专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06315423B1 Micro machined mirror 有权
标题翻译：微加工镜
公开(公告)号：US06315423B1
公开(公告)日：2001-11-13
申请号：US09352835
申请日：1999-07-13
申请人： Duli Yu , Lianzhong Yu , Howard D. Goldberg , Martin A. Schmidt , Robert P. Ried
发明人： Duli Yu , Lianzhong Yu , Howard D. Goldberg , Martin A. Schmidt , Robert P. Ried
IPC分类号： G02B7182
CPC分类号： G02B26/0841 , G02B7/1821
摘要： A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges and includes travel stops that limit motion of the mirror in the z-direction. The top and bottom micro machined caps also include travel stops that limit motion of the mirror in the z-direction.
摘要翻译：提供了一种微加工镜组件，其包括安装在陶瓷衬底上的微加工顶盖，镜和底盖。微加工镜由一对T形铰链弹性支撑，并包括限制镜子在z方向运动的行程挡块。顶部和底部微加工帽还包括限制镜子在z方向上的运动的行程挡块。

2. 发明授权

US06945110B2 Sensor design and process 有权
公开(公告)号：US06945110B2
公开(公告)日：2005-09-20
申请号：US10896602
申请日：2004-07-21
申请人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
发明人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
IPC分类号： G01D11/24 , G01P1/02 , G01P15/02 , G01P15/08 , G01P15/125 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/18 , G01V1/38 , H01L21/465 , G01P15/00 , H01L21/76
CPC分类号： G01P1/023 , G01D11/245 , G01P15/08 , G01P15/125 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/181 , G01V1/38 , Y10T29/49007
摘要： An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

3. 发明授权

US06871544B1 Sensor design and process 有权
标题翻译：传感器设计和工艺
公开(公告)号：US06871544B1
公开(公告)日：2005-03-29
申请号：US09936640
申请日：2000-03-16
申请人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
发明人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
IPC分类号： G01D11/24 , G01P1/02 , G01P15/02 , G01P15/08 , G01P15/125 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/18 , G01V1/38 , H01L21/465 , G01P15/00
CPC分类号： G01P1/023 , G01D11/245 , G01P15/08 , G01P15/125 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/181 , G01V1/38 , Y10T29/49007
摘要： An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).
摘要翻译：一种用于测量地震数据的加速度计（305）。加速度计（305）包括用于在真空密封过程中使用的集成通气孔以及用于减小盖晶片弯曲的平衡金属图案。加速度计（305）还包括用于将结合压力隔离到加速度计（305）的特定区域的顶盖压制框架凹部（405）和底盖压制框架凹部（420）。加速度计（305）被真空密封并且包括平衡的金属图案（730），以防止加速度计（305）的性能的劣化。在加速度计（305）上执行切割处理以隔离加速度计（305）的电引线。加速度计（305）还包括过冲保护缓冲器（720）和图案化的金属电极，以在加速度计（305）的操作期间减小静摩擦力。

4. 发明授权

US07274079B2 Sensor design and process 有权
标题翻译：传感器设计和工艺
公开(公告)号：US07274079B2
公开(公告)日：2007-09-25
申请号：US11209164
申请日：2005-08-22
申请人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
发明人： Arjun Selvakumar , Howard D. Goldberg , Duli Yu , Matthew Ip , Martin A. Schmidt , James L. Marsh , Bing-Fai Fung , Philip Simon
IPC分类号： H01L29/84 , H01L21/00
CPC分类号： G01P1/023 , G01D11/245 , G01P15/08 , G01P15/125 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/181 , G01V1/38 , Y10T29/49007
摘要： An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).
摘要翻译：一种用于测量地震数据的加速度计（305）。加速度计（305）包括用于在真空密封过程中使用的集成通气孔以及用于减小盖晶片弯曲的平衡金属图案。加速度计（305）还包括用于将结合压力隔离到加速度计（305）的特定区域的顶盖压制框架凹部（405）和底盖压制框架凹部（420）。加速度计（305）被真空密封并且包括平衡的金属图案（730），以防止加速度计（305）的性能的劣化。在加速度计（305）上执行切割处理以隔离加速度计（305）的电引线。加速度计（305）还包括过冲保护缓冲器（720）和图案化的金属电极，以在加速度计（305）的操作期间减小静摩擦力。

5. 发明授权

US5511428A Backside contact of sensor microstructures 失效
标题翻译：传感器微结构背面接触
公开(公告)号：US5511428A
公开(公告)日：1996-04-30
申请号：US257716
申请日：1994-06-10
申请人： Howard D. Goldberg , Martin A. Schmidt
发明人： Howard D. Goldberg , Martin A. Schmidt
IPC分类号： B81B7/00 , G01F1/684 , G01L9/00 , G01P15/08 , H01L29/96
CPC分类号： B81B7/0061 , B81B7/007 , G01F1/6845 , G01L9/0042 , G01L9/0073 , G01P15/0802 , G01B2210/64
摘要： A sensor microstructure contact scheme is provided for making backside electrical, mechanical, fluidic, or other contact to mechanical microstructures. The contact scheme is applicable to pressure sensors, shear stress sensors, flow rate sensors, temperature sensors, resonant microactuators, and other microsensors and microactuators. The contact scheme provides a microelectromechanical sensor body and support structure for backside contact of the sensor body, and features a support wafer substrate having one or more through-wafer vias each with a lateral span on the dimension of microns and a span that is more narrow at the wafer front surface than at the wafer back surface. An insulating film covers a portion of the support wafer substrate and sidewalls of the vias--with the lateral via span at the front surface being open. The front surface of the support wafer substrate is bonded to the front surface of a sensor body wafer substrate, such that contact of the front surface of the sensor body wafer substrate may be made through the support wafer substrate vias from the back surface of the support wafer substrate. The sensor body wafer substrate is adapted to define a mechanical sensor microstructure, and comprises a plurality of isolated substrate regions, each region corresponding to one of the support wafer substrate through-wafer vias. Each such region is circumscribed by an edge of the mechanical sensor microstructure and an isolating border region. Contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions is isolated and thereby prevented from making contact to any other sensor body substrate region.
摘要翻译：提供传感器微结构接触方案用于制造机械微观结构的背面电气，机械，流体或其他接触。接触方案适用于压力传感器，剪切应力传感器，流量传感器，温度传感器，共振微致动器和其他微传感器和微型致动器。接触方案提供了用于传感器主体的背侧接触的微机电传感器主体和支撑结构，其特征在于具有一个或多个贯穿晶片通孔的支撑晶片基板，每个通孔具有微米尺寸上的横向跨度和更窄的跨度在晶片正面与晶片背面相比。绝缘膜覆盖支撑晶片基板的一部分和通孔的侧壁，其中在前表面处的横向通孔跨度是敞开的。支撑晶片基板的前表面结合到传感器体晶片基板的前表面，使得传感器体晶片基板的前表面可以通过支撑晶片基板通孔从支撑体的后表面晶圆基板。传感器体晶片衬底适于限定机械传感器微结构，并且包括多个隔离的衬底区域，每个区域对应于支撑晶片衬底通晶片通孔之一。每个这样的区域被机械传感器微结构的边缘和隔离边界区域限定。通过支撑晶片衬底通过晶片通孔中的一个到相应的一个传感器主体衬底区域的接触被隔离，从而防止与任何其它传感器主体衬底区域接触。

6. 发明授权

US09388916B2 Single-use, permanently-sealable microvalve 有权
标题翻译：一次性，永久密封的微型阀
公开(公告)号：US09388916B2
公开(公告)日：2016-07-12
申请号：US13307665
申请日：2011-11-30
申请人： Akintunde I. Akinwande , Carol Livermore-Clifford , Martin A. Schmidt , Aalap S. Dighe , Luis Fernando Velásquez-García
发明人： Akintunde I. Akinwande , Carol Livermore-Clifford , Martin A. Schmidt , Aalap S. Dighe , Luis Fernando Velásquez-García
IPC分类号： F16K17/40 , F16K99/00
CPC分类号： F16K99/003 , F16K99/0044 , Y10T29/49412 , Y10T137/1812
摘要： A microvalve device is provided that includes a through via located in an island structure supported on a thermally-insulating membrane supported by a frame. The through via is surrounded by a meltable sealing material. A heater element is positioned on the island structure for sealing the material over the through via by heating the sealing material.
摘要翻译：提供了一种微型阀装置，其包括位于由框架支撑的绝热膜上支撑的岛状结构中的通孔。通孔由可熔融的密封材料包围。加热器元件位于岛状结构上，用于通过加热密封材料将材料密封在通孔上。

7. 发明申请

US20120076925A1 METHOD AND APPARATUS FOR THERMAL JET PRINTING 审中-公开
标题翻译：热喷涂印刷方法与装置
公开(公告)号：US20120076925A1
公开(公告)日：2012-03-29
申请号：US13311409
申请日：2011-12-05
申请人： Vladimir Bulovic , Jianglong Chen , Conor Francis Madigan , Martin A. Schmidt
发明人： Vladimir Bulovic , Jianglong Chen , Conor Francis Madigan , Martin A. Schmidt
IPC分类号： B41J29/38 , B05D5/06
CPC分类号： B41J2/04588 , B05B17/0638 , B41J2/04581 , B41J2/07 , B41J2/14 , B41J2202/09 , B41J2202/16 , H01L51/0005 , H01L51/56 , H05B33/10
摘要： The disclosure relates to a method for depositing films on a substrate which may form part of an LED or other types of display. In one embodiment, the disclosure relates to an apparatus for depositing ink on a substrate. The apparatus includes a chamber for receiving ink; a discharge nozzle having an inlet port and an outlet port, the discharge nozzle receiving a quantity of ink from the chamber at the inlet port and dispensing the quantity of ink from the outlet port; and a dispenser for metering the quantity of ink from the chamber to the inlet port of the discharge nozzle; wherein the chamber receives ink in liquid form having a plurality of suspended particles and the quantity of ink is pulsatingly metered from the chamber to the discharge nozzle; and the discharge nozzle evaporates the carrier liquid and deposits the solid particles on the substrate.
摘要翻译：本公开涉及一种用于在可以形成LED或其他类型的显示器的一部分的衬底上沉积膜的方法。在一个实施例中，本公开涉及一种用于在基底上沉积墨的装置。该装置包括用于接收墨水的腔室; 具有入口和出口的排出喷嘴，所述排出喷嘴从所述入口处的所述室接收一定量的墨，并从所述出口分配墨水量; 以及分配器，用于计量从所述腔室到所述排放喷嘴的入口的墨水量; 其中所述腔室容纳具有多个悬浮颗粒的液体形式的墨水，并且所述墨水量从所述腔室脉动地计量到所述排放喷嘴; 并且排出喷嘴使载液蒸发并将固体颗粒沉积在基板上。

8. 发明申请

US20110262624A1 Method and Apparatus for Depositing LED Organic Film 审中-公开
标题翻译：用于沉积LED有机膜的方法和装置
公开(公告)号：US20110262624A1
公开(公告)日：2011-10-27
申请号：US13095619
申请日：2011-04-27
申请人： Vladimir Bulovic , Marc A. Baldo , Martin A. Schmidt , Valerie LeBlanc , Jianglong Chen
发明人： Vladimir Bulovic , Marc A. Baldo , Martin A. Schmidt , Valerie LeBlanc , Jianglong Chen
IPC分类号： B05D5/12 , B05B7/22 , C23C14/24 , B05B1/00
CPC分类号： H01L51/0011 , B05D1/12 , C23C16/04 , C23C16/042 , C23C16/448 , C23C16/4481 , C23C16/4483 , C23C16/4485 , C23C16/45565 , C23C16/45568 , H01L51/56
摘要： In one embodiment the disclosure relates to an apparatus for depositing an organic material on a substrate, including a source heater for heating organic particles to form suspended organic particles; a transport stream for delivering the suspended organic particles to a discharge nozzle, the discharge nozzle having a plurality of micro-pores, the micro-pores providing a conduit for passage of the suspended organic particles; and a nozzle heater for pulsatingly heating the micro-pores nozzle to discharge the suspended organic particles from the discharge nozzle.
摘要翻译：在一个实施方案中，本公开涉及一种用于在基底上沉积有机材料的装置，包括用于加热有机颗粒以形成悬浮的有机颗粒的源加热器; 用于将悬浮的有机颗粒输送到排出喷嘴的输送流，排出喷嘴具有多个微孔，微孔提供用于悬浮的有机颗粒通过的导管; 以及喷嘴加热器，用于脉动地加热微孔喷嘴以从排出喷嘴排出悬浮的有机颗粒。

9. 发明申请

US20080171249A1 Thermally efficient micromachined device 审中-公开
标题翻译：热效率微加工装置
公开(公告)号：US20080171249A1
公开(公告)日：2008-07-17
申请号：US11890698
申请日：2007-08-07
申请人： Leonel R. Arana , Aleksander J. Franz , Klavs F. Jensen , Samuel B. Schaevitz , Martin A. Schmidt
发明人： Leonel R. Arana , Aleksander J. Franz , Klavs F. Jensen , Samuel B. Schaevitz , Martin A. Schmidt
IPC分类号： H01M8/08 , F28F1/00 , F28F1/20 , C01B3/32 , F25B21/02 , B01J19/24
CPC分类号： B01F5/0618 , B01F13/0059 , B01F2005/0621 , B01F2005/0636 , B01J19/0093 , B01J23/468 , B01J35/04 , B01J2219/00783 , B01J2219/00828 , B01J2219/00835 , B01J2219/0086 , B01J2219/00873 , B01J2219/00889 , B01L3/5027 , B01L2200/14 , B01L2300/1805 , B01L2300/1883 , C01B3/047 , C01B3/323 , C01B3/386 , C01B2203/0233 , C01B2203/0261 , C01B2203/066 , C01B2203/0811 , C01B2203/0822 , C01B2203/1223 , C01B2203/1247 , C01B2203/1282 , F28F3/12 , F28F2260/02 , H01M8/04097 , H01M8/04201 , H01M8/0606 , H01M2250/405 , Y02B90/16 , Y02E60/364 , Y02P20/128 , Y02P20/52
摘要： A micromachined device for efficient thermal processing at least one fluid stream includes at least one fluid conducting tube having at least a region with wall thickness of less than 50 μm. The device optionally includes one or more thermally conductive structures in thermal communication with first and second thermally insulating portions of the fluid conducting tube. The device also may include a thermally conductive region, and at least a portion of the fluid conducting tube is disposed within the region. A plurality of structures may be provided projecting from a wall of the fluid conducting tube into an inner volume of the tube. The structures enhance thermal conduction between a fluid within the tube and a wall of the tube. A method for fabricating, from a substrate, a micromachined device for processing a fluid stream allows the selective removal of portions of the substrate to provide desired structures integrated within the device. As an example, the micromachined device may be adapted to efficiently react fluid reactants to produce fuel for a fuel cell associated with the device, resulting in a system capable of conversion of chemical to electrical energy.
摘要翻译：一种用于高效热处理的微加工装置，至少一个流体流包括至少一个具有至少一个壁厚小于50um的区域的流体导管。该装置可选地包括与流体导管的第一和第二绝热部分热连通的一个或多个导热结构。该装置还可以包括导热区域，并且流体导管的至少一部分设置在该区域内。可以设置从流体导管的壁突出到管的内部容积中的多个结构。该结构增强了管内的流体和管的壁之间的热传导。用于从衬底制造用于处理流体流的微加工装置的方法允许选择性地去除衬底的部分以提供集成在装置内的期望的结构。作为示例，微加工装置可以适于有效地使流体反应物反应以产生与装置相关联的燃料电池的燃料，从而产生能够将化学品转化为电能的系统。

10. 发明授权

US09385322B2 Method and apparatus for depositing LED organic film 有权
公开(公告)号：US09385322B2
公开(公告)日：2016-07-05
申请号：US13095619
申请日：2011-04-27
申请人： Vladimir Bulovic , Marc A. Baldo , Martin A. Schmidt , Valerie Gassend , Jianglong Chen
发明人： Vladimir Bulovic , Marc A. Baldo , Martin A. Schmidt , Valerie Gassend , Jianglong Chen
IPC分类号： C23C16/00 , H01L51/00 , C23C16/448 , C23C16/455 , C23C16/04 , B05D1/12 , H01L51/56
CPC分类号： H01L51/0011 , B05D1/12 , C23C16/04 , C23C16/042 , C23C16/448 , C23C16/4481 , C23C16/4483 , C23C16/4485 , C23C16/45565 , C23C16/45568 , H01L51/56
摘要： In one embodiment the disclosure relates to an apparatus for depositing an organic material on a substrate, including a source heater for heating organic particles to form suspended organic particles; a transport stream for delivering the suspended organic particles to a discharge nozzle, the discharge nozzle having a plurality of micro-pores, the micro-pores providing a conduit for passage of the suspended organic particles; and a nozzle heater for pulsatingly heating the micro-pores nozzle to discharge the suspended organic particles from the discharge nozzle.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式