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    • 9. 发明授权
    • Article and method for in-process testing of RF products
    • RF产品过程测试的条款和方法
    • US5942766A
    • 1999-08-24
    • US932001
    • 1997-09-17
    • Michel R. Frei
    • Michel R. Frei
    • H01L23/544H01L23/58
    • H01L22/32H01L22/34H01L2924/3011
    • A wafer configured for in-process electrical testing is disclosed. According to the invention, a single RF-device monitor is disposed partially in a first street and partially in a second street orthogonal to the first street, between four adjacent dies present on a wafer. With such an arrangement, streets having a width of 100 microns and less are suitable for accomodating a RF-device monitor having a ground-signal configuration. As a result, less space is sacrificed for device monitors than in prior art wafers, thereby increasing the amount of wafer area available for circuitry.
    • 公开了一种配置用于在线电气测试的晶圆。 根据本发明,单个RF设备监视器部分地设置在第一街道中,部分地设置在与第一街道正交的第二街道中,存在于晶片上的四个相邻裸片之间。 通过这样的布置,具有100微米或更小的宽度的街道适合于容纳具有接地信号配置的RF设备监视器。 结果,对于设备监视器而言,牺牲了比现有技术的晶片少的空间,从而增加了可用于电路的晶片面积的数量。