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1. 发明授权

US08193067B2 Integrated circuit and a method using integrated process steps to form deep trench isolation structures and deep trench capacitor structures for the integrated circuit 有权
标题翻译：集成电路和采用集成工艺步骤形成集成电路的深沟槽隔离结构和深沟槽电容器结构的方法
公开(公告)号：US08193067B2
公开(公告)日：2012-06-05
申请号：US12630091
申请日：2009-12-03
申请人： Brent A. Anderson , Andres Bryant , Herbert L. Ho , Edward J. Nowak
发明人： Brent A. Anderson , Andres Bryant , Herbert L. Ho , Edward J. Nowak
IPC分类号： H01L21/20
CPC分类号： H01L21/76224 , H01L27/10829 , H01L27/10867 , H01L27/10894 , H01L27/10897 , H01L29/66181
摘要： Disclosed is an integrated circuit having at least one deep trench isolation structure and a deep trench capacitor. A method of forming the integrated circuit incorporates a single etch process to simultaneously form first trench(s) and a second trenches for the deep trench isolation structure(s) and a deep trench capacitor, respectively. Following formation of a buried capacitor plate adjacent to the lower portion of the second trench, the trenches are lined with a conformal insulator layer and filled with a conductive material. Thus, for the deep trench capacitor, the conformal insulator layer functions as the capacitor dielectric and the conductive material as a capacitor plate in addition to the buried capacitor plate. A shallow trench isolation (STI) structure formed in the substrate extending across the top of the first trench(es) encapsulates the conductive material therein, thereby creating the deep trench isolation structure(s).
摘要翻译：公开了具有至少一个深沟槽隔离结构和深沟槽电容器的集成电路。形成集成电路的方法包括单个蚀刻工艺，以分别同时形成用于深沟槽隔离结构的第一沟槽和第二沟槽以及深沟槽电容器。在形成与第二沟槽的下部相邻的埋置的电容器板之后，沟槽衬有保形绝缘体层并填充有导电材料。因此，对于深沟槽电容器，除了埋置的电容器板之外，保形绝缘体层用作电容器电介质和作为电容器板的导电材料。在衬底中形成的浅沟槽隔离（STI）结构跨越第一沟槽的顶部封装在其中的导电材料，从而形成深沟槽隔离结构。

2. 发明申请

US20110133310A1 INTEGRATED CIRCUIT AND A METHOD USING INTEGRATED PROCESS STEPS TO FORM DEEP TRENCH ISOLATION STRUCTURES AND DEEP TRENCH CAPACITOR STRUCTURES FOR THE INTEGRATED CIRCUIT 有权
标题翻译：集成电路和使用集成工艺步骤形成集成电路的深层隔离分离结构和深层电容电容器结构的方法
公开(公告)号：US20110133310A1
公开(公告)日：2011-06-09
申请号：US12630091
申请日：2009-12-03
申请人： Brent A. Anderson , Andres Bryant , Herbert L. Ho , Edward J. Nowak
发明人： Brent A. Anderson , Andres Bryant , Herbert L. Ho , Edward J. Nowak
IPC分类号： H01L29/92 , H01L21/8242
CPC分类号： H01L21/76224 , H01L27/10829 , H01L27/10867 , H01L27/10894 , H01L27/10897 , H01L29/66181
摘要： Disclosed is an integrated circuit having at least one deep trench isolation structure and a deep trench capacitor. A method of forming the integrated circuit incorporates a single etch process to simultaneously form first trench(s) and a second trenches for the deep trench isolation structure(s) and a deep trench capacitor, respectively. Following formation of a buried capacitor plate adjacent to the lower portion of the second trench, the trenches are lined with a conformal insulator layer and filled with a conductive material. Thus, for the deep trench capacitor, the conformal insulator layer functions as the capacitor dielectric and the conductive material as a capacitor plate in addition to the buried capacitor plate. A shallow trench isolation (STI) structure formed in the substrate extending across the top of the first trench(es) encapsulates the conductive material therein, thereby creating the deep trench isolation structure(s).
摘要翻译：公开了具有至少一个深沟槽隔离结构和深沟槽电容器的集成电路。形成集成电路的方法包括单个蚀刻工艺，以分别同时形成用于深沟槽隔离结构的第一沟槽和第二沟槽以及深沟槽电容器。在形成与第二沟槽的下部相邻的埋置的电容器板之后，沟槽衬有保形绝缘体层并填充有导电材料。因此，对于深沟槽电容器，除了埋置的电容器板之外，保形绝缘体层用作电容器电介质和作为电容器板的导电材料。在衬底中形成的浅沟槽隔离（STI）结构跨越第一沟槽的顶部封装在其中的导电材料，从而形成深沟槽隔离结构。

3. 发明授权

US08492820B2 Integrated circuit and a method using integrated process steps to form deep trench isolation structures and deep trench capacitor structures for the integrated circuit 有权
标题翻译：集成电路和采用集成工艺步骤形成集成电路的深沟槽隔离结构和深沟槽电容器结构的方法
公开(公告)号：US08492820B2
公开(公告)日：2013-07-23
申请号：US13406664
申请日：2012-02-28
申请人： Brent A. Anderson , Andres Bryant , Herbert L. Ho , Edward J. Nowak
发明人： Brent A. Anderson , Andres Bryant , Herbert L. Ho , Edward J. Nowak
IPC分类号： H01L29/94
CPC分类号： H01L21/76224 , H01L27/10829 , H01L27/10867 , H01L27/10894 , H01L27/10897 , H01L29/66181
摘要： Disclosed is an integrated circuit having at least one deep trench isolation structure and a deep trench capacitor. A method of forming the integrated circuit incorporates a single etch process to simultaneously form first trench(s) and a second trenches for the deep trench isolation structure(s) and a deep trench capacitor, respectively. Following formation of a buried capacitor plate adjacent to the lower portion of the second trench, the trenches are lined with a conformal insulator layer and filled with a conductive material. Thus, for the deep trench capacitor, the conformal insulator layer functions as the capacitor dielectric and the conductive material as a capacitor plate in addition to the buried capacitor plate. A shallow trench isolation (STI) structure formed in the substrate extending across the top of the first trench(es) encapsulates the conductive material therein, thereby creating the deep trench isolation structure(s).
摘要翻译：公开了具有至少一个深沟槽隔离结构和深沟槽电容器的集成电路。形成集成电路的方法包括单个蚀刻工艺，以分别同时形成用于深沟槽隔离结构的第一沟槽和第二沟槽以及深沟槽电容器。在形成与第二沟槽的下部相邻的埋置的电容器板之后，沟槽衬有保形绝缘体层并填充有导电材料。因此，对于深沟槽电容器，除了埋置的电容器板之外，保形绝缘体层用作电容器电介质和作为电容器板的导电材料。在衬底中形成的浅沟槽隔离（STI）结构跨越第一沟槽的顶部封装在其中的导电材料，从而形成深沟槽隔离结构。

4. 发明申请

US20120153431A1 INTEGRATED CIRCUIT AND A METHOD USING INTEGRATED PROCESS STEPS TO FORM DEEP TRENCH ISOLATION STRUCTURES AND DEEP TRENCH CAPACITOR STRUCTURES FOR THE INTEGRATED CIRCUIT 有权
标题翻译：集成电路和使用集成工艺步骤形成集成电路的深层隔离分离结构和深层电容电容器结构的方法
公开(公告)号：US20120153431A1
公开(公告)日：2012-06-21
申请号：US13406664
申请日：2012-02-28
申请人： Brent A. Anderson , Andres Bryant , Herbert L. Ho , Edward J. Nowak
发明人： Brent A. Anderson , Andres Bryant , Herbert L. Ho , Edward J. Nowak
IPC分类号： H01L29/06
CPC分类号： H01L21/76224 , H01L27/10829 , H01L27/10867 , H01L27/10894 , H01L27/10897 , H01L29/66181
摘要： Disclosed is an integrated circuit having at least one deep trench isolation structure and a deep trench capacitor. A method of forming the integrated circuit incorporates a single etch process to simultaneously form first trench(s) and a second trenches for the deep trench isolation structure(s) and a deep trench capacitor, respectively. Following formation of a buried capacitor plate adjacent to the lower portion of the second trench, the trenches are lined with a conformal insulator layer and filled with a conductive material. Thus, for the deep trench capacitor, the conformal insulator layer functions as the capacitor dielectric and the conductive material as a capacitor plate in addition to the buried capacitor plate. A shallow trench isolation (STI) structure formed in the substrate extending across the top of the first trench(es) encapsulates the conductive material therein, thereby creating the deep trench isolation structure(s).
摘要翻译：公开了具有至少一个深沟槽隔离结构和深沟槽电容器的集成电路。形成集成电路的方法包括单个蚀刻工艺，以分别同时形成用于深沟槽隔离结构的第一沟槽和第二沟槽以及深沟槽电容器。在形成与第二沟槽的下部相邻的埋置的电容器板之后，沟槽衬有保形绝缘体层并填充有导电材料。因此，对于深沟槽电容器，除了埋置的电容器板之外，保形绝缘体层用作电容器电介质和作为电容器板的导电材料。在衬底中形成的浅沟槽隔离（STI）结构跨越第一沟槽的顶部封装在其中的导电材料，从而形成深沟槽隔离结构。

5. 发明授权

US08946027B2 Replacement-gate FinFET structure and process 有权
标题翻译：替代栅FinFET结构和工艺
公开(公告)号：US08946027B2
公开(公告)日：2015-02-03
申请号：US13367725
申请日：2012-02-07
申请人： Brent A. Anderson , Andres Bryant , Edward J. Nowak
发明人： Brent A. Anderson , Andres Bryant , Edward J. Nowak
IPC分类号： H01L21/336
CPC分类号： H01L29/66545 , H01L29/66795 , H01L29/785
摘要： A fin field effect transistor (FinFET) structure and method of making the FinFET including a silicon fin that includes a channel region and source/drain (S/D) regions, formed on each end of the channel region, where an entire bottom surface of the channel region contacts a top surface of a lower insulator and bottom surfaces of the S/D regions contact first portions of top surfaces of a lower silicon germanium (SiGe) layer. The FinFET structure also includes extrinsic S/D regions that contact a top surface and both side surfaces of each of the S/D regions and second portions of top surfaces of the lower SiGe layer. The FinFET structure further includes a replacement gate or gate stack that contacts a conformal dielectric, formed over a top surface and both side surfaces of the channel region.
摘要翻译：鳍状场效应晶体管（FinFET）结构和制造FinFET的方法，其包括形成在沟道区的每个端部上的沟道区和源/漏（S / D）区的硅鳍，其中整个底表面沟道区域接触下绝缘体的顶表面，S / D区的底表面接触下硅锗（SiGe）层的顶表面的第一部分。 FinFET结构还包括接触顶部表面的外部S / D区域和下部SiGe层的顶表面的每个S / D区域和第二部分的两个侧表面。 FinFET结构还包括形成在通道区域的顶表面和两个侧表面上的适形电介质的替代栅极或栅极堆叠。

6. 发明授权

US08698245B2 Partially depleted (PD) semiconductor-on-insulator (SOI) field effect transistor (FET) structure with a gate-to-body tunnel current region for threshold voltage (VT) lowering and method of forming the structure 有权
标题翻译：部分耗尽（PD）绝缘体上半导体（SOI）场效应晶体管（FET）结构，具有用于阈值电压（VT）降低的栅 - 体隧道电流区域和形成结构的方法
公开(公告)号：US08698245B2
公开(公告)日：2014-04-15
申请号：US12967329
申请日：2010-12-14
申请人： Brent A. Anderson , Andres Bryant , Jiale Liang , Edward J. Nowak
发明人： Brent A. Anderson , Andres Bryant , Jiale Liang , Edward J. Nowak
IPC分类号： H01L27/12
CPC分类号： H01L29/78 , H01L21/26506 , H01L29/32 , H01L29/66477 , H01L29/78612
摘要： Disclosed are embodiments of a field effect transistor with a gate-to-body tunnel current region (GTBTCR) and a method. In one embodiment, a gate, having adjacent sections with different conductivity types, traverses the center portion of a semiconductor layer to create, within the center portion, a channel region and a GTBTCR below the adjacent sections having the different conductivity types, respectively. In another embodiment, a semiconductor layer has a center portion with a channel region and a GTBTCR. The GTBTCR comprises: a first implant region adjacent to and doped with a higher concentration of the same first conductivity type dopant as the channel region; a second implant region, having a second conductivity type, adjacent to the first implant region; and an enhanced generation and recombination region between the implant regions. A gate with the second conductivity type traverses the center portion.
摘要翻译：公开了具有栅对体隧道电流区域（GTBTCR）的场效应晶体管的实施例和方法。在一个实施例中，具有不同导电类型的相邻部分的栅极穿过半导体层的中心部分，以在中心部分内分别在具有不同导电类型的相邻部分之下分别形成沟道区域和GTBTCR。在另一个实施例中，半导体层具有具有沟道区域的中心部分和GTBTCR。 GTBTCR包括：与沟道区相邻并掺杂相同的第一导电类型掺杂剂的较高浓度的第一注入区; 具有第二导电类型的与第一植入区相邻的第二植入区; 以及植入区域之间的增强的生成和重组区域。具有第二导电类型的栅极穿过中心部分。

7. 发明授权

US08580601B2 Pixel sensor cell with a dual work function gate electrode 有权
标题翻译：具有双功能栅极电极的像素传感器单元
公开(公告)号：US08580601B2
公开(公告)日：2013-11-12
申请号：US13571986
申请日：2012-08-10
申请人： Brent A. Anderson , Andres Bryant , William F. Clark, Jr. , John Joseph Ellis-Monaghan , Edward J. Nowak
发明人： Brent A. Anderson , Andres Bryant , William F. Clark, Jr. , John Joseph Ellis-Monaghan , Edward J. Nowak
IPC分类号： H01L21/00
CPC分类号： H01L27/14614
摘要： Pixel sensor cells, methods of fabricating pixel sensor cells, and design structures for a pixel sensor cell. The pixel sensor cell has a gate structure that includes a gate dielectric and a gate electrode on the gate dielectric. The gate electrode includes a layer with first and second sections that have a juxtaposed relationship on the gate dielectric. The second section of the gate electrode is comprised of a conductor, such as doped polysilicon or a metal. The first section of the gate electrode is comprised of a metal having a higher work function than the conductor comprising the second section so that the gate structure has an asymmetric threshold voltage.
摘要翻译：像素传感器单元，制造像素传感器单元的方法以及像素传感器单元的设计结构。像素传感器单元具有在栅极电介质上包括栅极电介质和栅电极的栅极结构。栅极电极包括具有在栅极电介质上具有并置关系的第一和第二部分的层。栅电极的第二部分由诸如掺杂多晶硅或金属的导体组成。栅电极的第一部分由具有比包括第二部分的导体更高的功函的金属组成，使得栅极结构具有非对称阈值电压。

8. 发明授权

US08536018B1 Maskless inter-well deep trench isolation structure and methods of manufacture 有权
标题翻译：无掩膜深沟槽隔离结构及制造方法
公开(公告)号：US08536018B1
公开(公告)日：2013-09-17
申请号：US13467314
申请日：2012-05-09
申请人： Brent A. Anderson , Andres Bryant , Josephine B. Chang , Michael A. Guillorn , Ryoji Hasumi , Edward J. Nowak , Mickey H. Yu
发明人： Brent A. Anderson , Andres Bryant , Josephine B. Chang , Michael A. Guillorn , Ryoji Hasumi , Edward J. Nowak , Mickey H. Yu
IPC分类号： H01L27/108
CPC分类号： H01L21/76283 , H01L21/76232 , H01L21/84
摘要： A low power maskless inter-well deep trench isolation structure and methods of manufacture such structure are provided. A method includes depositing a plurality of layers over a substrate, and forming a layer over the plurality of layers. The method also includes forming well structures in the substrate, and forming sidewall spacers at opposing sides of the layer. The method further includes forming a self-aligned deep trench in the substrate to below the well structures, by removing the sidewall spacers and portions of the substrate aligned with an opening formed by the removal of the sidewall spacers. The method also includes forming a shallow trench in alignment with the deep trench. The method further includes forming shallow trench isolation structures and deep trench isolation structures by filling the shallow trench and the deep trench with insulator material.
摘要翻译：提供了一种低功率无掩膜深沟槽隔离结构及其制造方法。一种方法包括在衬底上沉积多个层，并在多个层上形成层。该方法还包括在衬底中形成阱结构，以及在层的相对侧形成侧壁间隔物。该方法还包括通过去除侧壁间隔件和与通过去除侧壁间隔件形成的开口对准的衬底的部分，将衬底中的自对准深沟槽形成在阱结构下方。该方法还包括形成与深沟槽对准的浅沟槽。该方法还包括通过用绝缘体材料填充浅沟槽和深沟槽来形成浅沟槽隔离结构和深沟槽隔离结构。

9. 发明授权

US08378394B2 Method for forming and structure of a recessed source/drain strap for a MUGFET 有权
标题翻译：用于MUGFET的凹陷源/排水带的形成和结构的方法
公开(公告)号：US08378394B2
公开(公告)日：2013-02-19
申请号：US12876343
申请日：2010-09-07
申请人： Brent A. Anderson , Andres Bryant , Edward J. Nowak , Jed H. Rankin
发明人： Brent A. Anderson , Andres Bryant , Edward J. Nowak , Jed H. Rankin
IPC分类号： H01L29/76
CPC分类号： H01L29/66795 , H01L29/7848 , H01L29/785 , H01L2029/7858
摘要： A method and semiconductor structure includes an insulator layer on a substrate, a plurality of parallel fins above the insulator layer, relative to a bottom of the structure. Each of the fins comprises a central semiconductor portion and conductive end portions. At least one conductive strap may be positioned within the insulator layer below the fins, relative to the bottom of the structure. The conductive strap can be perpendicular to the fins and contact the fins. The conductive strap further includes recessed portions disposed within the insulator layer, below the plurality of fins, relative to the bottom of the structure, and between each of the plurality of fins, and projected portions disposed above the insulator layer, collinear with each of the plurality of fins, relative to the bottom of the structure. The conductive strap is disposed in at least one of a source and a drain region of the semiconductor structure. A gate insulator contacts and covers the central semiconductor portion of the fins, and a gate conductor covers and contacts the gate insulator.
摘要翻译：一种方法和半导体结构包括在衬底上的绝缘体层，相对于该结构的底部在绝缘体层之上的多个平行的鳍。每个翅片包括中心半导体部分和导电端部。至少一个导电带可以相对于结构的底部定位在翅片下方的绝缘体层内。导电带可以垂直于翅片并接触翅片。导电带还包括设置在绝缘体层内的凹部，相对于结构的底部在多个散热片的下方，以及设置在绝缘体层之上的每个散热片之间的突出部分，多个翅片相对于结构的底部。导电带设置在半导体结构的源极和漏极区域中的至少一个中。栅极绝缘体接触并覆盖翅片的中心半导体部分，并且栅极导体覆盖并接触栅极绝缘体。

10. 发明申请

US20120301990A1 PIXEL SENSOR CELL WITH A DUAL WORK FUNCTION GATE ELECTODE 有权
公开(公告)号：US20120301990A1
公开(公告)日：2012-11-29
申请号：US13571986
申请日：2012-08-10
申请人： Brent A. Anderson , Andres Bryant , William F. Clark, JR. , John J. Ellis-Monaghan , Edward J. Nowak
发明人： Brent A. Anderson , Andres Bryant , William F. Clark, JR. , John J. Ellis-Monaghan , Edward J. Nowak
IPC分类号： H01L31/18
CPC分类号： H01L27/14614
摘要： Pixel sensor cells, methods of fabricating pixel sensor cells, and design structures for a pixel sensor cell. The pixel sensor cell has a gate structure that includes a gate dielectric and a gate electrode on the gate dielectric. The gate electrode includes a layer with first and second sections that have a juxtaposed relationship on the gate dielectric. The second section of the gate electrode is comprised of a conductor, such as doped polysilicon or a metal. The first section of the gate electrode is comprised of a metal having a higher work function than the conductor comprising the second section so that the gate structure has an asymmetric threshold voltage.

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