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1. 发明申请

WO2004081495A3 MICROMACHINED VIBRATORY GYROSCOPE WITH ELECTROSTATIC COUPLING 审中-公开
标题翻译：具有静电耦合的微型振动陀螺仪
公开(公告)号：WO2004081495A3
公开(公告)日：2005-04-21
申请号：PCT/US2004006453
申请日：2004-03-03
申请人： BEI TECHNOLOGIES INC , CONTI TEMIC MICROELECTRONIC , CONTINENTAL TEVES AG & CO OHG , YAN HAI , BURGHARDT ROLAND , HARTMANN BERNHARD , KAPSER KONRAD , ROSE MATTHIAS
发明人： YAN HAI , BURGHARDT ROLAND , HARTMANN BERNHARD , KAPSER KONRAD , ROSE MATTHIAS
IPC分类号： G01C19/5712 , G01C19/56
CPC分类号： G01C19/5719 , Y10T74/1275
摘要： Micromachined vibratory gyroscope having two or more coplanar movable masses suspended over a planar substrate. Two perpendicular axes (x and y) are defined within the substrate plane, while a third, the z-axis or input axis, is defined to be perpendicular to the substrate plane. The movements of the two masses along the x-axis are coupled through an electrostatic coupling means so that the natural resonant frequency of the in-phase mode and that of the anti-phase mode are separated from each other for the resonances along the x-axis. When the two masses are driven to vibrate along the x-axis in the anti-phase mode and the device experiences rotation about the z-axis, Coriolis forces act differentially on the masses in the Ydirection, causing the two masses to dither in an anti-phase motion along the y-axis. The anti-phase dithering along the y-axis can be sensed directly by a rate sensor to measure the rate of rotation about the z-axis. Alternatively, the anti-phase dithering of the first and second bodies along the y-axis can be transferred to other movable bodies (i.e., rate-sensing masses) whose movement is then sensed to measure the rate of rotation about the z-axis. The sensing bodies are preferably suspended in such manner that, in the absence of Coriolis forces, the x-axis motion of the vibrating masses does not affect the sensing bodies. That inhibits motion of the sensing bodies in response to linear acceleration within the plane of the substrate, but permits those bodies to respond readily to the Corollas-induced motion about an axis perpendicular to the substrate plane.
摘要翻译：微机械振动陀螺仪具有悬挂在平面基板上的两个或更多个共面可移动质量块。两个垂直轴（x和y）被限定在衬底平面内，而第三个z轴或输入轴被定义为垂直于衬底平面。沿着x轴的两个质量块的移动通过静电耦合装置耦合，使得同相模式和反相模式的固有谐振频率彼此分离，用于沿x轴的谐振，轴。当两个质量被驱动以反相模式沿着x轴振动并且该装置经历围绕z轴的旋转时，科里奥利力在Y方向上的质量作用差异地导致两个质量在反向沿y轴的相位运动。可以通过速率传感器直接感测沿y轴的反相抖动，以测量围绕z轴的旋转速率。或者，沿着y轴的第一和第二主体的相位抖动可以传递到其它可移动体（即，速率感测质量），其移动然后被感测以测量围绕z轴的旋转速率。感测体优选地以这样的方式悬挂，即在没有科里奥利力的情况下，振动块的x轴运动不影响感测体。这可以抑制感测体响应于衬底平面内的线性加速度的运动，但是允许这些物体容易地响应于围绕垂直于衬底平面的轴的花冠诱发的运动。

2. 发明公开

EP1606583A4 MICROMACHINED VIBRATORY GYROSCOPE WITH ELECTROSTATIC COUPLING 有权
标题翻译：静态与离合器MICRO装配式振动陀螺仪
公开(公告)号：EP1606583A4
公开(公告)日：2010-03-31
申请号：EP04716934
申请日：2004-03-03
申请人： BEI TECHNOLOGIES INC , CONTI TEMIC MICROELECTRONIC , CONTINENTAL TEVES AG & CO OHG
发明人： YAN HAI , BURGHARDT ROLAND , HARTMANN BERNHARD , KAPSER KONRAD , ROSE MATTHIAS
IPC分类号： G01C19/5712
CPC分类号： G01C19/5719 , Y10T74/1275

3. 发明申请

WO2008077821A3 ENCAPSULATION MODULE METHOD FOR PRODUCTION AND USE THEREOF 审中-公开
标题翻译：封装的制造方法和使用
公开(公告)号：WO2008077821A3
公开(公告)日：2008-11-13
申请号：PCT/EP2007063975
申请日：2007-12-14
申请人： CONTINENTAL TEVES AG & CO OHG , VTI TECHNOLOGIES OY , HARTMANN BERNHARD , HILSER ROLAND , KUISMA HEIKKI , TORKKELI ALTTI
发明人： HARTMANN BERNHARD , HILSER ROLAND , KUISMA HEIKKI , TORKKELI ALTTI
IPC分类号： B81C1/00
CPC分类号： H01L23/055 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C1/00301 , H01L2224/73204 , H01L2924/01019 , H01L2924/01079 , H01L2924/01322 , H01L2924/1433 , H01L2924/1461 , H01L2924/00
摘要： The invention relates to a method for producing an encapsulation module (A) and/or for encapsulating a micromechanical arrangement, wherein electronic connection means, such as through contacts (2), electrical lines, contacts and/or electronic structures are produced from a blank (1) of electrically conducting semiconductor material, in particular, doped silicon, by means of one or more structuring processes and/or etching processes, wherein in the process of the formation of the electronic connector means, a plinth (6) of the semiconductor material is generated on which the electronic connector means are arranged, subsequently being embedded in an embedding material (9) and the embedding material and/or the semiconductor plinth (6) are removed after the embedding to the extent that a defined number of the electronic connector means have electrical contact on at least one of the outer surfaces (7, 8) of the encapsulation module (A) and during the process of the formation of the electronic connector means with the at least one structuring and/or etching process at least one isolated material mound on each of which a through contact (2) is arranged, are formed on the plinth of the semiconductor material (6), which forms a semiconductor electrode (3). The invention further relates to an encapsulation module and/or a micromechanical arrangement with at least one through contact (2) and at least one semiconductor electrode (3) and the use thereof in motor vehicles.
摘要翻译：一种用于生产Verkapselungsmoduls和用于微机械组件的封装方法，所述电子制成的生坯的导电连接装置的半导体材料形成，其中，在形成所述电子连接的过程是指在半导体材料构成的基材，在其上elektronischen.Anschlüssmittel布置，其随后结果嵌入与在形成电子连接的过程中，半导体材料的基础上，是指嵌入材料; 在其上经由被布置在至少一个岛状材料山，形成，它代表了半导体电极。本发明另外涉及一种封装模块和具有经由至少一个和至少一个半导体电极以及在机动车辆中使用的微型机械装置。

4. 发明申请

WO2004026759A3 METHOD FOR PRODUCING INSULATION STRUCTURES 审中-公开
标题翻译：制造绝缘结构的方法
公开(公告)号：WO2004026759A3
公开(公告)日：2004-12-23
申请号：PCT/DE0303049
申请日：2003-09-12
申请人： CONTI TEMIC MICROELECTRONIC , AIKELE MATTHIAS , ENGELHARDT ALBERT , FREY MARCUS , HARTMANN BERNHARD , SEIDEL HELMUT
发明人： AIKELE MATTHIAS , ENGELHARDT ALBERT , FREY MARCUS , HARTMANN BERNHARD , SEIDEL HELMUT
IPC分类号： B81C1/00
CPC分类号： B81C1/00698 , B81B2201/0235 , B81B2203/033 , B81C2201/0178
摘要： The invention relates to methods for producing insulation structures for micromechanical sensors according to a monocrystalline surface technique. According to known methods, silicon structures defined by deep trenches are etched and the lower side thereof facing the substrate is exposed by a release etch step. The filling of said trenches with a dielectrically insulating material, such as silicon dioxide, enables the silicon structure to be solidly clutched on three sides. The invention is based on the fact that instead of filling trenches, thin-walled silicon is converted into an electrically non-conductive material. This can be carried out, for example, by means of thermal oxidation of narrow silicon sections previously exposed by trenches. In a minimal configuration, two trenches (holes) must be etched per section with the desired structural depth. The interlying silicon section must be narrow enough to be able to be fully thermally oxidised.
摘要翻译：本发明涉及用于制造单晶表面技术中的微机械传感器的绝缘结构的方法。在已知的方法中，由深沟槽沟槽限定的硅结构通过释放 - 蚀刻步骤被蚀刻并且在其底侧上暴露于衬底。随后，用诸如二氧化硅的介电绝缘材料填充这些沟槽，导致通过三面单侧开口Umklammerung牢固地锚固具有填充沟槽的硅结构。本发明的基本思想是将薄壁硅转变成不导电材料而不是填入沟槽中。这可以例如通过先前由沟槽暴露的窄硅网的热氧化来实现。在最小配置中，每个条纹的两个沟槽（孔）必须用所需的纹理深度进行蚀刻。插入的硅棒必须足够窄，才能被热完全氧化。

5. 发明专利

ES2333890T3 SENSOR DE VELOCIDAD ANGULAR. 未知
公开(公告)号：ES2333890T3
公开(公告)日：2010-03-02
申请号：ES05802596
申请日：2005-09-27
申请人： CONTI TEMIC MICROELECTRONIC
发明人： HARTMANN BERNHARD , KAPSER KONRAD , GOTTINGER REINHARD , GUNTHNER STEFAN
IPC分类号： G01C19/56
摘要： Sensor de velocidad angular con un sustrato, como mínimo un elemento base (1), que comprende un marco (2), una suspensión (7) del marco (2) en el sustrato, como mínimo una unidad de oscilación (3) y una suspensión (4, 5) de la unidad de oscilación (3) en el marco (2), un medio de accionamiento (8) y una unidad de lectura (9, 10), estando dispuesto el medio de accionamiento (8) de tal forma que influya en el marco (2) del elemento base (1, 11, 12, 13, 14), presentando el sensor de velocidad angular dos elementos base (1) conectados entre sí mediante una unidad de acoplamiento (6), estando orientados los elementos base (1) cada uno hacia el otro mediante un giro de 180º y pudiendo ponerlos en oscilación en oposición de fase y presentando una frecuencia de resonancia en común, estando dispuesta la unidad de oscilación (3) como masa sísmica en forma de remo, caracterizado porque el eje de rotación del remo está en paralelo a la dirección de accionamiento (y).

6. 发明专利

DE10035564B4 未知
公开(公告)号：DE10035564B4
公开(公告)日：2006-03-30
申请号：DE10035564
申请日：2000-07-21
申请人： CONTI TEMIC MICROELECTRONIC
发明人： ENGELHARDT ALBERT , HARTMANN BERNHARD , PRECHTEL ULRICH , SEIDEL HELMUT
IPC分类号： B81B7/00 , B81B3/00 , H01L23/04 , H01L23/10
摘要： A micromechanical enclosure suitable for micromechanical sensors, particularly acceleration sensors in the field of automotive vehicles, includes a micromechanical structure on a substrate, a conductor track layer connected to the micromechanical structure on the main surface of the substrate, a cover that covers a part of the main surface of the substrate, and a level compensation layer arranged next to the conductor track layer beneath the contact area during the manufacture of the wafer. A planarizing layer, which forms a level surface, may additionally be applied above this, to form a level area on the substrate which can easily be joined to a level area of the cover by means of a metallic wafer bond. This achieves small overall dimensions and avoids a glass frit bond.

7. 发明专利

AT332283T 未知
公开(公告)号：AT332283T
公开(公告)日：2006-07-15
申请号：AT03756438
申请日：2003-09-12
申请人： CONTI TEMIC MICROELECTRONIC
发明人： AIKELE MATTHIAS , ENGELHARDT ALBERT , FREY MARCUS , HARTMANN BERNHARD , SEIDEL HELMUT
IPC分类号： B81C1/00
摘要： Production of insulating structures comprises preparing a semiconductor substrate (11), forming trenches in the substrate with a bar lying between the trenches, converting the substrate material in the region of the trenches into an electrically insulating material up to the bar, and forming a functional structure (15) in the substrate material which is mechanically connected to the substrate via the converted substrate material.

8. 发明专利

DE10242661A1 Production of insulating structures used in the production of micromechanical sensors and in acceleration sensors for vehicle air bags comprises forming trenches in a substrate, and forming a functional structure in the substrate material 未知
公开(公告)号：DE10242661A1
公开(公告)日：2004-03-25
申请号：DE10242661
申请日：2002-09-13
申请人： CONTI TEMIC MICROELECTRONIC
发明人： AIKELE MATTHIAS , ENGELHARDT ALBERT , FREY MARCUS , HARTMANN BERNHARD , SEIDEL HELMUT
IPC分类号： B81C1/00 , H01L21/762
摘要： Production of insulating structures comprises preparing a semiconductor substrate (11), forming trenches in the substrate with a bar lying between the trenches, converting the substrate material in the region of the trenches into an electrically insulating material up to the bar, and forming a functional structure (15) in the substrate material which is mechanically connected to the substrate via the converted substrate material.

9. 发明专利

DE112007000303A5 未知
公开(公告)号：DE112007000303A5
公开(公告)日：2008-10-30
申请号：DE112007000303
申请日：2007-03-12
申请人： CONTI TEMIC MICROELECTRONIC
发明人： HARTMANN BERNHARD , GUENTHNER STEFAN
IPC分类号： G01C19/56
摘要： A micromechanical rotational rate sensor includes a substrate, at least one base element suspended by at least one spring element on the substrate, an excitation device and a read-out arrangement. The base element includes at least one seismic or inertial mass. The spring element is movable perpendicularly to the motion direction of the base element so that apex or deflection points of the spring element will move perpendicularly to the excitation direction while the base element is thereby not excited to move perpendicularly to the excitation direction.

10. 发明专利

DE112005002196A5 未知
公开(公告)号：DE112005002196A5
公开(公告)日：2008-06-26
申请号：DE112005002196
申请日：2005-09-27
申请人： CONTI TEMIC MICROELECTRONIC
发明人： HARTMANN BERNHARD , KAPSER KONRAD , GOTTINGER REINHARD , GUENTHNER STEFAN
IPC分类号： G01C19/56
摘要： Disclosed is a rotational rate sensor with a substrate, at least one basic element ( 1 ) which comprises a frame ( 2 ), a suspension ( 7 ) of the frame ( 2 ) on the substrate, at least one vibration facility ( 3 ) and a suspension ( 4, 5 ) of the vibration facility ( 3 ) on the frame ( 2 ), a drive device ( 8 ) and a reading facility ( 9, 10 ). The drive device ( 8 ) is designed in such a manner that it acts on the frame ( 2 ) of the basic element ( 1 ).

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