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1. 发明授权

US06390896B1 Method and device for cutting a multiplicity of disks from a hard brittle workpiece 失效
标题翻译：用于从硬脆的工件切割多个盘的方法和装置
公开(公告)号：US06390896B1
公开(公告)日：2002-05-21
申请号：US09387454
申请日：1999-09-01
申请人： Anton Huber , Joachim Junge , Jörg Moser
发明人： Anton Huber , Joachim Junge , Jörg Moser
IPC分类号： B24B100
CPC分类号： B23D57/0053 , B28D5/0064 , B28D5/0076 , B28D5/045
摘要： A method for cutting a multiplicity of disks from a hard brittle workpiece is by moving the workpiece at a defined feed rate through a wire web of a wire saw. In the method, the wire web is formed by a sawing wire which moves in a reciprocating manner and is covered with bonded abrasive grain. A cooling liquid is provided beneath the wire web, in which cooling liquid the sawing wire of the wire web is immersed when cutting off the disks. Also provided is a wire saw which is suitable for carrying out the method.
摘要翻译：用于从硬脆性工件切割多个盘的方法是通过以限定的进给速率通过线锯的丝网移动工件。在该方法中，金属丝网通过以往复方式移动并被粘合的磨粒覆盖的锯线形成。在丝网下方设置冷却液，当切断盘时，冷却液中浸渍有丝网的锯线。还提供了适用于执行该方法的线锯。

2. 发明授权

US08197300B2 Simultaneous double-side grinding of semiconductor wafers 有权
标题翻译：同时双面研磨半导体晶圆
公开(公告)号：US08197300B2
公开(公告)日：2012-06-12
申请号：US12242959
申请日：2008-10-01
申请人： Joachim Junge , Robert Weiss
发明人： Joachim Junge , Robert Weiss
IPC分类号： B24B49/00
CPC分类号： B24B37/08 , B24B49/00
摘要： Correction of grinding spindle positions in double-side grinding machines for the simultaneous double-side machining of semiconductor wafers is achieved by torsionally coupling the two grinding spindles, each comprising a grinding disk flange for receiving a grinding disk, and providing a measuring unit with an inclinometer and two sensors for distance measurement, between the two grinding disk flanges such that the grinding spindles are essentially in the position they would have with mounted grinding disks during the grinding process, wherein the coupled grinding spindles are rotated while inclinometer and sensors determine radial and axial correction values of axial alignment to adjust the grinding spindles to a symmetrical orientation. The spindle positions may be corrected under the action of process forces.
摘要翻译：通过扭转联接两个研磨主轴来实现用于双面研磨机的双面研磨机中的研磨主轴位置的修正，每个研磨主轴包括用于接收研磨盘的研磨盘凸缘，并且提供具有倾斜计和两个用于距离测量的传感器，在两个研磨盘凸缘之间，使得研磨主轴基本上处于其在研磨过程中具有安装的研磨盘的位置，其中联接的研磨主轴旋转，而倾斜仪和传感器确定径向和轴向对准的轴向校正值，以将研磨主轴调整到对称取向。主轴位置可以在加工力的作用下进行修正。

3. 发明申请

US20090011683A1 Method For Grinding Semiconductor Wafers 有权
标题翻译：研磨半导体晶片的方法
公开(公告)号：US20090011683A1
公开(公告)日：2009-01-08
申请号：US12140307
申请日：2008-06-17
申请人： Joachim Junge , Robert Weiss
发明人： Joachim Junge , Robert Weiss
IPC分类号： B24B7/24 , B24B7/26 , B24B55/02 , H01L21/463
CPC分类号： B24B7/228 , B24B7/16 , B24B7/17 , B24B55/02
摘要： Semiconductor wafers are processed so as to remove material on one or both sides by means of at least one grinding tool, with coolant supplied into a contact region between the semiconductor wafer and the at least one grinding tool, characterized in that the coolant flow rate is set as a function of a grinding tooth height of the at least one grinding tool and this coolant flow rate is reduced as the grinding tooth height decreases.
摘要翻译：处理半导体晶片以通过至少一个研磨工具在一侧或两侧上移除材料，其中冷却剂供应到半导体晶片和至少一个研磨工具之间的接触区域中，其特征在于，冷却剂流速为设定为所述至少一个研磨工具的研磨齿高度的函数，并且所述冷却剂流速随着所述研磨齿高度的减小而减小。

4. 发明授权

US5030910A Method and apparatus for slicing crystalline wafers aided by magnetic field monitoring means 失效
标题翻译：通过磁场监测装置辅助切片晶片的方法和装置
公开(公告)号：US5030910A
公开(公告)日：1991-07-09
申请号：US384563
申请日：1989-07-24
申请人： Joachim Junge , Johann Glas , Johann Niedermeier , Gerhard Brehm
发明人： Joachim Junge , Johann Glas , Johann Niedermeier , Gerhard Brehm
IPC分类号： B23Q17/09 , B23D59/00 , B28D5/02 , H01L21/301 , H01L21/304
CPC分类号： B23D59/002 , B28D5/028 , Y10T83/141
摘要： In a method and apparatus for monitoring the path of the cut in slicing wrs from non-magnetizble crystalline workpieces with a slicing tool which is moved through the workpiece, a measuring unit is disposed in a defined position with respect to the slicing tool and a constant magnetic field is established between the measuring unit and the slicing tool. The magnetic field during the slicing process passes at least partly through the wafer to be sliced off and varies with deviations of the slicing tool from the required line of cut established between the fixed measuring unit and the slicing tool. By measuring the change in the constant field caused by the deviation of the slicing tool, the slicing tool can be brought back into the required direction again by regulation so that wafers with excellent planarity are obtained.
摘要翻译：在用于通过工件移动的切片工具来监测来自非磁化晶体工件的切片晶片切割路径的方法和装置中，测量单元相对于切片工具设置在限定位置，并且具有常数在测量单元和切片工具之间建立磁场。切片过程中的磁场至少部分地穿过晶片以进行切割，随着切割工具与固定测量单元和切片工具之间建立的所需切割线的偏差而变化。通过测量由切片工具的偏差引起的恒定场的变化，可以通过调节使切片工具再次回到所需方向，从而获得具有优异平面性的晶片。

5. 发明申请

US20090104846A1 Simultaneous Double-Side Grinding Of Semiconductor Wafers 有权
标题翻译：半导体晶片的同时双面研磨
公开(公告)号：US20090104846A1
公开(公告)日：2009-04-23
申请号：US12242959
申请日：2008-10-01
申请人： Joachim Junge , Robert Weiss
发明人： Joachim Junge , Robert Weiss
IPC分类号： B24B51/00
CPC分类号： B24B37/08 , B24B49/00
摘要： Correction of grinding spindle positions in double-side grinding machines for the simultaneous double-side machining of semiconductor wafers is achieved by torsionally coupling the two grinding spindles, each comprising a grinding disk flange for receiving a grinding disk, and providing a measuring unit with an inclinometer and two sensors for distance measurement, between the two grinding disk flanges such that the grinding spindles are essentially in the position they would have with mounted grinding disks during the grinding process, wherein the coupled grinding spindles are rotated while inclinometer and sensors determine radial and axial correction values of axial alignment to adjust the grinding spindles to a symmetrical orientation. The spindle positions may be corrected under the action of process forces.
摘要翻译：通过扭转联接两个研磨主轴来实现用于双面研磨机的双面研磨机中的研磨主轴位置的修正，每个研磨主轴包括用于接收研磨盘的研磨盘凸缘，并且提供具有倾斜计和两个用于距离测量的传感器，在两个研磨盘凸缘之间，使得研磨主轴基本上处于其在研磨过程中具有安装的研磨盘的位置，其中联接的研磨主轴旋转，而倾斜仪和传感器确定径向和轴向对准的轴向校正值，以将研磨主轴调整到对称取向。主轴位置可以在加工力的作用下进行修正。

6. 发明申请

US20130061842A1 SINGLE-LAYERED WINDING OF SAWING WIRE WITH FIXEDLY BONDED ABRASIVE GRAIN FOR WIRE SAWS FOR SLICING WAFERS FROM A WORKPIECE 审中-公开
标题翻译：用于从工作台切割的波纹的用于电线的固定式磨粒的锯状线的单层卷绕
公开(公告)号：US20130061842A1
公开(公告)日：2013-03-14
申请号：US13594897
申请日：2012-08-27
申请人： Joachim Junge , Joerg Moser
发明人： Joachim Junge , Joerg Moser
IPC分类号： H01L21/304
CPC分类号： B28D5/045 , B23D57/0061
摘要： Wire spools used for multiple wire saws for slicing one or more wafers from a workpiece composed of semiconductor material using a wire web including parallel wire sections coated with bonded abrasive grain. The wire spools include a first wire spool configured as a dispensing spool and a second wire spool configured as a receiver spool. A sawing wire coated with bonded abrasive grain runs from the first wire spool via at least one deflection roll to the wire web and from the wire web via at least one deflection roll to the second wire spool. The sawing wire enters into guide grooves of the deflection rolls at an alignment angle α1 and exits the guide grooves of the deflection rolls at an alignment angle α2. The sawing wire has a single layer winding on each of the first and second wire spools.
摘要翻译：用于多个线锯的线芯，用于使用包括涂覆有粘合磨料颗粒的平行线段的线网将来自由半导体材料组成的工件切片一个或多个晶片。线轴包括构造为分配线轴的第一线轴和构造为接收器线轴的第二线轴。涂覆有粘结磨料颗粒的锯线从第一线卷轴经由至少一个偏转辊延伸到丝网，并且通过至少一个偏转辊到丝网卷到第二线卷轴。锯线以对准角α1进入偏转辊的引导槽，并以对准角α2离开偏转辊的引导槽。锯线在第一和第二线轴的每一个上具有单层缠绕。

7. 发明授权

US06997779B2 Device for the simultaneous double-side grinding of a workpiece in wafer form 有权
标题翻译：用于以晶圆形式同时双面研磨工件的装置
公开(公告)号：US06997779B2
公开(公告)日：2006-02-14
申请号：US11070297
申请日：2005-03-02
申请人： Joachim Junge , Robert Weiss
发明人： Joachim Junge , Robert Weiss
IPC分类号： B24B7/00
CPC分类号： B24B37/08 , B24B41/061 , B24B49/08 , H01L21/02013
摘要： A device for the simultaneous double-side grinding of workpiece wafers has two collinear grinding wheels and two hydropads oppositely positioned for hydrostatic bearing of the workpiece, each having at least one hydrostatic bearing and at least one dynamic pressure tube for measuring the spacing between the workpiece and the hydrdopads. The surfaces of the hydropads which face the workpiece are of nonplanar configuration, contoured in such a manner that the spacing between the surface and the workpiece adopts a minimum value near the edge of the hydropads proximate the grinding wheels, this spacing increasing at increasing distance from the grinding wheels. In a further embodiment, at least one bore, through which liquid and abraded material can be discharged from the vicinity of the dynamic pressure tube, is proximate each dynamic pressure tube.
摘要翻译：用于同时双面研磨工件晶片的装置具有两个共线研磨轮和两个相对定位用于工件的静压轴承的水平面，每个具有至少一个静压轴承和用于测量工件之间的间隔的至少一个动压力管和氢键。面向工件的水力平台的表面是非平面构造，其轮廓是这样的，使得表面和工件之间的间距在靠近研磨轮的靠近水槽的边缘处采取最小值，磨轮。在另一实施例中，液体和磨损材料可以从动压管附近排出的至少一个孔靠近每个动压管。

8. 发明申请

US20050202757A1 Device for the simultaneous double-side grinding of a workpiece in wafer form 有权
标题翻译：用于以晶圆形式同时双面研磨工件的装置
公开(公告)号：US20050202757A1
公开(公告)日：2005-09-15
申请号：US11070297
申请日：2005-03-02
申请人： Joachim Junge , Robert Weiss
发明人： Joachim Junge , Robert Weiss
IPC分类号： B24B7/17 , B24B41/00 , B24B41/047 , B24B49/00 , H01L21/304
CPC分类号： B24B37/08 , B24B41/061 , B24B49/08 , H01L21/02013
摘要： A device for the simultaneous double-side grinding of workpiece wafers has two collinear grinding wheels and two hydropads oppositely positioned for hydrostatic bearing of the workpiece, each having at least one hydrostatic bearing and at least one dynamic pressure tube for measuring the spacing between the workpiece and the hydrdopads. The surfaces of the hydropads which face the workpiece are of nonplanar configuration, contoured in such a manner that the spacing between the surface and the workpiece adopts a minimum value near the edge of the hydropads proximate the grinding wheels, this spacing increasing at increasing distance from the grinding wheels. In a further embodiment, at least one bore, through which liquid and abraded material can be discharged from the vicinity of the dynamic pressure tube, is proximate each dynamic pressure tube.
摘要翻译：用于同时双面研磨工件晶片的装置具有两个共线研磨轮和两个相对定位用于工件的静压轴承的水平面，每个具有至少一个静压轴承和用于测量工件之间的间隔的至少一个动压力管和氢键。面向工件的水力平台的表面是非平面构造，其轮廓是这样的，使得表面和工件之间的间距在靠近研磨轮的靠近水槽的边缘处采取最小值，磨轮。在另一实施例中，液体和磨损材料可以从动压管附近排出的至少一个孔靠近每个动压管。

9. 发明授权

US07666064B2 Method for grinding semiconductor wafers 有权
标题翻译：研磨半导体晶圆的方法
公开(公告)号：US07666064B2
公开(公告)日：2010-02-23
申请号：US12140307
申请日：2008-06-17
申请人： Joachim Junge , Robert Weiss
发明人： Joachim Junge , Robert Weiss
IPC分类号： B24B49/00
CPC分类号： B24B7/228 , B24B7/16 , B24B7/17 , B24B55/02
摘要： Semiconductor wafers are processed so as to remove material on one or both sides by means of at least one grinding tool, with coolant supplied into a contact region between the semiconductor wafer and the at least one grinding tool, characterized in that the coolant flow rate is set as a function of a grinding tooth height of the at least one grinding tool and this coolant flow rate is reduced as the grinding tooth height decreases.
摘要翻译：处理半导体晶片以通过至少一个研磨工具在一侧或两侧上移除材料，其中冷却剂供应到半导体晶片和至少一个研磨工具之间的接触区域中，其特征在于，冷却剂流速为设定为所述至少一个研磨工具的研磨齿高度的函数，并且所述冷却剂流速随着所述研磨齿高度的减小而减小。

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