为导体。 翅片的端部被底切以使翅片的端部与基板断开,使得翅片沿着中心部分连接到基板,并且沿着端部与基板断开,并且端部部分是自由的 移动,中央部分不能自由移动。 在翅片的第一侧上形成有应变层,并且应变层在翅片上施加物理压力,使得端部在紧固层形成之后永久地与中心部分的直线取向远离。 因此,与形成应变层相结合的底切使翅片弯曲,使得当从基板的顶部观察时,翅片弯曲并具有弯曲形状。
    • 10. 发明授权
    • Nanowire field effect transistors
    • 纳米线场效应晶体管
    • US08536563B2
    • 2013-09-17
    • US12884707
    • 2010-09-17
    • Sarunya BangsaruntipGuy M. CohenShreesh NarasimhaJeffrey W. Sleight
    • Sarunya BangsaruntipGuy M. CohenShreesh NarasimhaJeffrey W. Sleight
    • H01L29/06
    • H01L29/775B82Y10/00H01L21/84H01L29/0673H01L29/42392H01L29/4966H01L29/513H01L29/66439H01L29/78696
    • A method for forming a nanowire field effect transistor (FET) device including forming a first silicon on insulator (SOI) pad region, a second SOI pad region, a third SOI pad region, a first SOI portion connecting the first SOI pad region to the second SOI pad region, and a second SOI portion connecting the second SOI pad region to the third SOI pad region on a substrate, patterning a first hardmask layer over the second SOI portion, forming a first suspended nanowire over the semiconductor substrate, forming a first gate structure around a portion of the first suspended nanowire, patterning a second hardmask layer over the first gate structure and the first suspended nanowire, removing the first hardmask layer, forming a second suspended nanowire over the semiconductor substrate, forming a second gate structure around a portion of the second suspended nanowire, and removing the second hardmask layer.
    • 一种用于形成纳米线场效应晶体管(FET)器件的方法,包括形成绝缘体上硅(SOI)焊盘区域,第二SOI焊盘区域,第三SOI焊盘区域,将第一SOI焊盘区域连接到第一SOI焊盘区域的第一SOI部分 第二SOI焊盘区域和将第二SOI焊盘区域连接到衬底上的第三SOI焊盘区域的第二SOI部分,在第二SOI部分上形成第一硬掩模层,在半导体衬底上形成第一悬浮的纳米线,形成第一 围绕第一悬浮纳米线的一部分构造栅极结构,在第一栅极结构和第一悬置纳米线上图案化第二硬掩模层,去除第一硬掩模层,在半导体衬底上形成第二悬浮纳米线,在第二栅极结构周围形成第二栅极结构 第二悬浮纳米线的一部分,以及去除第二硬掩模层。