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    • 1. 发明授权
    • Fault management for a communication bus
    • 通讯总线故障管理
    • US08438419B2
    • 2013-05-07
    • US12997993
    • 2008-06-30
    • Valerie Bernon-EnjalbertThierry CassagnesPhilippe Lance
    • Valerie Bernon-EnjalbertThierry CassagnesPhilippe Lance
    • H04L29/14
    • H04L12/403H01L2224/48137H01L2224/49175H01L2924/13091H04L12/10H04L25/0272H04L25/028H04L25/08H01L2924/00
    • A differential communication bus comprising a master module and a plurality of slave modules connected to at least first and second conductors whereby to communicate between the master and slave modules. The master module comprises a driver for applying first and second voltages respectively to the first and second conductors and for sourcing and sinking currents in the first and second conductors. The driver controls a difference between the first and second voltages and a common mode value of the first and second voltages. The driver includes first sourcing and sinking current limiters and second sourcing and sinking current limiters for limiting the currents in the first and second conductors. The master module is selectively responsive to a fault condition triggering simultaneous activation of the first and second sourcing current limiters or of the first and second sinking current limiters to disable the driver.
    • 差分通信总线包括主模块和连接到至少第一和第二导体的多个从模块,从而在主模块和从模块之间进行通信。 主模块包括用于将第一和第二电压分别施加到第一和第二导体并用于在第一和第二导体中的电流和吸收电流的驱动器。 驱动器控制第一和第二电压之间的差异以及第一和第二电压的共模值。 该驱动器包括用于限制第一和第二导体中的电流的第一采样和吸收限流器以及第二采集和吸收限流器。 主模块选择性地响应于触发同时激活第一和第二源电流限制器或第一和第二吸收电流限制器的故障条件以禁用驱动器。
    • 7. 发明授权
    • Apparatus for managing an intergrated circuit
    • 用于管理集成电路的装置
    • US06750664B2
    • 2004-06-15
    • US09934159
    • 2001-08-21
    • Philippe LancePhilippe Meunier
    • Philippe LancePhilippe Meunier
    • G01R2708
    • G01N25/72
    • An apparatus for an integrated circuit comprising a thermal sensor (41-44), an A-D converter (58) coupled to the thermal sensor, wherein the thermal sensor provides an input to the A-D converter, and the A-D converter converts the input to a digital value representative of the thermal environment of the thermal sensor. The integrated circuit collects a data value at a location on an integrated circuit wherein the data value has a predetermined functional relationship to the temperature at the location. The integrated circuit converts the data value to a value representative of the thermal environment of the location on the integrated circuit.
    • 一种用于集成电路的装置,包括热传感器(41-44),耦合到所述热传感器的AD转换器(58),其中所述热传感器向所述AD转换器提供输入,并且所述AD转换器将所述输入转换为数字 代表热传感器的热环境的值。 集成电路在集成电路的位置处收集数据值,其中数据值与该位置处的温度具有预定的功能关系。 集成电路将数据值转换为代表集成电路上位置的热环境的值。
    • 8. 发明授权
    • Chip damage detection device for a semiconductor integrated circuit
    • 一种用于半导体集成电路的芯片损坏检测装置
    • US09157955B2
    • 2015-10-13
    • US13522865
    • 2010-01-21
    • Erwan HemonPhilippe LanceKurt Neugebauer
    • Erwan HemonPhilippe LanceKurt Neugebauer
    • G01R31/20G01R31/28G01R31/317
    • G01R31/31717H01L2924/0002H01L2924/00
    • A chip damage detection device is provided that includes at least one bi-stable circuit having a first conductive line passing through an observed area of a semiconductor integrated circuit chip for damage monitoring of the observed area. The at least one bi-stable circuit is arranged to flip from a first stable state into a second stable state when a potential difference between a first end and a second end of the first conductive line changes or when a leakage current overdrives a state keeping current at the first conductive line. Further, a semiconductor integrated circuit device that includes the chip damage detection device and a safety critical system that includes the semiconductor integrated circuit device or the chip damage detection circuit is provided.
    • 提供一种芯片损伤检测装置,其包括至少一个双稳电路,该双稳态电路具有穿过半导体集成电路芯片的观察区域的第一导线,用于对观察区域进行损伤监测。 当第一导电线的第一端和第二端之间的电位差发生变化时,或当泄漏电流过驱动保持电流时,至少一个双稳态电路被布置成从第一稳定状态翻转到第二稳定状态 在第一导线上。 此外,提供了包括芯片损坏检测装置和包括半导体集成电路装置或芯片损坏检测电路的安全关键系统的半导体集成电路装置。