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    • 4. 发明申请
    • DATA COMMUNICATION SYSTEM AND METHOD
    • 数据通信系统及方法
    • US20090313407A1
    • 2009-12-17
    • US12375855
    • 2006-08-01
    • Philippe LanceArlette Marty-BlavierEric Rolland
    • Philippe LanceArlette Marty-BlavierEric Rolland
    • G06F13/42
    • H04L7/06
    • A data communication system includes one or more data processing units and includes a central control unit. The decentralized data processing units are connected to the central control unit by data connection. The central control unit includes a synchronisation unit for outputting via the data connection an electric synchronisation signal to the data processing unit. The data processing unit includes a data generator for generating data and transmitting, after the electric synchronisation signal, data to the central control unit. The central control unit further includes a discharge signal generator for outputting a discharge signal via the data connection to the data processing unit.
    • 数据通信系统包括一个或多个数据处理单元,并且包括中央控制单元。 分散数据处理单元通过数据连接连接到中央控制单元。 中央控制单元包括同步单元,用于经由数据连接将电同步信号输出到数据处理单元。 数据处理单元包括用于产生数据并在电同步信号之后将数据发送到中央控制单元的数据发生器。 中央控制单元还包括放电信号发生器,用于经由数据连接将数据处理单元的放电信号输出。
    • 8. 发明授权
    • Apparatus for managing an intergrated circuit
    • 用于管理集成电路的装置
    • US06750664B2
    • 2004-06-15
    • US09934159
    • 2001-08-21
    • Philippe LancePhilippe Meunier
    • Philippe LancePhilippe Meunier
    • G01R2708
    • G01N25/72
    • An apparatus for an integrated circuit comprising a thermal sensor (41-44), an A-D converter (58) coupled to the thermal sensor, wherein the thermal sensor provides an input to the A-D converter, and the A-D converter converts the input to a digital value representative of the thermal environment of the thermal sensor. The integrated circuit collects a data value at a location on an integrated circuit wherein the data value has a predetermined functional relationship to the temperature at the location. The integrated circuit converts the data value to a value representative of the thermal environment of the location on the integrated circuit.
    • 一种用于集成电路的装置,包括热传感器(41-44),耦合到所述热传感器的AD转换器(58),其中所述热传感器向所述AD转换器提供输入,并且所述AD转换器将所述输入转换为数字 代表热传感器的热环境的值。 集成电路在集成电路的位置处收集数据值,其中数据值与该位置处的温度具有预定的功能关系。 集成电路将数据值转换为代表集成电路上位置的热环境的值。
    • 9. 发明授权
    • Chip damage detection device for a semiconductor integrated circuit
    • 一种用于半导体集成电路的芯片损坏检测装置
    • US09157955B2
    • 2015-10-13
    • US13522865
    • 2010-01-21
    • Erwan HemonPhilippe LanceKurt Neugebauer
    • Erwan HemonPhilippe LanceKurt Neugebauer
    • G01R31/20G01R31/28G01R31/317
    • G01R31/31717H01L2924/0002H01L2924/00
    • A chip damage detection device is provided that includes at least one bi-stable circuit having a first conductive line passing through an observed area of a semiconductor integrated circuit chip for damage monitoring of the observed area. The at least one bi-stable circuit is arranged to flip from a first stable state into a second stable state when a potential difference between a first end and a second end of the first conductive line changes or when a leakage current overdrives a state keeping current at the first conductive line. Further, a semiconductor integrated circuit device that includes the chip damage detection device and a safety critical system that includes the semiconductor integrated circuit device or the chip damage detection circuit is provided.
    • 提供一种芯片损伤检测装置,其包括至少一个双稳电路,该双稳态电路具有穿过半导体集成电路芯片的观察区域的第一导线,用于对观察区域进行损伤监测。 当第一导电线的第一端和第二端之间的电位差发生变化时,或当泄漏电流过驱动保持电流时,至少一个双稳态电路被布置成从第一稳定状态翻转到第二稳定状态 在第一导线上。 此外,提供了包括芯片损坏检测装置和包括半导体集成电路装置或芯片损坏检测电路的安全关键系统的半导体集成电路装置。