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    • 2. 发明授权
    • Non-single crystal semiconductor apparatus thin film transistor and
liquid crystal display apparatus
    • 非单晶半导体装置薄膜晶体管和液晶显示装置
    • US5763904A
    • 1998-06-09
    • US710110
    • 1996-09-12
    • Mitsuo NakajimaYasumasa GotouYoshito Kawakyu
    • Mitsuo NakajimaYasumasa GotouYoshito Kawakyu
    • G02F1/1368H01L21/285H01L21/336H01L21/77H01L21/84H01L27/12H01L29/786H01L29/76
    • H01L29/78618H01L21/28512H01L27/1214H01L29/66757G02F1/1368H01L29/78603
    • A thin film transistor is disclosed, that comprises a first substrate protection film formed on a transparent insulation substrate, a second substrate protection film formed in a predetermined shape on the first substrate protection film, a semiconductor film having a channel region and a contact region formed on the second substrate protection film, the channel region being surrounded by the contact region, a gate insulation film formed above the semiconductor film, the gate insulation film having an opening portion for the contact region of the semiconductor film, a gate electrode formed in a region corresponding to the channel region of the semiconductor film on the gate insulation film, an inter-layer insulation film formed above the gate electrode, the inter-layer insulation film having an opening portion for the contact region of the semiconductor film, and a plurality of electrodes formed on the inter-layer insulation film, the plurality of electrodes being connected to the contact region of the semiconductor film through the opening portion. The edge surfaces of the second substrate protection film may be tapered. A contact state between the gate electrode and the inter-layer insulation film is controlled corresponding to the concentration of hydrogen of the inter-layer insulation film.
    • 公开了一种薄膜晶体管,其包括形成在透明绝缘基板上的第一基板保护膜,在第一基板保护膜上形成为预定形状的第二基板保护膜,形成有沟道区域和接触区域的半导体膜 在所述第二基板保护膜上,所述沟道区域被所述接触区域包围,形成在所述半导体膜上方的栅极绝缘膜,所述栅极绝缘膜具有用于所述半导体膜的接触区域的开口部分, 对应于栅极绝缘膜上的半导体膜的沟道区域的区域,形成在栅极电极上方的层间绝缘膜,层间绝缘膜具有用于半导体膜的接触区域的开口部分和多个 形成在所述层间绝缘膜上的电极,所述多个电极连接到所述层间绝缘膜 通过开口部分的半导体膜的作用区域。 第二基板保护膜的边缘表面可以是锥形的。 对应于层间绝缘膜的氢浓度来控制栅电极和层间绝缘膜之间的接触状态。
    • 3. 发明授权
    • Method of producing polycrystalline silicon
    • 生产多晶硅的方法
    • US06255199B1
    • 2001-07-03
    • US09413539
    • 1999-10-06
    • Hiroshi MitsuhashiYoshito Kawakyu
    • Hiroshi MitsuhashiYoshito Kawakyu
    • H01L2120
    • H01L21/02675H01L21/02532H01L21/02691H01L21/2026
    • A thin film transistor to be adapted to each pixel switch in a liquid crystal display has a polycrystalline silicon layer which is acquired by crystallizing amorphous silicon deposited on a glass substrate by laser annealing. A characteristic curve indicating the intensity distribution of a laser beam in this laser annealing has a peak shifted on the upstream side in the direction the glass substrate is moved. In the laser annealing of amorphous silicon, the laser beam is irradiated on the amorphous silicon in such a way that a higher-intensity portion of the laser beam hits the amorphous silicon first. This can make the fluence margin of a laser beam in laser annealing wide enough to achieve a high field-effect mobility and a high yield.
    • 适用于液晶显示器中的每个像素开关的薄膜晶体管具有通过激光退火使沉积在玻璃基板上的非晶硅结晶而获得的多晶硅层。 在该激光退火中,表示激光束的强度分布的特性曲线在玻璃基板移动的方向的上游侧具有偏移。 在非晶硅的激光退火中,将激光束照射在非晶硅上,使得较高强度的激光束部分首先撞击非晶硅。 这可以使激光退火中的激光束的能量密度足够宽,以获得高的场效应迁移率和高产率。
    • 4. 发明授权
    • Method for manufacturing polycrystal semiconductor film
    • 多晶半导体膜的制造方法
    • US5970368A
    • 1999-10-19
    • US939660
    • 1997-09-29
    • Hideyuki SasakiMichihiro OoseIsao SuzukiShiro TakenoMitsuhiro TomitaYoshito KawakyuYuki MatsuuraHiroshi Mitsuhashi
    • Hideyuki SasakiMichihiro OoseIsao SuzukiShiro TakenoMitsuhiro TomitaYoshito KawakyuYuki MatsuuraHiroshi Mitsuhashi
    • H01L21/20H01L21/205H01L29/04
    • H01L21/2026
    • There is disclosed a method for manufacturing a polycrystal semiconductor film comprising the steps of applying a high energy beam to a surface of a semiconductor film comprising an amorphous or a polycrystal semiconductor provided on a surface of a substrate to melt only the semiconductor film, and solidifying the film via a solid and liquid coexisting state to form a semiconductor film comprising a polycrystal semiconductor having a large grain diameter, by heating a liquid part using a difference in an electric resistance in the liquid and solid coexisting state to heat only the liquid part, and by extending the solidification time until the completion of solidifying of the molten liquid crystal film. Furthermore, as the base film of the semiconductor film, a material having a melting point of 1600.degree. C. and a thermal conductivity of 0.01 cal/cm.s..degree. C. is used to suppress heat dissipation from the molten liquid of the semiconductor to the substrate so that time until the complete solidification can be prolonged. Furthermore, the beam is irradiated so as to form a standing wave at a predetermined position of the surface of the semiconductor film to generate the heat density distribution having the same cycle with the standing wave and to melt the semiconductor film with the result that a polycrystal semiconductor film comprising a uniform and a large crystal grains by controlling the distribution of the crystal nuclei at the interface between the base film and the substrate.
    • 公开了一种制造多晶半导体膜的方法,包括以下步骤:将高能束施加到包括设置在基板表面上的非晶或多晶半导体的半导体膜的表面,以仅熔化半导体膜,并固化 通过固体和液体共存状态形成包含具有大粒径的多晶半导体的半导体膜,通过使用液体中的电阻差和固体共存状态加热液体部分以仅加热液体部分, 并延长凝固时间直到熔融液晶膜凝固完成。 此外,作为半导体膜的基膜,具有熔点为1600℃,导热率为0.01cal / cm 3的材料。 使用DEG来抑制从半导体的熔融液体到基板的散热,从而可以延长直到完全凝固的时间。 此外,照射光束以在半导体膜的表面的预定位置处形成驻波,以产生具有与驻波相同周期的热密度分布并熔化半导体膜,结果是多晶 通过控制在基膜和基板之间的界面处的晶核的分布而包含均匀和大的晶粒的半导体膜。
    • 10. 发明授权
    • Method for producing compound semiconductors and apparatus therefor
    • 生产化合物半导体的方法及其设备
    • US5229319A
    • 1993-07-20
    • US618928
    • 1990-11-28
    • Yoshito KawakyuHironori IshikawaMasahiro SasakiMasao Mashita
    • Yoshito KawakyuHironori IshikawaMasahiro SasakiMasao Mashita
    • H01L21/205C23C16/44C23C16/455C30B25/02H01L21/20H01L21/32
    • C23C16/45525C30B25/02C30B29/40H01L21/02395H01L21/02546H01L21/0262H01L21/02639H01L21/32Y10S148/056Y10S148/065Y10S438/935
    • Disclosed is a method of selective chemical vapor deposition for selectively forming thin films of a semiconductor, dielectric or metal on a semiconductor by providing a mask of SiO.sub.2 having a plurality of openings in various forms on the substrate, wherein a trimethyl gallium (TMG) gas as a Group III material, 10% hydrogen-based arsine (AsH.sub.3) gas as a Group V material, and 500 ppm hydrogen-based disilane (Si.sub.2 H.sub.6) gas as an n-type impurity material are alternately supplied onto the substrate, and each supply amount of the material gases is controlled at a value to obtain a film growth rate for forming the corresponding monoatomic layer or monomolecular layer to each material at each opening. Also disclosed is an apparatus for performing the above-disclosed method of chemical vapor deposition, wherein four reaction chambers are included, and the material gases are supplied to the respective reaction chambers in accordance with the following gas supply sequences: Chamber 1: TMG+H.sub.2 /H.sub.2 (for gas replacement)/AsH.sub.3 +H.sub.2 /H.sub.2 (for gas replacement); Chamber 2: H.sub.2 (for gas replacement)/AsH.sub.3 +H.sub.2 /H.sub.2 (for gas replacement)/TMG+H.sub.2 ; Chamber 3: AsH.sub.3 +H.sub.2 /H.sub.2 (for gas replacement)/TMG+H.sub.2 /H.sub.2 (for gas replacement); Chamber 4: H.sub.2 (for gas replacement)/TMG+H.sub.2 /H.sub.2 (for gas replacement)/AsH.sub.3 +H.sub.2.
    • 公开了一种选择性化学气相沉积的方法,通过在衬底上提供具有各种形式的多个开口的SiO 2掩模,在半导体上选择性地形成半导体,电介质或金属的薄膜,其中三甲基镓(TMG)气体 作为III族材料,作为第V族材料的10%氢基胂(AsH 3)气体和作为n型杂质材料的500ppm氢基乙硅烷(Si 2 H 6)气体交替供给到基板上, 将材料气体的量控制在一个值以获得用于在每个开口处形成每个材料的相应单原子层或单分子层的膜生长速率。 还公开了一种用于执行上述化学气相沉积方法的装置,其中包括四个反应室,并且根据以下气体供应顺序将材料气体供应到各个反应室:腔室1:TMG + H2 / H2(用于更换气体)/ AsH3 + H2 / H2(用于更换气体); 室2:H2(用于气体置换)/ AsH3 + H2 / H2(用于气体置换)/ TMG + H2; 室3:AsH3 + H2 / H2(用于气体置换)/ TMG + H2 / H2(用于气体替换); 室4:H2(用于更换气体)/ TMG + H2 / H2(用于气体置换)/ AsH3 + H2。