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    • 1. 发明申请
    • NOR Flash Memory and Fabrication Process
    • NOR闪存和制造工艺
    • US20070257299A1
    • 2007-11-08
    • US11381948
    • 2006-05-05
    • Bomy ChenPrateep TuntasoodDer-Tsyr Fan
    • Bomy ChenPrateep TuntasoodDer-Tsyr Fan
    • H01L29/788
    • H01L29/7885G11C16/0425G11C16/0433G11C16/0491H01L27/115H01L27/11521H01L27/11524H01L29/42328
    • Semiconductor memory array and process of fabrication in which a plurality of bit line diffusions are formed in a substrate, and memory cells formed in pairs between the bit line diffusions, with each of the pairs of cells having first and second conductors adjacent to the bit line diffusions, floating gates beside the first and second conductors, an erase gate between the floating gates, and a source line diffusion in the substrate beneath the erase gate, and at least one additional conductor capacitively coupled to the floating gates. In some disclosed embodiments, the conductors adjacent to the bit line diffusions are word lines, and the additional conductors consist of either a pair of coupling gates which are coupled to respective ones of the floating gates or a single coupling gate which is coupled to both of the floating gates. In another embodiment, the conductors adjacent to the bit line diffusions are program lines, and the third conductors are word lines which extend in a direction perpendicular to the program lines and the diffusions.
    • 半导体存储器阵列及其制造方法,其中在衬底中形成多个位线扩散,以及在位线扩散之间成对形成的存储单元,其中每对单元具有与位线相邻的第一和第二导体 在第一和第二导体旁边的扩散,浮置栅极,浮置栅极之间的擦除栅极以及在擦除栅极下方的衬底中的源极线扩散以及电容耦合到浮动栅极的至少一个附加导体。 在一些公开的实施例中,与位线扩散相邻的导体是字线,并且附加导体由耦合到相应浮动栅极的一对耦合栅极或耦合到两个 浮动门。 在另一个实施例中,与位线扩散相邻的导体是编程线,并且第三导体是在垂直于编程线和扩散的方向上延伸的字线。
    • 2. 发明授权
    • NOR flash memory
    • NOR闪存
    • US07598561B2
    • 2009-10-06
    • US11381948
    • 2006-05-05
    • Bomy ChenPrateep TuntasoodDer-Tsyr Fan
    • Bomy ChenPrateep TuntasoodDer-Tsyr Fan
    • H01L29/788
    • H01L29/7885G11C16/0425G11C16/0433G11C16/0491H01L27/115H01L27/11521H01L27/11524H01L29/42328
    • Semiconductor memory array and process of fabrication in which a plurality of bit line diffusions are formed in a substrate, and memory cells formed in pairs between the bit line diffusions, with each of the pairs of cells having first and second conductors adjacent to the bit line diffusions, floating gates beside the first and second conductors, an erase gate between the floating gates, and a source line diffusion in the substrate beneath the erase gate, and at least one additional conductor capacitively coupled to the floating gates. In some disclosed embodiments, the conductors adjacent to the bit line diffusions are word lines, and the additional conductors consist of either a pair of coupling gates which are coupled to respective ones of the floating gates or a single coupling gate which is coupled to both of the floating gates. In another embodiment, the conductors adjacent to the bit line diffusions are program lines, and the third conductors are word lines which extend in a direction perpendicular to the program lines and the diffusions.
    • 半导体存储器阵列及其制造方法,其中在衬底中形成多个位线扩散,以及在位线扩散之间成对形成的存储单元,其中每对单元具有与位线相邻的第一和第二导体 在第一和第二导体旁边的扩散,浮置栅极,浮置栅极之间的擦除栅极以及在擦除栅极下方的衬底中的源极线扩散以及电容耦合到浮动栅极的至少一个附加导体。 在一些公开的实施例中,与位线扩散相邻的导体是字线,并且附加导体由耦合到相应浮动栅极的一对耦合栅极或耦合到两个 浮动门。 在另一个实施例中,与位线扩散相邻的导体是编程线,并且第三导体是在垂直于编程线和扩散的方向上延伸的字线。
    • 3. 发明授权
    • Array of contactless non-volatile memory cells
    • 非接触非易失性存储单元阵列
    • US07800159B2
    • 2010-09-21
    • US11923515
    • 2007-10-24
    • Yuniarto WidjajaHenry A. O'M'ManiPrateep TuntasoodBomy Chen
    • Yuniarto WidjajaHenry A. O'M'ManiPrateep TuntasoodBomy Chen
    • H01L29/788
    • H01L27/115H01L21/28273H01L27/11521H01L29/42328H01L29/66825H01L29/7881
    • A plurality of non-volatile memory cell units are arranged in rows and columns in a single crystalline semiconductor substrate of a first conductivity type. Each cell unit has a first region of a second conductivity type in the substrate along the planar surface, and a second region of the second conductivity, spaced apart from the first region, with a channel region therebetween. The channel region has a first portion adjacent to the first region, a third portion adjacent to the second region and a second portion therebetween. A first and second floating gates are over the first portion and third portion respectively and are insulated therefrom. A first and second control gates are over the first and second floating gates respectively and are capacitively coupled thereto. A first and second erase gates are over the first and second regions respectively and are insulated therefrom. A word line is over the second portion and is insulated therefrom. Electrical contacts to the array are made along the extremities of the array.
    • 多个非易失性存储单元单元以第一导电类型的单晶半导体衬底中的行和列布置。 每个单元单元具有沿着平面的基板中的第二导电类型的第一区域和与第一区域间隔开的第二导电体的第二区域,其间具有沟道区域。 通道区域具有与第一区域相邻的第一部分,与第二区域相邻的第三部分和在其间的第二部分。 第一和第二浮动栅极分别在第一部分和第三部分之上,并与之绝缘。 第一和第二控制栅极分别在第一和第二浮置栅极之上并与其电容耦合。 第一和第二擦除栅极分别在第一和第二区域之上并与之绝缘。 字线在第二部分之上并与之绝缘。 阵列的电触点沿着阵列的末端进行。
    • 7. 发明申请
    • Novel chalcogenide material, switching device and array of non-volatile memory cells
    • 新型硫族化物材料,开关器件和非易失性存储器单元阵列
    • US20070278471A1
    • 2007-12-06
    • US11443876
    • 2006-05-30
    • Bomy ChenYin Yin Lin
    • Bomy ChenYin Yin Lin
    • H01L29/06
    • H01L27/2472G11C13/0004G11C13/0069G11C2013/008H01L27/2481H01L45/06H01L45/1206H01L45/122H01L45/126H01L45/144
    • A novel chalcogenide material has a bulk composition which has a first material selected from the group of Si and Sn, a second material selected from the group of Sb, and a third material selected from the group of Te. The first material, second material, and third material are in a ratio of (Six or Sny) Sb2 Te5, where x is 1≦x≦5, and y is 0.5≦y≦2.0. The material can be used in a switch device, which includes a dielectric/heater layer having a first surface and a second surface opposite the first surface, and the material having a first surface and a second surface opposite the first surface; with the first surface of the material immediately adjacent to and in contact with the first surface of the dielectric/heater layer. A first electrical contact is on the second surface of the dielectric/heater layer. A second electrical contact is on the second surface of the phase changing chalcogenide material. A third electrical contact is on the second surface of the phase changing chalcogenide material, spaced apart from the second electrical contact. The switching device can be programmed such that the channel length separation between the second electrical contact and the third electrical contact on the phase changing chalcogenide material is changed to represent the desired state to be stored in the device. Finally, an array of the above described non-volatile memory cells can be formed in a dielectric/heater layer and the chalcogenide material.
    • 新型硫族化物材料具有本体组合物,其具有选自Si和Sn的第一材料,选自Sb的第二材料和选自Te组的第三材料。 第一材料,第二材料和第三材料的比例为(Si x Si x Si y Sb y Sb 2 Sb 2 O 3) ,其中x是1 <= x <= 5,y是0.5 <= y <= 2.0。 该材料可以用在开关装置中,其包括具有第一表面和与第一表面相对的第二表面的电介质/加热器层,并且该材料具有与第一表面相对的第一表面和第二表面; 其中材料的第一表面紧邻电介质/加热器层的第一表面并与其接触。 电介质/加热器层的第二表面上具有第一电接触。 第二个电触点位于相变硫族化物材料的第二个表面上。 相变硫族化物材料的第二表面上的第三电接触与第二电触点间隔开。 切换装置可以被编程为使得在相变硫属化物材料上的第二电接触和第三电接触之间的通道长度间隔被改变以表示要存储在设备中的期望状态。 最后,可以在电介质/加热器层和硫族化物材料中形成上述非易失性存储单元的阵列。
    • 8. 发明授权
    • Dynamically tunable resistor or capacitor using a non-volatile floating gate memory cell
    • 使用非易失性浮动栅极存储单元的动态可调谐电阻或电容
    • US07245529B2
    • 2007-07-17
    • US11092227
    • 2005-03-28
    • Bomy ChenKevin Gene-Wah Jew
    • Bomy ChenKevin Gene-Wah Jew
    • G11C11/34
    • G11C27/005G11C16/10
    • An integrated circuit programmable resistor or programmable capacitor has a floating gate memory cell connected either in series or in parallel to a fixed resistor or a fixed capacitor. The resistance or the capacitance of the floating gate memory cell can be changed by the amount of charge stored on the floating gate which affects the resistance or the capacitance of the channel from which the floating gate is spaced apart. A particular application of the programmable resistor/capacitor is used in a system whereby the resistance or the capacitance can be change or fine tuned as a result of either drift caused by time or by operating conditions such as temperature. Thus, the temperature of the substrate in which the floating gate memory cell is fabricated can be monitored and the resistance or the capacitance of the floating gate memory cell changed dynamically.
    • 集成电路可编程电阻器或可编程电容器具有与固定电阻器或固定电容器串联或并联连接的浮动栅极存储器单元。 可以通过浮动栅极上存储的电荷量来改变浮动栅极存储单元的电阻或电容,影响浮动栅极间隔开的沟道的电阻或电容。 可编程电阻器/电容器的特定应用在系统中使用,由此由于由时间引起的漂移或诸如温度的操作条件导致的电阻或电容可以改变或微调。 因此,可以监视其中制造浮动栅极存储单元的衬底的温度,并且动态地改变浮动栅极存储单元的电阻或电容。
    • 9. 发明授权
    • Self aligned method of forming a semiconductor memory array of floating gate memory cells with buried floating gate and pointed channel region
    • 形成具有埋置浮栅和尖通道区域的浮栅存储器单元的半导体存储器阵列的自对准方法
    • US07208376B2
    • 2007-04-24
    • US11070079
    • 2005-03-01
    • Bomy ChenYing Kit TsuiWen-Juei Lu
    • Bomy ChenYing Kit TsuiWen-Juei Lu
    • H01L21/8247
    • H01L27/11556H01L27/115H01L29/42336H01L29/7885
    • A method of forming an array of floating gate memory cells, and an array formed thereby, wherein a trench is formed into a surface of a semiconductor substrate. The source region is formed underneath the trench, the drain region is formed along the substrate surface, and the channel region therebetween includes a first portion extending vertically along the trench sidewall and a second portion extending horizontally along the substrate surface. The floating gate is disposed in the trench adjacent to and insulated from the channel region first portion. The control gate is disposed over and insulated from the channel region second portion. The trench sidewall meets the substrate surface at an acute angle to form a sharp edge. The channel region second portion extends from the second region in a direction toward the sharp edge and the floating gate to define a path for programming the floating gate with electrons via hot electron injection.
    • 一种形成浮置栅极存储单元阵列的方法,以及由此形成的阵列,其中沟槽形成在半导体衬底的表面中。 源极区形成在沟槽下方,漏极区沿着衬底表面形成,并且其间的沟道区包括沿着沟槽侧壁垂直延伸的第一部分和沿衬底表面水平延伸的第二部分。 浮动栅极设置在与沟道区域第一部分相邻并与沟槽区域第一部分绝缘的沟槽中。 控制栅极设置在通道区域第二部分之上并与沟道区域第二部分绝缘。 沟槽侧壁以锐角与衬底表面相接触以形成锋利的边缘。 沟道区域第二部分从朝向尖锐边缘的方向从第二区域延伸,并且浮置栅极限定用于通过热电子注入用电子编程浮动栅极的路径。
    • 10. 发明授权
    • Semiconductor memory array of floating gate memory cells with buried floating gate, pointed floating gate and pointed channel region
    • 半导体存储器阵列的浮动栅极存储单元具有埋入浮栅,尖浮栅和尖通道区
    • US07180127B2
    • 2007-02-20
    • US10872052
    • 2004-06-17
    • Bomy ChenDana Lee
    • Bomy ChenDana Lee
    • H01L29/788
    • H01L27/11521H01L21/28273H01L29/42336H01L29/66825H01L29/7885
    • A method of forming a floating gate memory cell array, and the array formed thereby, wherein a trench is formed into the surface of a semiconductor substrate. The source and drain regions are formed underneath the trench and along the substrate surface, respectively, with a non-linear channel region therebetween. The floating gate has a lower portion disposed in the trench and an upper portion disposed above the substrate surface and having a lateral protrusion extending parallel to the substrate surface. The lateral protrusion is formed by etching a cavity into an exposed end of a sacrificial layer and filling it with polysilicon. The control gate is formed about the lateral protrusion and is insulated therefrom. The trench sidewall meets the substrate surface at an acute angle to form a sharp edge that points toward the floating gate and in a direction opposite to that of the lateral protrusion.
    • 一种形成浮栅存储单元阵列的方法和由此形成的阵列,其中沟槽形成在半导体衬底的表面中。 源极和漏极区分别形成在沟槽下方并且沿着衬底表面,其间具有非线性沟道区。 浮动栅极具有设置在沟槽中的下部和设置在基板表面上方并具有平行于基板表面延伸的横向突起的上部。 横向突起通过将空腔蚀刻到牺牲层的暴露端并用多晶硅填充而形成。 控制门围绕横向突起形成并与其绝缘。 沟槽侧壁以锐角与衬底表面相接触以形成指向浮动栅极并且沿与横向突起的方向相反的方向的尖锐边缘。