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1. 发明授权

US06852201B2 Sputter target and method of using a sputter target 有权
标题翻译：溅射靶和使用溅射靶的方法
公开(公告)号：US06852201B2
公开(公告)日：2005-02-08
申请号：US10344128
申请日：2001-08-07
申请人： Bernd Hermeler , Alexander Wuropulos
发明人： Bernd Hermeler , Alexander Wuropulos
IPC分类号： C23C14/34
CPC分类号： C23C14/3414
摘要： A sputtering target used in carrying out a PVD coating process where the sputtering target is sputtered by bombardment with gas atoms and a layer consisting of several metallic elements is deposited onto a substrate, the sputtering target being a plate made of a metal used for building up the layer, and with the other metals used for building up the layer being present at least partially in the form of plugs, which are inserted in holes in the plate, the shape of the free surfaces of the plugs being selected in such a way that the sputtering rate for each metal used in the sputtering process can be set according to the desired composition of the layer being applied.
摘要翻译：用于进行PVD涂覆工艺的溅射靶，其中通过用气体原子轰击溅射溅射靶和由若干金属元素组成的层而沉积到衬底上，溅射靶是由用于构建的金属制成的板所述层以及用于构建所述层的其它金属至少部分地以塞子的形式存在于所述板中的孔中，所述插塞的自由表面的形状被选择为使得可以根据所施加的层的期望组成来设定溅射工艺中使用的每种金属的溅射速率。

2. 发明授权

US06352627B2 Method and device for PVD coating 有权
标题翻译： PVD涂层的方法和装置
公开(公告)号：US06352627B2
公开(公告)日：2002-03-05
申请号：US09402961
申请日：1999-10-14
申请人： Antonius Leyendecker , Georg Erkens , Stefan Esser , Hans-Gerd Fuss , Bernd Hermeler , Rainer Wenke
发明人： Antonius Leyendecker , Georg Erkens , Stefan Esser , Hans-Gerd Fuss , Bernd Hermeler , Rainer Wenke
IPC分类号： C23C1434
CPC分类号： C23C14/345 , C23C14/3464 , H01J37/34 , H01J37/3444
摘要： The invention relates to a PVD coating method and to a PVD coating device with a chamber in which at least one target cathode, at least one anode and at least one substrate holder which is intended to hold at least one substrate are arranged, and with a control device which delivers a first voltage in order to supply the target cathode with a negative electrical potential relative to the anode in order to form a plasma in which the substrate is arranged, and which delivers a second voltage in order to supply the anode with a positive electrical potential relative to the chamber wall. In this sputter-coating device, the ion fraction of the target material which can be achieved is too low for qualitatively satisfactory coating properties. It is increased according to the invention in that the control device delivers a third voltage which supplies the substrate with an electrical potential that is more negative than the potential of the anode.
摘要翻译：本发明涉及一种PVD涂覆方法以及具有室的PVD涂覆装置，其中布置有至少一个靶阴极，至少一个阳极和至少一个用于容纳至少一个基板的基板保持器，并且具有控制装置，其传递第一电压，以便相对于所述阳极向所述目标阴极提供负电位，以便形成其中布置所述衬底的等离子体，并且所述等离子体传送第二电压以向所述阳极提供相对于室壁的正电位。在这种溅射涂布装置中，可以实现的目标材料的离子分数对于定性满意的涂层性能而言太低。根据本发明，增加了控制装置传送第三电压，该第三电压向基板提供比阳极电位更负的电位。

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