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1. 发明申请

WO2008077821A3 ENCAPSULATION MODULE METHOD FOR PRODUCTION AND USE THEREOF 审中-公开
标题翻译：封装的制造方法和使用
公开(公告)号：WO2008077821A3
公开(公告)日：2008-11-13
申请号：PCT/EP2007063975
申请日：2007-12-14
申请人： CONTINENTAL TEVES AG & CO OHG , VTI TECHNOLOGIES OY , HARTMANN BERNHARD , HILSER ROLAND , KUISMA HEIKKI , TORKKELI ALTTI
发明人： HARTMANN BERNHARD , HILSER ROLAND , KUISMA HEIKKI , TORKKELI ALTTI
IPC分类号： B81C1/00
CPC分类号： H01L23/055 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C1/00301 , H01L2224/73204 , H01L2924/01019 , H01L2924/01079 , H01L2924/01322 , H01L2924/1433 , H01L2924/1461 , H01L2924/00
摘要： The invention relates to a method for producing an encapsulation module (A) and/or for encapsulating a micromechanical arrangement, wherein electronic connection means, such as through contacts (2), electrical lines, contacts and/or electronic structures are produced from a blank (1) of electrically conducting semiconductor material, in particular, doped silicon, by means of one or more structuring processes and/or etching processes, wherein in the process of the formation of the electronic connector means, a plinth (6) of the semiconductor material is generated on which the electronic connector means are arranged, subsequently being embedded in an embedding material (9) and the embedding material and/or the semiconductor plinth (6) are removed after the embedding to the extent that a defined number of the electronic connector means have electrical contact on at least one of the outer surfaces (7, 8) of the encapsulation module (A) and during the process of the formation of the electronic connector means with the at least one structuring and/or etching process at least one isolated material mound on each of which a through contact (2) is arranged, are formed on the plinth of the semiconductor material (6), which forms a semiconductor electrode (3). The invention further relates to an encapsulation module and/or a micromechanical arrangement with at least one through contact (2) and at least one semiconductor electrode (3) and the use thereof in motor vehicles.
摘要翻译：一种用于生产Verkapselungsmoduls和用于微机械组件的封装方法，所述电子制成的生坯的导电连接装置的半导体材料形成，其中，在形成所述电子连接的过程是指在半导体材料构成的基材，在其上elektronischen.Anschlüssmittel布置，其随后结果嵌入与在形成电子连接的过程中，半导体材料的基础上，是指嵌入材料; 在其上经由被布置在至少一个岛状材料山，形成，它代表了半导体电极。本发明另外涉及一种封装模块和具有经由至少一个和至少一个半导体电极以及在机动车辆中使用的微型机械装置。

2. 发明专利

DE102007060931A1 Encapsulation module producing and/or micromechanical arrangement encapsulating method, involves forming insulated material mound on base of semiconductor material by structuring and/or etching process 未知
公开(公告)号：DE102007060931A1
公开(公告)日：2008-08-28
申请号：DE102007060931
申请日：2007-12-14
申请人： CONTINENTAL TEVES AG & CO OHG , VTI TECHNOLOGIES OY
发明人： HILSER ROLAND , HARTMANN BERNHARD , TORKKELI ALTTI , KUISMA HEIKKI
IPC分类号： H01L23/055 , B81C1/00
摘要： The method involves generating a base of a semiconductor material during a process of the formation of an electronic connector unit e.g. through contact (2). The electronic connector unit is arranged on the base of the semiconductor material. An insulated material mound is formed on the base of the semiconductor material by a structuring and/or etching process during the process of the formation of the electronic connector unit, where the insulated material mound represents a semiconductor electrode (3). An independent claim is also included for an encapsulation module for encapsulating a micromechanical structure and/or micromechanical arrangement.

3. 发明专利

ES2727204T3 Módulo de encapsulación, método para su fabricación y su utilización 未知
公开(公告)号：ES2727204T3
公开(公告)日：2019-10-14
申请号：ES07857609
申请日：2007-12-14
申请人： CONTINENTAL TEVES AG & CO OHG
发明人： SCHMID BERNHARD , HILSER ROLAND , KUISMA HEIKKI , TORKKELI ALTTI
IPC分类号： B81B1/00
摘要： Procedimiento para la fabricación de un módulo de encapsulación (A) o para la encapsulación de una disposición micromecánica, en el que la disposición micromecánica presenta al menos un módulo estructural y al menos un módulo de encapsulación (A), en el que a partir de un cuerpo bruto (1) se configuran materiales semiconductores conductores de electricidad, en particular de silicio dotado, medios de conexión electrónicos, como contactos pasantes (2), líneas eléctricas, contactos y/o estructuras electrónicas, a través de uno o varios procesos de estructuración y/o procesos de decapado, en el que en el transcurso de la configuración de los medios de conexión electrónicos resulta un zócalo (6) del material semiconductores, en el que éstos se incrustan en los medios de conexión electrónicos, en el que éstos se incrustan a continuación con un material de incrustación (9) y el material de incrustación y/o el zócalo de semiconductores (6) se retiran después de la incrustación hasta el punto de que un número definido de los medios de conexión electrónicos presentan contactos eléctricos en al menos una de las superficies exteriores (7, 8) del módulo de encapsulación (A) fabricado de esta manera, caracterizadoporque en el transcurso de la configuración de los medios de conexión electrónicos, a través de al menos un proceso de estructura y/o de decapado, se configura sobre el zócalo del material semiconductor (6), al menos una colina de material, sobre la/s que está dispuesto, respectivamente, un contacto pasante (2), que incorpora el electrodo de semiconductores (3).

4. 发明专利

CA2700565C VIBRATING MICROMECHANICAL SENSOR OF ANGULAR VELOCITY 未知
公开(公告)号：CA2700565C
公开(公告)日：2015-11-17
申请号：CA2700565
申请日：2008-09-29
申请人： VTI TECHNOLOGIES OY
发明人： KLEMETTI PETRI , NERA KAISA , LIPSANEN ANTTI , BLOMQVIST ANSSI , TORKKELI ALTTI
IPC分类号： G01C19/56 , G01C19/5712
摘要： The invention relates to measuring devices to be used in the measuring of angular velocity and, more precisely, to vibrating micromechanical sensors of angular velocity. In a sensor of angular velocity according to the invention, a mass is supported to the frame of the sensor component by means of an asymmetrical spring structure (1), (2), (3), (4), (22), (24) in such a way, that the coupling from one mode of motion to another, conveyed by the spring (1), (2), (3), (4), (22), (24), cancels or alleviates the coupling caused by the non-ideality due to the skewness in the springs or in their support. The structure of the sensor of angular velocity according to the invention enables reliable measuring with good performance, particularly in small vibrating micromechanical so-lutions for sensors of angular velocity.

5. 发明专利

FI119895B 未知
公开(公告)号：FI119895B
公开(公告)日：2009-04-30
申请号：FI20075708
申请日：2007-10-05
申请人： VTI TECHNOLOGIES OY
发明人： KLEMETTI PETRI , NERA KAISA , LIPSANEN ANTTI , TORKKELI ALTTI , BLOMQVIST ANSSI
IPC分类号： G01P15/08 , B81B3/00 , G01C19/5712
摘要： The invention relates to measuring devices to be used in the measuring of angular velocity and, more precisely, to vibrating micromechanical sensors of angular velocity. In a sensor of angular velocity according to the invention, a mass is supported to the frame of the sensor component by means of an asymmetrical spring structure (1), (2), (3), (4), (22), (24) in such a way, that the coupling from one mode of motion to another, conveyed by the spring (1), (2), (3), (4), (22), (24), cancels or alleviates the coupling caused by the non-ideality due to the skewness in the springs or in their support. The structure of the sensor of angular velocity according to the invention enables reliable measuring with good performance, particularly in small vibrating micromechanical solutions for sensors of angular velocity.

6. 发明专利

CA2700565A1 VIBRATING MICROMECHANICAL SENSOR OF ANGULAR VELOCITY 未知
公开(公告)号：CA2700565A1
公开(公告)日：2009-04-09
申请号：CA2700565
申请日：2008-09-29
申请人： VTI TECHNOLOGIES OY
发明人： KLEMETTI PETRI , NERA KAISA , LIPSANEN ANTTI , BLOMQVIST ANSSI , TORKKELI ALTTI
IPC分类号： G01P3/02 , G01C19/5712 , G01P15/097
摘要： The invention relates to measuring devices to be used in the measuring of angular velocity and, more precisely, to vibrating micromechanical sensors of angular velocity. In a sensor of angular velocity according to the invention, a mass is supported to the frame of the sensor component by means of an asymmetrical spring structure (1), (2), (3), (4), (22), (24) in such a way, that the coupling from one mode of motion to another, conveyed by the spring (1), (2), (3), (4), (22), (24), cancels or alleviates the coupling caused by the non-ideality due to the skewness in the springs or in their support. The structure of the sensor of angular velocity according to the invention enables reliable measuring with good performance, particularly in small vibrating micromechanical solutions for sensors of angular velocity.

7. 发明专利

FI20075708A0 未知
公开(公告)号：FI20075708A0
公开(公告)日：2007-10-05
申请号：FI20075708
申请日：2007-10-05
申请人： VTI TECHNOLOGIES OY
发明人： KLEMETTI PETRI , NERA KAISA , LIPSANEN ANTTI , TORKKELI ALTTI , BLOMQVIST ANSSI
IPC分类号： G01C19/5712
摘要： The invention relates to measuring devices to be used in the measuring of angular velocity and, more precisely, to vibrating micromechanical sensors of angular velocity. In a sensor of angular velocity according to the invention, a mass is supported to the frame of the sensor component by means of an asymmetrical spring structure (1), (2), (3), (4), (22), (24) in such a way, that the coupling from one mode of motion to another, conveyed by the spring (1), (2), (3), (4), (22), (24), cancels or alleviates the coupling caused by the non-ideality due to the skewness in the springs or in their support. The structure of the sensor of angular velocity according to the invention enables reliable measuring with good performance, particularly in small vibrating micromechanical solutions for sensors of angular velocity.

8. 发明公开

EP2195662A4 VIBRATING MICROMECHANICAL SENSOR OF ANGULAR VELOCITY 有权转让
标题翻译： VIBRANT微机械传感器角速度的
公开(公告)号：EP2195662A4
公开(公告)日：2012-07-25
申请号：EP08805461
申请日：2008-09-29
申请人： VTI TECHNOLOGIES OY
发明人： KLEMETTI PETRI , NERA KAISA , LIPSANEN ANTTI , BLOMQVIST ANSSI , TORKKELI ALTTI
IPC分类号： G01P3/02 , G01C19/56 , G01C19/5712 , G01P15/097
CPC分类号： G01C19/5712

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