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1. 发明申请

US20040266085A1 Integrated multi-step gap fill and all feature planarization for conductive materials 失效
标题翻译：集成的多步间隙填充和导电材料的所有特征平面化
公开(公告)号：US20040266085A1
公开(公告)日：2004-12-30
申请号：US10792069
申请日：2004-03-03
申请人： Applied Materials, Inc.
发明人： Wei-Yung Hsu , Liang-Yuh Chen , Ratson Morad , Daniel A. Carl , Sasson Somekh
IPC分类号： H01L021/76
CPC分类号： C25D7/123 , C25D5/06 , C25D5/22 , C25D17/001 , C25D17/008 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/7684 , H01L21/76877
摘要： A method and apparatus is provided for depositing and planarizing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a partial enclosure, a permeable disc, a diffuser plate and optionally an anode. A substrate carrier is positionable above the partial enclosure and is adapted to move a substrate into and out of contact or close proximity with the permeable disc. The partial enclosure and the substrate carrier are rotatable to provide relative motion between a substrate and the permeable disc. In another aspect, a method is provided in which a substrate is positioned in a partial enclosure having an electrolyte therein at a first distance from a permeable disc. A current is optionally applied to the surface of the substrate and a first thickness is deposited on the substrate. Next, the substrate is positioned closer to the permeable disc. During the deposition, the partial enclosure and the substrate are rotated relative one another.
摘要翻译：提供了一种用于沉积和平坦化衬底上的材料层的方法和装置。在一个实施例中，提供了一种装置，其包括部分外壳，可渗透盘，漫射板和任选的阳极。衬底载体可定位在部分外壳上方，并且适于将衬底移动到与可渗透盘接触或接近的位置。部分外壳和基板载体可旋转以提供基板和可渗透盘之间的相对运动。在另一方面，提供了一种方法，其中将基底定位在其中具有电解质的部分封闭体中，其中离开可渗透盘的第一距离处。任选地将电流施加到衬底的表面，并且在衬底上沉积第一厚度。接下来，将基板定位成更靠近可渗透盘。在沉积期间，部分封闭物和基底相对彼此旋转。

2. 发明申请

US20010001756A1 Chemical mechanical polishing with multiple polishing pads 失效
标题翻译：化学机械抛光与多个抛光垫
公开(公告)号：US20010001756A1
公开(公告)日：2001-05-24
申请号：US09729868
申请日：2000-12-04
申请人： Applied Materials, Inc. a Delaware Corporation
发明人： Sasson Somekh
IPC分类号： B24B007/22
CPC分类号： B24B37/245 , B24B37/013 , B24B37/042 , B24B37/205 , B24B49/12
摘要： In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.
摘要翻译：在化学机械抛光中，用一个或多个固定研磨抛光垫将基底平坦化。然后用标准抛光垫抛光衬底，以消除由固定研磨抛光垫产生的划痕缺陷。

3. 发明申请

US20040083021A1 Multi-tool control system, method and medium 审中-公开
标题翻译：多工具控制系统，方法和介质
公开(公告)号：US20040083021A1
公开(公告)日：2004-04-29
申请号：US10686589
申请日：2003-10-17
申请人： Applied Materials, Inc.
发明人： Sasson Somekh , Howard E. Grunes
IPC分类号： G06F019/00
CPC分类号： H01L21/67253
摘要： A system, method and medium for facilitating communication between tools in a semiconductor (e.g., wafer) processing facility. In particular, the present invention provides greater control of the overall semiconductor product output of groups of tools in terms of the quantity and/or quality of a final semiconductor product.
摘要翻译：一种用于促进半导体（例如，晶片）处理设备中的工具之间的通信的系统，方法和介质。特别地，本发明在最终的半导体产品的数量和/或质量方面提供对工具组的整体半导体产品输出的更好的控制。

4. 发明申请

US20040003894A1 METHOD AND APPARATUS FOR ELECTRO-CHEMICAL PROCESSING 失效
标题翻译：电化学处理方法与装置
公开(公告)号：US20040003894A1
公开(公告)日：2004-01-08
申请号：US09739139
申请日：2000-12-18
申请人： Applied Materials, Inc.
发明人： Wei-Yung Hsu , Liang-Yuh Chen , Ratson Morad , Daniel A. Carl , Sasson Somekh
IPC分类号： C23F001/00
CPC分类号： C25D7/123 , C25D5/06 , C25D5/22 , C25D17/001 , C25D17/008 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/7684 , H01L21/76877
摘要： A method and apparatus is provided for depositing and planarizing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a partial enclosure, a permeable disc, a diffuser plate and optionally an anode. A substrate carrier is positionable above the partial enclosure and is adapted to move a substrate into and out of contact or close proximity with the permeable disc. The partial enclosure and the substrate carrier are rotatable to provide relative motion between a substrate and the permeable disc. In another aspect, a method is provided in which a substrate is positioned in a partial enclosure having an electrolyte therein at a first distance from a permeable disc. A current is optionally applied to the surface of the substrate and a first thickness is deposited on the substrate. Next, the substrate is positioned closer to the permeable disc and a second thickness is deposited on the substrate. During the deposition, the partial enclosure and the substrate are rotated relative one another.
摘要翻译：提供了一种用于沉积和平坦化衬底上的材料层的方法和装置。在一个实施例中，提供了一种装置，其包括部分外壳，可渗透盘，漫射板和任选的阳极。衬底载体可定位在部分外壳上方，并且适于将衬底移动到与可渗透盘接触或接近的位置。部分外壳和基板载体可旋转以提供基板和可渗透盘之间的相对运动。在另一方面，提供了一种方法，其中将基底定位在其中具有电解质的部分封闭体中，其中离开可渗透盘的第一距离处。任选地将电流施加到衬底的表面，并且在衬底上沉积第一厚度。接下来，将基板定位成更靠近可渗透盘，并且在基板上沉积第二厚度。在沉积期间，部分封闭物和基底相对彼此旋转。

5. 发明申请

US20030181137A1 Linear polishing sheet with window 有权
标题翻译：线性抛光板带窗
公开(公告)号：US20030181137A1
公开(公告)日：2003-09-25
申请号：US10394599
申请日：2003-03-21
申请人： Applied Materials, Inc., a Delaware corporation
发明人： Fred C. Redeker , Manoocher Birang , Shijian Li , Sasson Somekh
IPC分类号： B24B049/00
CPC分类号： B24B37/005 , B24B21/04 , B24B49/04 , B24B49/12 , H01L21/30625
摘要： A polishing article for chemical mechanical polishing. The polishing article includes a generally elongated polishing sheet with a polishing surface. The polishing article is formed from a material that is substantially opaque, and has a discrete region extending substantially the length of the polishing sheet that is at least semi-transparent.
摘要翻译：用于化学机械抛光的抛光制品。抛光制品包括具有抛光表面的大致细长的抛光片。抛光制品由基本上不透明的材料形成，并且具有基本上延伸至少半透明的抛光片的长度的离散区域。

6. 发明申请

US20040020601A1 Process and an integrated tool for low k dielectric deposition including a pecvd capping module 审中-公开
标题翻译：工艺和用于低k电介质沉积的集成工具，包括pecvd封盖模块
公开(公告)号：US20040020601A1
公开(公告)日：2004-02-05
申请号：US10631303
申请日：2003-07-29
申请人： Applied Materials, Inc.
发明人： Jun Zhao , Farhad Moghadam , Tim Weidman , Rick J. Roberts , Hari Ponnekanti , Chau T. Nguyen , Satish Sundar , David H. Quach , Sasson Somekh
IPC分类号： H01L021/306 , C23C016/00
CPC分类号： H01L21/67161 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/02304 , H01L21/02337 , H01L21/0234 , H01L21/02362 , H01L21/31695 , H01L21/67167 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67742 , H01L21/76807
摘要： A series of modular apparatuses for processing substrates using a unique combinations of a substrate coating subsystem, a substrate curing subsystem and a PECVD-based capping subsystem. The individual subsystems are capable of being combined with one another for creating unique integrated substrate processing apparatuses that enable combined processing by the coating, curing and capping subsystems in an integrated and controlled environment, thus enabling the processing of substrates in an efficient manner, while minimizing the exposure of the substrates to an external environment and minimizing the condensation of vapors while the substrate is processed by the cure and capping subsystems.
摘要翻译：一系列用于使用基板涂层子系统，基板固化子系统和基于PECVD的封盖子系统的独特组合来处理衬底的模块化装置。各个子系统能够彼此组合，用于创建独特的集成基板处理设备，其能够通过在集成和受控环境中的涂层，固化和封盖子系统进行组合处理，从而能够以有效的方式处理基板，同时最小化衬底暴露于外部环境，并且在通过固化和封盖子系统处理衬底的同时使蒸气冷凝最小化。

7. 发明申请

US20030190865A1 Chemical mechanical polishing with multiple polishing pads 失效
公开(公告)号：US20030190865A1
公开(公告)日：2003-10-09
申请号：US10425684
申请日：2003-04-28
申请人： Applied Materials, Inc., a Delaware corporation
发明人： Sasson Somekh
IPC分类号： B24B049/00 , B24B051/00 , B24B001/00 , B24B007/19 , B24B007/30
CPC分类号： B24B37/245 , B24B37/013 , B24B37/042 , B24B37/205 , B24B49/12
摘要： In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.

8. 发明申请

US20030171069A1 Web lift system for chemical mechanical planarization 失效
公开(公告)号：US20030171069A1
公开(公告)日：2003-09-11
申请号：US10408032
申请日：2003-04-03
申请人： Applied Materials, Inc.
发明人： John M. White , Phillip R. Sommer , Sasson Somekh
IPC分类号： B24B007/22
CPC分类号： B24B37/16 , B24B21/004 , B24B21/008 , B24B21/20
摘要： Generally, a method and system for lifting a web of polishing material is provided. In one embodiment, the system includes a platen that has a first lift member disposed adjacent to a first side and a second lift member disposed adjacent to a second side. The platen is adapted to support the web of polishing media that is disposed between the first and the second lift members. A method includes supporting a web of polishing media on a platen between a first lift member and a second lift member and moving at least the first lift member or the second lift member to an extended position relative the platen that places the web in a spaced-apart relation with the platen.

9. 发明申请

US20030139123A1 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system 有权
公开(公告)号：US20030139123A1
公开(公告)日：2003-07-24
申请号：US10364081
申请日：2003-02-10
申请人： Applied Materials, Inc., a Delaware corporation
发明人： Sasson Somekh
IPC分类号： B24B007/22
CPC分类号： B24B37/30 , B24B37/0053
摘要： A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

10. 发明申请

US20030060143A1 Chemical mechanical polishing apparatus with rotating belt 有权
标题翻译：化学机械抛光装置带旋转带
公开(公告)号：US20030060143A1
公开(公告)日：2003-03-27
申请号：US10174476
申请日：2002-06-17
申请人： Applied Materials, Inc.
发明人： Manoocher Birang , Lawrence M. Rosenberg , Sasson Somekh , John M. White , Sandra M. Rosenberg
IPC分类号： B24B001/00
CPC分类号： B24B21/004 , B24B21/008 , B24B21/04 , B24B27/0023 , B24B37/04 , B24B37/16 , B24B37/24 , B24B37/245 , B24B53/017 , B24D7/12 , H01L21/30625
摘要： A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.
摘要翻译：化学机械抛光装置具有可转动的压板，比在两个卷轴之间延伸的基板宽的抛光片，用于推进抛光片的驱动机构和用于间歇地将抛光片固定到压板上的夹持机构。压板可以具有适于接收圆形压板顶部或矩形压板顶部的压板基座。

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