专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06871544B1 Sensor design and process 有权
标题翻译：传感器设计和工艺
公开(公告)号：US06871544B1
公开(公告)日：2005-03-29
申请号：US09936640
申请日：2000-03-16
申请人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
发明人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
IPC分类号： G01D11/24 , G01P1/02 , G01P15/02 , G01P15/08 , G01P15/125 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/18 , G01V1/38 , H01L21/465 , G01P15/00
CPC分类号： G01P1/023 , G01D11/245 , G01P15/08 , G01P15/125 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/181 , G01V1/38 , Y10T29/49007
摘要： An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).
摘要翻译：一种用于测量地震数据的加速度计（305）。加速度计（305）包括用于在真空密封过程中使用的集成通气孔以及用于减小盖晶片弯曲的平衡金属图案。加速度计（305）还包括用于将结合压力隔离到加速度计（305）的特定区域的顶盖压制框架凹部（405）和底盖压制框架凹部（420）。加速度计（305）被真空密封并且包括平衡的金属图案（730），以防止加速度计（305）的性能的劣化。在加速度计（305）上执行切割处理以隔离加速度计（305）的电引线。加速度计（305）还包括过冲保护缓冲器（720）和图案化的金属电极，以在加速度计（305）的操作期间减小静摩擦力。

2. 发明授权

US06945110B2 Sensor design and process 有权
公开(公告)号：US06945110B2
公开(公告)日：2005-09-20
申请号：US10896602
申请日：2004-07-21
申请人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
发明人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
IPC分类号： G01D11/24 , G01P1/02 , G01P15/02 , G01P15/08 , G01P15/125 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/18 , G01V1/38 , H01L21/465 , G01P15/00 , H01L21/76
CPC分类号： G01P1/023 , G01D11/245 , G01P15/08 , G01P15/125 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/181 , G01V1/38 , Y10T29/49007
摘要： An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

3. 发明授权

US07274079B2 Sensor design and process 有权
标题翻译：传感器设计和工艺
公开(公告)号：US07274079B2
公开(公告)日：2007-09-25
申请号：US11209164
申请日：2005-08-22
申请人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
发明人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
IPC分类号： H01L29/84 , H01L21/00
CPC分类号： G01P1/023 , G01D11/245 , G01P15/08 , G01P15/125 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/181 , G01V1/38 , Y10T29/49007
摘要： An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).
摘要翻译：一种用于测量地震数据的加速度计（305）。加速度计（305）包括用于在真空密封过程中使用的集成通气孔以及用于减小盖晶片弯曲的平衡金属图案。加速度计（305）还包括用于将结合压力隔离到加速度计（305）的特定区域的顶盖压制框架凹部（405）和底盖压制框架凹部（420）。加速度计（305）被真空密封并且包括平衡的金属图案（730），以防止加速度计（305）的性能的劣化。在加速度计（305）上执行切割处理以隔离加速度计（305）的电引线。加速度计（305）还包括过冲保护缓冲器（720）和图案化的金属电极，以在加速度计（305）的操作期间减小静摩擦力。

4. 发明授权

US07152473B1 Integrated and multi-axis sensor assembly and packaging 有权
标题翻译：集成和多轴传感器组装和包装
公开(公告)号：US07152473B1
公开(公告)日：2006-12-26
申请号：US09936634
申请日：2000-03-17
申请人： Larry Rushefsky , Axel Sigmar , Howard D. Goldberg , W. Marc Stalnaker , Ray Rinne , Demetrios Balderes , Guido Lemke , Matthew Ip , Lawrence P. Behn , Klaus Domagalski , Lianzhong Yu , Arjun Selvakumar , Duli Yu , James L. Marsh , Peter Maxwell , David Morgan , Thomas Buie , Kees Faber , Sjoerd Altman , Richard Laroo
发明人： Larry Rushefsky , Axel Sigmar , Howard D. Goldberg , W. Marc Stalnaker , Ray Rinne , Demetrios Balderes , Guido Lemke , Matthew Ip , Lawrence P. Behn , Klaus Domagalski , Lianzhong Yu , Arjun Selvakumar , Duli Yu , James L. Marsh , Peter Maxwell , David Morgan , Thomas Buie , Kees Faber , Sjoerd Altman , Richard Laroo
IPC分类号： G01D11/10 , G01P15/00
CPC分类号： B81B7/0074 , B81B2201/0242 , G01D11/245 , G01P1/023 , G01P15/18 , H01L2224/48091 , H01L2224/48472 , H01L2924/00014
摘要： A sensor apparatus (104) includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module (305) supported by a planar surface (345) within a cavity (340) of a housing (205) coupled to a first end cap (210) by a PC-board connection (355). Housing (205) is further coupled to first end cap (210) by a first coupling member (315) and a second coupling member (320) and is also coupled to an opposite second end cap (215) by a third coupling member (320) and a fourth coupling member (325). Interface sealing members (330a, 330b, 330c, 330d) seal between housing (205) and first end cap (210). Interface sealing members (335a, 335b, 335c, 335d) seal between housing (205) and second end cap (215).
摘要翻译：传感器装置（104）包括灵敏度定位的传感器组件的多个不同的空间方向轴，所述传感器组件包含传感器模块（305），所述传感器组件由平面（345）支撑在壳体（205）的空腔（340）内，所述壳体耦合到第一端盖（210）通过PC板连接（355）。壳体（205）还通过第一联接构件（315）和第二联接构件（320）进一步联接到第一端盖（210），并且还通过第三联接构件（320）联接到相对的第二端盖（215））和第四联接构件（325）。接口密封构件（330a，330b，330c，330d）在壳体（205）和第一端盖（210）之间密封。接口密封构件（335a，335b，335c，335d）在壳体（205）和第二端盖（215）之间密封。

5. 发明授权

US06861587B1 Low stress die attachment 有权
标题翻译：低应力模附件
公开(公告)号：US06861587B1
公开(公告)日：2005-03-01
申请号：US09914421
申请日：2000-03-15
申请人： Arjun SelVakumar , James L. Marsh , Howard D. Goldberg , Duli Yu , W. Marc Stalnaker
发明人： Arjun SelVakumar , James L. Marsh , Howard D. Goldberg , Duli Yu , W. Marc Stalnaker
IPC分类号： G01P21/00 , G01D11/24 , G01D18/00 , G01H1/00 , G01L27/00 , G01N1/02 , G01P1/02 , G01P15/08 , G01P15/125 , G01P15/13 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/18 , G01V1/40 , H01L21/60 , H01L29/84 , H05K5/00
CPC分类号： G01P1/023 , B81B3/001 , B81B3/0072 , B81B7/0016 , B81B2201/0235 , G01D11/245 , G01D18/008 , G01N2001/021 , G01P15/0802 , G01P15/13 , G01P21/00 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/181 , G01V1/186 , H01L2224/48472 , H01L2924/0002 , H01L2924/00
摘要： A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.
摘要翻译：一种用于将质料弹性地附接到包装的系统。该系统包括质量块，壳体，弹性联接器，用于弹性地将质量连接到壳体，用于滑动地支撑质量的缓冲器以及用于将质量块电耦合到壳体的电连接。

6. 发明授权

US06315423B1 Micro machined mirror 有权
标题翻译：微加工镜
公开(公告)号：US06315423B1
公开(公告)日：2001-11-13
申请号：US09352835
申请日：1999-07-13
申请人： Duli Yu , Lianzhong Yu , Howard D. Goldberg , Martin A. Schmidt , Robert P. Ried
发明人： Duli Yu , Lianzhong Yu , Howard D. Goldberg , Martin A. Schmidt , Robert P. Ried
IPC分类号： G02B7182
CPC分类号： G02B26/0841 , G02B7/1821
摘要： A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges and includes travel stops that limit motion of the mirror in the z-direction. The top and bottom micro machined caps also include travel stops that limit motion of the mirror in the z-direction.
摘要翻译：提供了一种微加工镜组件，其包括安装在陶瓷衬底上的微加工顶盖，镜和底盖。微加工镜由一对T形铰链弹性支撑，并包括限制镜子在z方向运动的行程挡块。顶部和底部微加工帽还包括限制镜子在z方向上的运动的行程挡块。

7. 发明授权

US06617098B1 Merged-mask micro-machining process 有权
标题翻译：合并掩模微加工工艺
公开(公告)号：US06617098B1
公开(公告)日：2003-09-09
申请号：US09352025
申请日：1999-07-13
申请人： Lianzhong Yu , Robert P. Ried , Howard D. Goldberg , Duli Yu
发明人： Lianzhong Yu , Robert P. Ried , Howard D. Goldberg , Duli Yu
IPC分类号： G03F700
CPC分类号： G02B26/0816 , B81B2201/042 , B81C1/00396 , B81C2201/0132 , B81C2201/0133 , B81C2203/0109 , C23F1/02
摘要： A merged-mask micro-machining process is provided that includes the application of a plurality of layers of masking material that are patterned to provide a plurality of etching masks.
摘要翻译：提供了一种合并掩模微加工工艺，其包括施加图案化以提供多个蚀刻掩模的多层掩模材料。

8. 发明授权

US06458513B1 Temporary bridge for micro machined structures 有权
标题翻译：微加工结构临时桥梁
公开(公告)号：US06458513B1
公开(公告)日：2002-10-01
申请号：US09406158
申请日：1999-09-27
申请人： Lianzhong Yu , Howard D. Goldberg , Duli Yu
发明人： Lianzhong Yu , Howard D. Goldberg , Duli Yu
IPC分类号： G03F700
CPC分类号： B81C1/00142 , B81B2201/042 , B81B2203/0315 , B81C1/00896 , B81C2203/0118 , B81C2203/036 , G02B26/0816
摘要： A micro machined structure includes one or more temporary bridges for temporarily coupling the micro machined structure to a support structure.
摘要翻译：微加工结构包括用于将微加工结构临时耦合到支撑结构的一个或多个临时桥。

9. 发明授权

US5511428A Backside contact of sensor microstructures 失效
标题翻译：传感器微结构背面接触
公开(公告)号：US5511428A
公开(公告)日：1996-04-30
申请号：US257716
申请日：1994-06-10
申请人： Howard D. Goldberg , Martin A. Schmidt
发明人： Howard D. Goldberg , Martin A. Schmidt
IPC分类号： B81B7/00 , G01F1/684 , G01L9/00 , G01P15/08 , H01L29/96
CPC分类号： B81B7/0061 , B81B7/007 , G01F1/6845 , G01L9/0042 , G01L9/0073 , G01P15/0802 , G01B2210/64
摘要： A sensor microstructure contact scheme is provided for making backside electrical, mechanical, fluidic, or other contact to mechanical microstructures. The contact scheme is applicable to pressure sensors, shear stress sensors, flow rate sensors, temperature sensors, resonant microactuators, and other microsensors and microactuators. The contact scheme provides a microelectromechanical sensor body and support structure for backside contact of the sensor body, and features a support wafer substrate having one or more through-wafer vias each with a lateral span on the dimension of microns and a span that is more narrow at the wafer front surface than at the wafer back surface. An insulating film covers a portion of the support wafer substrate and sidewalls of the vias--with the lateral via span at the front surface being open. The front surface of the support wafer substrate is bonded to the front surface of a sensor body wafer substrate, such that contact of the front surface of the sensor body wafer substrate may be made through the support wafer substrate vias from the back surface of the support wafer substrate. The sensor body wafer substrate is adapted to define a mechanical sensor microstructure, and comprises a plurality of isolated substrate regions, each region corresponding to one of the support wafer substrate through-wafer vias. Each such region is circumscribed by an edge of the mechanical sensor microstructure and an isolating border region. Contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions is isolated and thereby prevented from making contact to any other sensor body substrate region.
摘要翻译：提供传感器微结构接触方案用于制造机械微观结构的背面电气，机械，流体或其他接触。接触方案适用于压力传感器，剪切应力传感器，流量传感器，温度传感器，共振微致动器和其他微传感器和微型致动器。接触方案提供了用于传感器主体的背侧接触的微机电传感器主体和支撑结构，其特征在于具有一个或多个贯穿晶片通孔的支撑晶片基板，每个通孔具有微米尺寸上的横向跨度和更窄的跨度在晶片正面与晶片背面相比。绝缘膜覆盖支撑晶片基板的一部分和通孔的侧壁，其中在前表面处的横向通孔跨度是敞开的。支撑晶片基板的前表面结合到传感器体晶片基板的前表面，使得传感器体晶片基板的前表面可以通过支撑晶片基板通孔从支撑体的后表面晶圆基板。传感器体晶片衬底适于限定机械传感器微结构，并且包括多个隔离的衬底区域，每个区域对应于支撑晶片衬底通晶片通孔之一。每个这样的区域被机械传感器微结构的边缘和隔离边界区域限定。通过支撑晶片衬底通过晶片通孔中的一个到相应的一个传感器主体衬底区域的接触被隔离，从而防止与任何其它传感器主体衬底区域接触。

10. 发明授权

US5607566A Batch deposition of polymeric ion sensor membranes 失效
标题翻译：聚合离子传感器膜的分批沉积
公开(公告)号：US5607566A
公开(公告)日：1997-03-04
申请号：US196105
申请日：1994-10-03
申请人： Richard B. Brown , Guen-Sig Cha , Howard D. Goldberg
发明人： Richard B. Brown , Guen-Sig Cha , Howard D. Goldberg
IPC分类号： G01N27/333 , G01N27/414 , G01N27/26
CPC分类号： G01N27/3335
摘要： Screen printing technology is employed in the batch fabrication of the contacts and polymeric membranes of solid-state ion-selective sensors. The process achieves high yield with very reproducible results. Moreover, membrane thickness can easily be predetermined, as it is directly related to the thickness of the screen or stencil. The process of the present invention is compatible with many integrated circuit manufacturing technologies, including CMOS fabrication. Advantageous polymeric membrane paste compositions include a polyurethane/hydroxylated poly(vinyl chloride) compound and a silicone-based compound in appropriate solvent systems to provide screen-printable pastes of the appropriate viscosity and thixotropy.
摘要翻译： PCT No.PCT / US92 / 07037 Sec。 371日期：1994年10月3日 102（e）日期1994年10月3日PCT 1992年8月20日提交印刷技术用于批量制造固态离子选择传感器的接触和聚合物膜。该方法获得高产量，结果非常可重现。此外，膜厚度可以容易地被预先确定，因为其与丝网或模板的厚度直接相关。本发明的方法与许多集成电路制造技术相兼容，包括CMOS制造。有利的聚合物膜糊组合物包括在合适的溶剂体系中的聚氨酯/羟基化聚（氯乙烯）化合物和硅氧烷基化合物，以提供具有适当粘度和触变性的可印刷丝网的浆料。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式