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1. 发明授权

US09310362B2 Microwell array chip and method of manufacturing same 有权
标题翻译：微孔阵列芯片及其制造方法相同
公开(公告)号：US09310362B2
公开(公告)日：2016-04-12
申请号：US13088582
申请日：2011-04-18
申请人： Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
发明人： Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
IPC分类号： C12N5/16 , C12N5/00 , G01N33/543 , B01J19/00 , A61K35/12 , A61K48/00
CPC分类号： G01N33/54366 , A61K35/12 , A61K48/00 , B01J19/0046 , B01J2219/00659 , C12M23/12 , G06F19/00
摘要： A microwell array chip made of silicon and having multiple microwells where each microwell is used to store a single specimen organic cell. The microwell of the array chip is of a size and shape to hold just one organic cell and the interior surface of the microwells are coated with a fluorocarbon film.
摘要翻译：由硅制成并具有多个微孔的微孔阵列芯片，其中每个微孔用于存储单个样品有机电池。阵列芯片的微孔具有仅容纳一个有机电池的尺寸和形状，并且微孔的内表面涂覆有氟碳膜。

2. 发明申请

US20080014631A1 Microwell Array Chip and Its Manufacturing Method 审中-公开
标题翻译：微孔阵列芯片及其制造方法
公开(公告)号：US20080014631A1
公开(公告)日：2008-01-17
申请号：US10573289
申请日：2004-09-22
申请人： Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
发明人： Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
IPC分类号： C12M1/34
CPC分类号： G01N33/54366 , A61K35/12 , A61K48/00 , B01J19/0046 , B01J2219/00659 , C12M23/12
摘要： A microwell array chip having multiple microwells on a principal surface of a substrate, said microwells being of a shape and size permitting the storage of only a single organic cell in each microwell, wherein microwell markers are present on the same substrate surface as the openings of the microwells. A microwell array chip having multiple microwells on a principal surface of a substrate, said microwells being of a shape and size permitting the storage of only a single organic cell in each microwell, wherein protrusions are present in the openings of said microwells so as to narrow said openings. A method for manufacturing the microwell array chip. The method comprises the steps of: forming a film on at least one principal surface of a substrate; applying a resist coating on the film that has been formed; exposing the resist surface through a mask having a microwell pattern and removing uncured portions of resist; etching the exposed portions of said film and substrate to fabricate wells in the form of a microwell array; and removing the resist. A microwell array chip made of silicon and having multiple microwells, each microwell being used to store a single specimen organic cell, wherein each microwell is of a size and shape holding just one organic cell.
摘要翻译：一种微孔阵列芯片，其在基底的主表面上具有多个微孔，所述微孔具有允许在每个微孔中仅存储单个有机细胞的形状和尺寸，其中微孔标记物存在于与基底表面的开口相同的基底表面上微孔。一种微孔阵列芯片，其在基底的主表面上具有多个微孔，所述微孔具有允许在每个微孔中仅存储单个有机细胞的形状和尺寸，其中突起存在于所述微孔的开口中以使其变窄说开口一种微孔阵列芯片的制造方法。该方法包括以下步骤：在衬底的至少一个主表面上形成膜; 在已经形成的膜上施加抗蚀剂涂层; 通过具有微孔图案的掩模曝光抗蚀剂表面并除去未固化的抗蚀剂部分; 蚀刻所述膜和基底的暴露部分以制造微孔阵列形式的孔; 并除去抗蚀剂。由硅制成并具有多个微孔的微孔阵列芯片，每个微孔用于存储单个样品有机电池，其中每个微孔具有仅具有一个有机电池的尺寸和形状。

3. 发明申请

US20110195496A1 MICROWELL ARRAY CHIP AND METHOD OF MANUFACTURING SAME 有权
标题翻译： MICROWELL阵列芯片及其制造方法
公开(公告)号：US20110195496A1
公开(公告)日：2011-08-11
申请号：US13088582
申请日：2011-04-18
申请人： Atsushi MURAGUCHI , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
发明人： Atsushi MURAGUCHI , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
IPC分类号： C12N5/078
CPC分类号： G01N33/54366 , A61K35/12 , A61K48/00 , B01J19/0046 , B01J2219/00659 , C12M23/12 , G06F19/00
摘要： The present invention is directed to a microwell array chip made of silicon and having multiple microwells. Each microwell is used to store a single specimen organic cell. Each microwell is of a size and shape holding just one organic cell, and the interior surface of the microwells are coated with a fluorocarbon film.
摘要翻译：本发明涉及由硅制成并具有多个微孔的微孔阵列芯片。每个微孔用于存储单个样品有机细胞。每个微孔具有只容纳一个有机电池的尺寸和形状，并且微孔的内表面涂覆有氟碳膜。

4. 发明授权

US08664003B2 Chip provided with film having hole pattern with the use of thermoresponsive polymer and method of producing the same 有权
标题翻译：具有使用热电聚合物的具有孔图案的膜的芯片及其制造方法
公开(公告)号：US08664003B2
公开(公告)日：2014-03-04
申请号：US13569291
申请日：2012-08-08
申请人： Eiichi Tamiya , Yoshiyuki Yokoyama , Satoshi Fujiki , Katsumi Tanino , Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Shohei Yamamura
发明人： Eiichi Tamiya , Yoshiyuki Yokoyama , Satoshi Fujiki , Katsumi Tanino , Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Shohei Yamamura
IPC分类号： C12Q1/24
CPC分类号： C12N5/0068 , C12N2533/12 , C12N2535/10 , C12N2537/10 , C12N2539/10 , Y10T428/24273 , Y10T436/25 , Y10T436/25375
摘要： A chip useful for treating cells and the like which has a mechanism and a structure wherein the size of a hole pattern is arbitrarily changed so that cells can easily move in and get out from the hole in scattering or collecting cells but can hardly get out from the hole during washing or antigen-stimulation. The chip comprises a crosslinked product of a temperature-responsive polymer as a constituting member and being provided with a film having a hole pattern on the surface of a baseboard. A method of producing the chip comprises applying a composition containing a crosslinkable temperature-responsive polymer on the surface of a baseboard to thereby form a coating film, crosslinking the coating film to thereby form the crosslinked product as described above and then forming a hole pattern on the coating film of the crosslinked product.
摘要翻译：用于处理细胞等的芯片，其具有机构和结构，其中孔图案的尺寸任意改变，使得细胞可以容易地在散射或收集细胞中从孔中移出并离开，但几乎不能从洗涤期间的孔或抗原刺激。芯片包括作为构成部件的温度敏感性聚合物的交联体，并且在基板的表面上设置有具有孔图案的膜。制造该芯片的方法包括在基板的表面上涂布含有交联性温度敏感性聚合物的组合物，从而形成涂膜，使涂膜交联从而形成如上所述的交联产物，然后在交联产物的涂膜。

5. 发明申请

US20090130384A1 Chip Provided with film Having Hole Pattern with the Use of Thermoresponsive Polymer and Method of Producing the Same 审中-公开
标题翻译：带有膜的芯片具有使用热聚合物的孔图案及其制造方法
公开(公告)号：US20090130384A1
公开(公告)日：2009-05-21
申请号：US11992594
申请日：2006-09-27
申请人： Eiichi Tamiya , Yoshiyuki Yokoyama , Satoshi Fujiki , Katsumi Tanino , Atsushi Muraguchi , Horoyuki Kishi , Yoshiharu Tokimitsu , Shohei Yamamura
发明人： Eiichi Tamiya , Yoshiyuki Yokoyama , Satoshi Fujiki , Katsumi Tanino , Atsushi Muraguchi , Horoyuki Kishi , Yoshiharu Tokimitsu , Shohei Yamamura
IPC分类号： B32B3/10 , C12N11/04 , B05D3/00 , G03F7/20
CPC分类号： C12N5/0068 , C12N2533/12 , C12N2535/10 , C12N2537/10 , C12N2539/10 , Y10T428/24273 , Y10T436/25 , Y10T436/25375
摘要： [Problems] To provide a novel chip useful for treating cells and the like which has a mechanism and a structure wherein the size of a hole pattern is arbitrarily changed so that cells can easily move in and get out from the hole in scattering or collecting cells but can hardly get out from the hole during washing or antigen-stimulation.[Means for Solving Problems] A chip comprising a crosslinked product of a temperature-responsive polymer as a constituting member and being provided with a film having a hole pattern on the surface of a baseboard. A method of producing a chip which comprises a crosslinked product of a temperature-responsive polymer as a constituting member and is provided with a film having a hole pattern on the surface of the baseboard. This method comprises applying a composition containing a crosslinkable temperature-responsive polymer, a composition containing a crosslinkable temperature-responsive polymer and a crosslinking agent or a composition containing a temperature-responsive polymer and a crosslinking agent on the surface of a baseboard to thereby form a coating film, crosslinking the coating film to thereby form the crosslinked product as described above and then forming a hole pattern on the coating film of the crosslinked product.
摘要翻译： [问题]提供一种用于处理细胞等的新颖的芯片，其具有机构和结构，其中孔图案的尺寸任意改变，使得细胞可以容易地在散射或收集细胞中从孔中移出和离开但在洗涤或抗原刺激期间几乎不能从孔中脱出。解决问题的手段一种芯片，其包含作为构成部件的温度敏感性聚合物的交联体，并且在基板的表面设置有具有孔图案的膜。一种制造芯片的方法，其包括作为构成部件的温度敏感性聚合物的交联产物，并且在基板的表面上设置有具有孔图案的膜。该方法包括在基板的表面上涂布含有交联性温度响应性聚合物的组合物，含有交联性温度敏感性聚合物和交联剂的组合物或含有温度敏感性聚合物和交联剂的组合物，从而形成使涂膜交联，由此形成如上所述的交联产物，然后在交联产物的涂膜上形成孔图案。

6. 发明授权

US4499010A Conductive paint 失效
标题翻译：导电漆
公开(公告)号：US4499010A
公开(公告)日：1985-02-12
申请号：US471924
申请日：1983-03-02
申请人： Katsumi Tanino , Satoshi Fujiki , Shinzi Okamoto
发明人： Katsumi Tanino , Satoshi Fujiki , Shinzi Okamoto
IPC分类号： C09D5/24 , H05K1/09 , H01B1/02
CPC分类号： C09D5/24 , H05K1/095
摘要： Conductive paint comprises an organic solvent having dissolved and dispersed therein a binder containing a thermosetting resin and a hydroquinone derivative which is a product resulting from reaction between a hydroquinone (polyhydric phenol) and a fatty acid having 10 to 20 carbon atoms, added to the thermosetting resin, metal powder as a conductive material, and preferably a fatty acid derived from natural oils and fats and having 10 to 20 carbon atoms. This conductive paint exhibits characteristics not inferior to those of the conventional Ag conductive paint, such as low specific resistance, high moisture resistance and high heat resistance, and is much less expensive than the conventional Ag conductive paint.
摘要翻译：导电涂料包括溶解并分散有含有热固性树脂和氢醌衍生物的粘合剂的有机溶剂，氢醌衍生物是由氢醌（多元酚）和具有10至20个碳原子的脂肪酸之间的反应产生的产物，加入到热固性树脂，金属粉末作为导电材料，优选衍生自天然油脂的脂肪酸，并具有10〜20个碳原子。该导电涂料具有不劣于常规Ag导电涂料的特性，例如低电阻率，高耐湿性和高耐热性，并且比常规Ag导电涂料便宜得多。

7. 发明授权

US4921928A Piezoelectric polymer materials from epoxy resins and polytetramethyleneoxide-di-p-aminobenzoate 失效
标题翻译：来自环氧树脂和聚四亚甲基氧化物 - 二对氨基苯甲酸酯的压电聚合物材料
公开(公告)号：US4921928A
公开(公告)日：1990-05-01
申请号：US208063
申请日：1988-06-17
申请人： Katsumi Tanino , Morihito Kakada
发明人： Katsumi Tanino , Morihito Kakada
IPC分类号： C08G59/00 , C08G59/50 , C08K5/17 , C08L63/00 , H01B3/40 , H01L41/193 , H01L41/45
CPC分类号： H01L41/45 , C08G59/50 , C08G59/504 , C08G59/5053 , C08L63/00 , H01L41/193
摘要： A piezoelectric polymer material comprising a cured product of a composition comprised of an epoxy resin having at least two epoxy groups in the molecules, a compound having a molecular weight not less than 1200 and containing defined numbers of amino groups, benzene rings, carbonyl groups and methylene groups, and a crosslinking agent. The cured product has dipolarly oriented micro crystals therein. A method for making such a piezoelectric polymer material is also described, in which the resin composition is thermally cured and contacted with an electric field at a high temperature to cause dipolar orientation in the product. The dipoles are frozen by cooling the product while applying the electric field.
摘要翻译：一种压电聚合物材料，其包含由分子中具有至少两个环氧基的环氧树脂组成的组合物的固化产物，分子量不小于1200且含有规定数目的氨基的化合物，苯环，羰基和亚甲基和交联剂。固化产物中具有偶极取向的微晶。还描述了制造这种压电聚合物材料的方法，其中树脂组合物被热固化并在高温下与电场接触以在产品中引起偶极取向。通过在施加电场的同时冷却产品来冷冻偶极子。

8. 发明申请

US20070148810A1 Functional paste 有权
标题翻译：功能性糊状物
公开(公告)号：US20070148810A1
公开(公告)日：2007-06-28
申请号：US10579857
申请日：2004-10-22
申请人： Sylke Klein , Armin Kuebelbeck , Werner Stockum , Jun Nakanowatari , Kiyohiko Kawamoto , Katsumi Tanino
发明人： Sylke Klein , Armin Kuebelbeck , Werner Stockum , Jun Nakanowatari , Kiyohiko Kawamoto , Katsumi Tanino
IPC分类号： H01L21/00
CPC分类号： C09K13/08 , H01L31/022425 , H05K1/095 , H05K1/097 , Y02E10/50
摘要： [Aims] To provide functional paste with etching activity and good electrical properties. [Means] Functional paste comprising a metal powder, an etching agent, a binder and an organic solvent.
摘要翻译： [目的]提供具有蚀刻活性和良好电性能的功能性糊剂。包括金属粉末，蚀刻剂，粘合剂和有机溶剂的功能性糊剂。

9. 发明授权

US4808326A Resin-bonded magnetic composition and process for producing magnetic molding therefrom 失效
标题翻译：树脂粘结磁性组合物及其制造方法
公开(公告)号：US4808326A
公开(公告)日：1989-02-28
申请号：US26369
申请日：1987-02-09
申请人： Katsumi Tanino , Yukio Nakazawa , Takeo Kizaki
发明人： Katsumi Tanino , Yukio Nakazawa , Takeo Kizaki
IPC分类号： H01F1/12 , H01F1/26 , H01F1/37 , H01F27/255 , G11B5/68
CPC分类号： H01F27/255 , H01F1/26 , H01F1/37 , Y10S428/90 , Y10T428/256 , Y10T428/257 , Y10T428/2991 , Y10T428/2998
摘要： A magnetic composition which comprises 80 to 95 weight % of ferromagnetic powder, 5 to 20 weight % of highly heat-resistant thermosetting resin powder and 0.1 to 1 weight % of a metal chelate compound. Further, a process characterized in that all of the powders which comprise the magnetic composition are mixed together and molded under heat and pressure to produce a magnetic molding.The magnetic composition enables molding of materials of complicated form at low temperatures, and the obtained magnetic moldings are excellent in heat resistance, mechanical strength, mechanical workability and initial magnetic permeability.
摘要翻译： PCT No.PCT / JP86 / 00288 Sec。 371日期1987年2月9日 102（e）1987年2月9日PCT PCT 1986年6月9日PCT公布。出版物WO86 / 07489 日期：1986年12月18日。磁性组合物，其含有80〜95重量％的铁磁粉末，5〜20重量％的高耐热性热固性树脂粉末和0.1〜1重量％的金属螯合物。此外，其特征在于将包含磁性组合物的所有粉末混合在一起并在加热和加压下成型以产生磁性模塑。磁性组合物能够在低温下成型复杂的材料，所得到的磁性模制品的耐热性，机械强度，机械加工性和初始磁导率优异。

10. 发明申请

US20140077120A1 Magnetically Enhanced Resin 审中-公开
标题翻译：强磁树脂
公开(公告)号：US20140077120A1
公开(公告)日：2014-03-20
申请号：US14114281
申请日：2012-02-17
申请人： Katsumi Tanino , Michio Kawamoto , Yoshihiro Kakutani
发明人： Katsumi Tanino , Michio Kawamoto , Yoshihiro Kakutani
IPC分类号： H01F1/01
CPC分类号： H01F1/01 , C08K3/08 , C08K5/3415 , C08K2201/01 , C09D5/23 , C09D7/61 , C09D7/63 , H01F1/26 , H01F1/28 , H01F1/37
摘要： A major objective of the present invention is to provide a magnetically enhanced resin and the like having an improved magnetic permeability. The magnetically enhanced resin contains a ferromagnetic material, a compound having a macrocyclic π electronic structure, and an adhesive resin. The ferromagnetic material is preferably a powder of a Fe—Ni alloy, a Fe—Ni—Mo alloy, a Fe—Ni—Cu alloy, or a Fe—Al—Si alloy. The ferromagnetic material is preferably a powder of permalloy, supermalloy, sendust, or ferrite. The compound having a macrocyclic π electronic structure is preferably phthalocyanine, porphyrin, or polycyanine, a substitution product thereof, or a metal coordination complex thereof. The adhesive resin is preferably an epoxy resin, a melamine resin, a polyimide resin, a polycarbonate resin, a phenol resin, or a fluorosilicone resin. The average particle size of the powder of the ferromagnetic material is preferably 0.1 to 100 μm.
摘要翻译：本发明的主要目的是提供具有改善的磁导率的磁增强树脂等。磁性增强树脂含有铁磁材料，具有大环的化合物; 电子结构和粘合剂树脂。铁磁材料优选为Fe-Ni合金，Fe-Ni-Mo合金，Fe-Ni-Cu合金或Fe-Al-Si合金的粉末。铁磁材料优选是坡莫合金，超合金，铁硅铝铁合金或铁氧体的粉末。具有大环的化合物电子结构优选为酞菁，卟啉或聚花青，其取代产物或其金属配位络合物。粘合树脂优选为环氧树脂，三聚氰胺树脂，聚酰亚胺树脂，聚碳酸酯树脂，酚醛树脂或氟硅树脂。铁磁性材料的粉末的平均粒径优选为0.1〜100μm。

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