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1. 发明公开

KR20200142056A 간섭계 및 간섭계 제조 방법 审中-公开
公开(公告)号：KR20200142056A
公开(公告)日：2020-12-21
申请号：KR20207032544
申请日：2019-04-10
申请人： BOSCH GMBH ROBERT
发明人： NOLTEMEYER RALF , HUBER CHRISTIAN , ROEDEL REINHOLD , STEIN BENEDIKT , SCHELLING CHRISTOPH , KRAEMMER CHRISTOPH DANIEL
IPC分类号： G01J3/26 , G01J3/02 , G02B26/00
摘要： 본발명은작동리세스(108)를갖는홀딩요소(106), 상기작동리세스(108) 반대편의홀딩요소(106) 상에배치되거나배치될수 있는제 1 미러요소(102), 및광학갭(112)을형성하기위해미러거리로제 1 미러요소(102) 반대편에배치되거나배치될수 있는제 2 미러요소(104)로구성된간섭계(100)에관한것이다. 상기제 1 미러요소(102)는제 2 미러요소(104)와홀딩요소(106) 사이에배치되거나배치될수 있고, 광학갭(112)은제 1 미러요소(102)에의해작동리세스(108)로부터공간적으로분리된다. 간섭계(100)는미러요소(102) 또는 (104) 중하나상에또는내에규정되는, 배치되는및/또는배치될수 있는제 1 작동전극(114), 및제 1 작동전극(114) 반대편에놓인작동리세스(108)의측면에규정되는, 배치되는및/또는배치될수 있는제 2 작동전극(116)으로이루어진전극쌍을더 포함한다. 상기미러거리는상기전극쌍에전압을인가함으로써변경될수 있다.

2. 发明专利

JP2005031078A SENSOR ELEMENT 审中-公开
公开(公告)号：JP2005031078A
公开(公告)日：2005-02-03
申请号：JP2004198315
申请日：2004-07-05
申请人： BOSCH GMBH ROBERT
发明人： FUERTSCH MATTHIAS , WEBER HERIBERT , SCHELLING CHRISTOPH
IPC分类号： G01P5/12 , G01F1/684 , G01F1/692 , G01F1/696 , G01N27/26 , G01P15/00 , H05B1/02
摘要： PROBLEM TO BE SOLVED: To enhance the accuracy and sensitivity of measurement of a sensor element which has a heating structure body. SOLUTION: The enhancement of the measurement sensitivity can be solved by mounting a measuring track with an additional high resistance to a means for detecting the resistance, and by composing so as to take out a voltage directly by using the measuring track at each part of the heating structure body. COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明申请

WO2013182335A3 SENSOR ARRANGEMENT FOR SENSING ROTATION ANGLES ON A ROTATING COMPONENT 审中-公开
标题翻译：进行收购事项之自转传感器配置角度上的旋转部件
公开(公告)号：WO2013182335A3
公开(公告)日：2014-07-03
申请号：PCT/EP2013057295
申请日：2013-04-08
申请人： BOSCH GMBH ROBERT
发明人： SCHELLING CHRISTOPH , HAS REMIGIUS
IPC分类号： G01D5/347
CPC分类号： G01D5/3473
摘要： The invention relates to a sensor arrangement (1) for sensing rotation angles on a rotating component (10) coupled to a measurement transmitter (30), which in conjunction with a measuring sensor (50) generates at least one signal (I1, I2, I3) representing the rotation angle of the rotating component (10). According to the invention the measurement transmitter (30) and the measuring sensor (50) are designed as an optical measuring system, wherein the measurement transmitter (30) comprises at least one light source (32) and a shadow mask (40) having at least one transparent aperture (44) through which a measurement beam (MS) generated by the at least one light source (32) can be guided onto a light-sensitive measurement sensor (54) of the measuring sensor (50), wherein an illuminated area (51) of the light-sensitive measurement sensor (54) is dependent upon the current rotation angle of the rotating component (10).
摘要翻译：本发明涉及一种传感器装置（1），用于检测其联接到换能器（30），其代表与测量传感器（50），至少所述旋转部件的旋转角度相结合的旋转构件（10）的旋转角度（10）信号（I1，I2，I3）被产生。根据本发明的发射机（30）和所述换能器（50）被构造为光学测量系统，其中所述发射器（30）包括至少一个光源（32）和具有至少一个透明的开口（44）的荫罩（40），通过该通过所述至少一个光源（32）产生的测量光束（MS）到换能器（50）的光敏感的测量传感器（54）能够被引导，其特征在于，由（10）中的旋转构件的旋转的当前角度的光敏感的测量传感器（54）的照明区域（51），这取决于是。

4. 发明申请

WO2013171010A3 INFRARED SENSOR DEVICE AND METHOD FOR PRODUCING AN INFRARED SENSOR DEVICE 审中-公开
标题翻译：红外线传感器及其制造方法红外线传感器
公开(公告)号：WO2013171010A3
公开(公告)日：2014-10-23
申请号：PCT/EP2013057693
申请日：2013-04-12
申请人： BOSCH GMBH ROBERT
发明人： HERRMANN INGO , SCHELLING CHRISTOPH
IPC分类号： G01J5/20 , G01J5/02 , G01J5/04 , H01L27/146 , H01L31/0352 , H01L31/103
CPC分类号： H01L31/035281 , G01J5/0225 , G01J5/023 , G01J5/024 , G01J5/046 , G01J5/20 , H01L27/1443 , H01L27/14649 , H01L31/02005 , H01L31/028 , H01L31/103 , H01L31/1804 , Y02E10/50
摘要： The invention relates to an infrared sensor device (100) which comprises at least one sensor element (2) formed in a semiconductor substrate (5), a gap (3, 8) being provided in an SOI wafer (1) below and around the sensor element (2); and to a suspension means (10) by which the sensor element is suspended in the SOI wafer (1). The infrared sensor device (100) is characterized in that the sensor element (2) is substantially arranged below the suspension means (10). In this way, a high sensitivity, low thermal capacity, low thermal coupling to the substrate and thus a high image refresh rate can be achieved. The sensor element (2) is a diode, which is formed in single-crystal, substantially U-shaped silicon regions of the semiconductor substrate (5).
摘要翻译：本发明提出一种红外线传感器装置（100），包括至少一个在半导体衬底（5）形成的传感器元件（2），在一个SOI晶片（1）的下方，围绕所述传感器元件（2）周围的间隙（3， 8形成）; 和悬挂装置（10），借助于该在SOI晶片（1）所述传感器元件被挂起。红外线传感器装置（100）的特征在于，所述传感器元件（2）被布置成基本上下方的悬吊装置（10）。因此，高灵敏度，低的热容量，低的热耦合到衬底并因此以高帧频实现。所述传感器元件（2）是在单晶硅二极管，形成（5）在半导体衬底的基本上为U形硅区。

5. 发明申请

WO2009086978A3 PRODUCTION METHOD FOR A MICROMECHANICAL ELECTROSTATIC ADJUSTER DEVICE AND MICROMECHANICAL ELECTROSTATIC ADJUSTER DEVICE 审中-公开
标题翻译： PROCESS微型机械静态修正及MICRO电荷调节
公开(公告)号：WO2009086978A3
公开(公告)日：2010-04-01
申请号：PCT/EP2008065575
申请日：2008-11-14
申请人： BOSCH GMBH ROBERT , PIRK TJALF , PINTER STEFAN , BENZEL HUBERT , WEBER HERIBERT , KRUEGER MICHAEL , SATTLER ROBERT , MUCHOW JOERG , FRITZ JOACHIM , SCHELLING CHRISTOPH , FRIESE CHRISTOPH
发明人： PIRK TJALF , PINTER STEFAN , BENZEL HUBERT , WEBER HERIBERT , KRUEGER MICHAEL , SATTLER ROBERT , MUCHOW JOERG , FRITZ JOACHIM , SCHELLING CHRISTOPH , FRIESE CHRISTOPH
IPC分类号： B81C1/00
CPC分类号： B81C1/00666 , B81B2201/033 , B81B2201/042 , B81B2203/0136 , B81B2203/019 , B81C1/00166 , B81C2201/0167 , H02N1/002
摘要： The invention relates to a production method for a micromechanical electrostatic adjuster device (10), comprising the steps: application of a first conducting layer (12) to a substrate (28,30), etching the first conducting layer (12) to form at least one first electrode (16) in the material of the first conducting layer (12), application of a separation layer (32a) to the first conducting layer (12), application of a second conducting layer to the separation layer (32a), etching the second conducting layer to form at least one second electrode (22) in the material of the second conducting layer and application of a cover layer (40) to the second electrode (22) and bending the second electrode (22) by means of a mechanical compression load exerted on the second electrode (22) by means of the cover layer (40). The invention further relates to a corresponding micromechanical electrostatic adjuster device.
摘要翻译：本发明涉及一种用于微机械静电调节器（10）的制造方法，包括以下步骤：基部（28,30）上沉积第一导电层（12），蚀刻所述第一导电层（12），用于形成至少一个第一电极（ 16）从第一导电层（12）的材料，在施加第一导电层（12）上的脱模层（32a），其上沉积隔离层（32A）上的第二导电层，蚀刻第二导电层，以形成至少一个从第二导电层的材料，并施加于第二电极（22）的覆盖层（40）和由在第二电极上的覆盖层（40）中的一个的装置的第二电极（22）的弯曲的第二电极（22）（22）施加机械压应力。本发明还涉及一种相应的微机械静电调节器。

6. 发明申请

WO2009149979A2 PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT, CORRESPONDING COMPOSITE COMPONENT AND CORRESPONDING MICROMECHANICAL COMPONENT 审中-公开
标题翻译：对于微机械部件，这样的部件复合材料和相应的微机械结构制作工艺
公开(公告)号：WO2009149979A2
公开(公告)日：2009-12-17
申请号：PCT/EP2009054695
申请日：2009-04-21
申请人： BOSCH GMBH ROBERT , BENZEL HUBERT , HENNING FRANK , SCHARPING ARMIN , SCHELLING CHRISTOPH
发明人： BENZEL HUBERT , HENNING FRANK , SCHARPING ARMIN , SCHELLING CHRISTOPH
IPC分类号： B81C1/00
CPC分类号： B81C3/001 , B81B2201/0264 , B81C2201/019 , G01L9/0055
摘要： The invention relates to a production method for a micromechanical component, to a corresponding composite component and to a corresponding micromechanical component. The method has the following steps: provision of a first composite (W1; W1'; W1''; W1''') of a plurality of semiconductor chips (SC1, SC2, SC3; SC2''; SC1''', SC2'''; SC3'''), the first composite having a first front surface (V1; V1'; V1''; V1''') and a first rear surface (R1; R1'; R1''; R1'''); provision of a second composite (W2; W2') of a corresponding plurality of carrier substrates (SS1, SS2, SS3; SS1''', SS2''', SS3'''), the second composite having a second front surface (V2; V2''') and a second rear surface (R2; R2'''); printing of a structured adhesion promoter layer (SG) onto the first front surface (V1; V1'; V1''; V1''') and/or the second front surface (V2; V2'''), said layer having degassing channels (SK, KG); alignment of the first front surface (V1; V1'; V1''; V1''') and the second front surface (V2; V2''') corresponding to a plurality of micromechanical components, each having a semiconductor chip (SC1, SC2, SC3; SC2''; SC1''', SC2'''; SC3''') and a corresponding carrier substrate (SS1, SS2, SS3; SS1''', SS2''', SS3'''); connection of the first front surface (V1; V1'; V1''; V1''') and the second front surface (V2; V2''') by means of the structured adhesion promoter layer (SG) by the application of pressure, in such a way that each semiconductor chip (SC1, SC2,SC3; SC2''; SC1''', SC2'''; SC3''') is connected to a corresponding carrier substrate (SS1, SS2, SS3; SS1''',SS2''', SS3''') corresponding to a micromechanical component, permitting a gas in the ambient atmosphere to escape to the exterior through the degassing channels (SK, KG); and separation of the micromechanical components.
摘要翻译：本发明提供了一种用于微机械部件，相应的装置和相应的复合微机械部件的制造方法。该方法包括以下步骤：提供一个第一网络（W1，W1 'W1' '; W1' ''） '的多个半导体芯片（SC1，SC2，SC3，SC2的'; SC1 ''”，SC2' '' ; SC3 '' '），所述第一复合材料的第一前表面（V1，V1'; '; V1' V1 '' '）和第一后表面（R1; R1'，R1'，R1 ''“）包括：提供第二复合物; '（; ''，SS2 ''”，SS3' '' 的相应的多个载体基质SS1，SS2，SS3 SS1）的（W2 W2）'，其中所述第二化合物，第二前表面（V2; V2 '' '）和第二后表面（R2; R2' 包括 ''）; 印刷图案化的粘合促进层（SG）的第一前表面（ '; V1' V1 V1 'V1' ''）和/或第二前表面（V2; V2 '''），其Ausgasungskanäle（SK，KG）包括：对准第一前表面（“; V1” V1 V1“ V1' ‘’）;对应于多个微机械装置，每个具有一个半导体芯片（SC1，SC2，SC3和第二前表面（V2‘’” V2） ; '; SC3'; SC2 '' SC1 '' 'SC2' '' '）和对应的支撑基板（SS1，SS2，SS3; SS1' '' 有，连接 '）'，SS2 '''，SS3' 第一前表面（“; V1” V1 V1“ V1' ‘’）和第二前表面（V2; V2‘’”）在与压力，使得每一个半导体芯片的应用图案化的粘合促进层（SG）（SC1， SC2，SC3，SC2 ''; SC1 ''; SC3 '' '）与相应的载体基板（SS1，SS2，SS3，' 'SC2' '对应于SS1' '）'，SS2 '''，SS3' '' 被连接到相应的微型机械装置，其特征在于，一个气体通过Ausgasungskanäle（SK，KG）周围大气可以逸出到外部，和微机械部件的分离。

7. 发明申请

WO2009089946A3 MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT 审中-公开
标题翻译：微机械结构和方法微机械结构
公开(公告)号：WO2009089946A3
公开(公告)日：2010-01-21
申请号：PCT/EP2008065572
申请日：2008-11-14
申请人： BOSCH GMBH ROBERT , BENZEL HUBERT , SCHELLING CHRISTOPH
发明人： BENZEL HUBERT , SCHELLING CHRISTOPH
IPC分类号： B81B3/00 , G02B26/08
CPC分类号： G02B26/0841 , B81B3/0021 , B81B2201/032 , B81B2201/038 , B81B2201/042 , G02B26/0825 , G02B26/0858
摘要： The invention relates to a micromechanical component (10) comprising a support (12) having a recess (14) on a surface of the support (12); a membrane (16) which covers the recess (14) to at least some degree; at least one active element (24) with voltage connections arranged on the membrane (16); the active element (24) being designed to vary its spatial extension when a voltage is applied to the active element (24) and to deform the membrane (16); and a microelement (22), arranged on the membrane (16), which can be adjusted by way of a deformation of the membrane (16) due to the application of voltage to the active element (24). The invention further relates to a method for producing a micromechanical component (10) and to a method for operating a micromechanical component (10).
摘要翻译：本发明涉及一种具有在支架的一个表面上的保持器（12）配有一微机械部件（10）（12）形成的凹槽（14）; 的膜（16）连接所述凹部（14）至少部分地覆盖; 至少一个在所述膜（16）布置成与电压端子有源元件（24）; 其中所述有源元件（24）适于在施加电压以改变所述有源元件（24），其空间膨胀和变形膜（16）; 和布置成一个，其是可调节由所述膜（16）的变形而通过将电压施加到所述有源元件（24）的膜（16）的微元件（22）上。此外，本发明涉及一种用于微机械部件（10）和用于操作的微机械部件（10）的方法的制造方法。

8. 发明申请

WO2009124605A2 MICROMECHANICAL COMPONENT HAVING A SLANTED STRUCTURE AND CORRESPONDING PRODUCTION METHOD 审中-公开
标题翻译：与斜面结构及相应方法微机械结构
公开(公告)号：WO2009124605A2
公开(公告)日：2009-10-15
申请号：PCT/EP2008066388
申请日：2008-11-28
申请人： BOSCH GMBH ROBERT , PIRK TJALF , PINTER STEFAN , BENZEL HUBERT , WEBER HERIBERT , KRUEGER MICHAEL , SATTLER ROBERT , NJIKAM NJIMONZIE FREDERIC , MUCHOW JOERG , FRITZ JOACHIM , SCHELLING CHRISTOPH , FRIESE CHRISTOPH
发明人： PIRK TJALF , PINTER STEFAN , BENZEL HUBERT , WEBER HERIBERT , KRUEGER MICHAEL , SATTLER ROBERT , NJIKAM NJIMONZIE FREDERIC , MUCHOW JOERG , FRITZ JOACHIM , SCHELLING CHRISTOPH , FRIESE CHRISTOPH
IPC分类号： B81C1/00
CPC分类号： B81C1/00103 , B81B2203/0118 , B81B2203/0307
摘要： The invention relates to a micromechanical component having a slanted structure and to a corresponding production method. Said component comprises a substrate (1) having a surface (O); a first anchor (3e; 3e') that is provided on the surface (O) of the substrate (1) and which extends away from the substrate (1); and at least one arm (3c, 3d; 3c; 3c') that is oriented away from the anchor (3e; 3e') and that is provided on one lateral surface (S1, S2; S1'; S1'') of the anchor (3e; 3e').
摘要翻译：本发明提供了螺旋结构和相应的制造方法的微机械部件。该组件包括具有表面（O）的基板（1）; 在基板（1）的表面上的第一锚（3E，3E“），该（O）被设置，并且从衬底（1）延伸离开; 指向离开和在侧面的至少一个; '（其被从电枢倾斜臂3c和3d，3c和3c）中所提供的电枢的（S1，S2 S1”，S1' '）（3E，3E） '（图3e' 3E）是。

9. 发明申请

WO2013011114A4 COMPONENT HAVING A MICROMECHANICAL MICROPHONE STRUCTURE 审中-公开
标题翻译：微机械麦克风结构的施工要素
公开(公告)号：WO2013011114A4
公开(公告)日：2013-08-22
申请号：PCT/EP2012064251
申请日：2012-07-20
申请人： BOSCH GMBH ROBERT , ZOELLIN JOCHEN , LAERMER FRANZ , DALEY MIKE , SCHELLING CHRISTOPH
发明人： ZOELLIN JOCHEN , LAERMER FRANZ , DALEY MIKE , SCHELLING CHRISTOPH
IPC分类号： H04R19/04 , H01L29/84
CPC分类号： H04R7/06 , B81B3/0051 , B81B2201/0257 , H04R19/005 , H04R19/04 , H04R2201/003
摘要： The invention relates to possibilities for realizing substrate-side overload protection for the membrane structure of a microphone component having a micromechanical microphone structure, which overload protection impairs the damping properties of the microphone structure as little as possible. The microphone structure comprises a membrane structure (2) having at least one acoustically active membrane (11), which is formed in a membrane layer over a semiconductor substrate (1). The membrane structure spans at least one sound opening (13) in the rear side of the substrate. A stationary acoustically permeable counter element (14) is formed over the membrane layer in the layer structure of the component (10). According to the invention, at least projections (17) are formed at the outer edge area of the membrane structure (2), which projections project beyond the edge area of the sound opening (13), such that the edge area of the sound opening (13) acts as a substrate-side stop for the membrane structure (2).
摘要翻译：提出了用于实现具有微机械麦克风结构的麦克风部件的膜结构的基板侧过载保护的可能性，其尽可能少地影响麦克风结构的阻尼特性。该麦克风结构包括具有至少一个声学活性膜（11）的膜结构（2），该声学活性膜形成在半导体衬底（1）上方的膜层中。它跨越基板背面的至少一个声音开口（13）。固定的声学可透相对元件（14）形成在膜层上的部件（10）的层结构中。至少延伸部（17）根据本发明在膜结构的外边缘区域（2）被形成，其突出于声音开口（13）的外周，从而使声音开口（13）作为底侧抵接的隔膜结构的边缘区域（2）作用。

10. 发明申请

WO2013011114A3 COMPONENT HAVING A MICROMECHANICAL MICROPHONE STRUCTURE 审中-公开
标题翻译：带麦克风的微观力学结构件
公开(公告)号：WO2013011114A3
公开(公告)日：2013-07-04
申请号：PCT/EP2012064251
申请日：2012-07-20
申请人： BOSCH GMBH ROBERT , ZOELLIN JOCHEN , LAERMER FRANZ , DALEY MIKE , SCHELLING CHRISTOPH
发明人： ZOELLIN JOCHEN , LAERMER FRANZ , DALEY MIKE , SCHELLING CHRISTOPH
IPC分类号： H04R19/04 , H01L29/84
CPC分类号： H04R7/06 , B81B3/0051 , B81B2201/0257 , H04R19/005 , H04R19/04 , H04R2201/003
摘要： The invention relates to possibilities for realizing substrate-side overload protection for the membrane structure of a microphone component having a micromechanical microphone structure, which overload protection impairs the damping properties of the microphone structure as little as possible. The microphone structure comprises a membrane structure (2) having at least one acoustically active membrane (11), which is formed in a membrane layer over a semiconductor substrate (1). The membrane structure spans at least one sound opening (13) in the rear side of the substrate. A stationary acoustically permeable counter element (14) is formed over the membrane layer in the layer structure of the component (10). According to the invention, at least projections (17) are formed at the outer edge area of the membrane structure (2), which projections project beyond the edge area of the sound opening (13), such that the edge area of the sound opening (13) acts as a substrate-side stop for the membrane structure (2).
摘要翻译：它提出的方式来实现用于具有微机械传声器结构尽可能少有害的麦克风结构的阻尼特性的麦克风组件的膜结构的衬底侧过载保护。麦克风结构包括具有至少一个声学活性膜（11），其形成在一个薄膜层在半导体衬底上的膜结构（2）（1）。它跨越在基板背面侧的至少一个声音开口（13）。固定声透射反元件（14）形成在所述薄膜层上的部件（10）的层结构。至少延伸部（17）根据本发明在膜结构的外边缘区域（2）被形成，其突出于声音开口（13）的外周，从而使声音开口（13）作为底侧抵接的隔膜结构的边缘区域（2）作用。

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