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    • 2. 发明授权
    • Method and device for PVD coating
    • PVD涂层的方法和装置
    • US06352627B2
    • 2002-03-05
    • US09402961
    • 1999-10-14
    • Antonius LeyendeckerGeorg ErkensStefan EsserHans-Gerd FussBernd HermelerRainer Wenke
    • Antonius LeyendeckerGeorg ErkensStefan EsserHans-Gerd FussBernd HermelerRainer Wenke
    • C23C1434
    • C23C14/345C23C14/3464H01J37/34H01J37/3444
    • The invention relates to a PVD coating method and to a PVD coating device with a chamber in which at least one target cathode, at least one anode and at least one substrate holder which is intended to hold at least one substrate are arranged, and with a control device which delivers a first voltage in order to supply the target cathode with a negative electrical potential relative to the anode in order to form a plasma in which the substrate is arranged, and which delivers a second voltage in order to supply the anode with a positive electrical potential relative to the chamber wall. In this sputter-coating device, the ion fraction of the target material which can be achieved is too low for qualitatively satisfactory coating properties. It is increased according to the invention in that the control device delivers a third voltage which supplies the substrate with an electrical potential that is more negative than the potential of the anode.
    • 本发明涉及一种PVD涂覆方法以及具有室的PVD涂覆装置,其中布置有至少一个靶阴极,至少一个阳极和至少一个用于容纳至少一个基板的基板保持器,并且具有 控制装置,其传递第一电压,以便相对于所述阳极向所述目标阴极提供负电位,以便形成其中布置所述衬底的等离子体,并且所述等离子体传送第二电压以向所述阳极提供 相对于室壁的正电位。 在这种溅射涂布装置中,可以实现的目标材料的离子分数对于定性满意的涂层性能而言太低。 根据本发明,增加了控制装置传送第三电压,该第三电压向基板提供比阳极电位更负的电位。