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1. 发明授权

US06390896B1 Method and device for cutting a multiplicity of disks from a hard brittle workpiece 失效
标题翻译：用于从硬脆的工件切割多个盘的方法和装置
公开(公告)号：US06390896B1
公开(公告)日：2002-05-21
申请号：US09387454
申请日：1999-09-01
申请人： Anton Huber , Joachim Junge , Jörg Moser
发明人： Anton Huber , Joachim Junge , Jörg Moser
IPC分类号： B24B100
CPC分类号： B23D57/0053 , B28D5/0064 , B28D5/0076 , B28D5/045
摘要： A method for cutting a multiplicity of disks from a hard brittle workpiece is by moving the workpiece at a defined feed rate through a wire web of a wire saw. In the method, the wire web is formed by a sawing wire which moves in a reciprocating manner and is covered with bonded abrasive grain. A cooling liquid is provided beneath the wire web, in which cooling liquid the sawing wire of the wire web is immersed when cutting off the disks. Also provided is a wire saw which is suitable for carrying out the method.
摘要翻译：用于从硬脆性工件切割多个盘的方法是通过以限定的进给速率通过线锯的丝网移动工件。在该方法中，金属丝网通过以往复方式移动并被粘合的磨粒覆盖的锯线形成。在丝网下方设置冷却液，当切断盘时，冷却液中浸渍有丝网的锯线。还提供了适用于执行该方法的线锯。

2. 发明授权

US09073135B2 Method for slicing wafers from a workpiece 有权
标题翻译：从工件切片晶圆的方法
公开(公告)号：US09073135B2
公开(公告)日：2015-07-07
申请号：US13423350
申请日：2012-03-19
申请人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
发明人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
IPC分类号： B28D5/00 , B28D1/08 , B23D57/00 , B28D5/04
CPC分类号： B23D57/0053 , B28D5/0064 , B28D5/0076 , B28D5/045
摘要： A method for slicing wafers from a workpiece includes providing wire guide rolls that each have a grooved coating with a specific thickness, providing a fixed bearing respectively associated with each wire guide roll and providing a sawing wire including wire sections disposed in a parallel fashion. The wire sections are tensioned between the wire guide rolls and are moved relative to the workpiece so as to perform a sawing operation. The wire guide rolls cooled and the fixed bearings are cooled independently of the wire guide rolls.
摘要翻译：一种用于从工件切片晶片的方法包括提供每个具有特定厚度的带槽涂层的导丝辊，提供分别与每个线导向辊相关联的固定轴承，并提供包括以平行方式设置的线段的锯线。线段在线导向辊之间张紧并相对于工件移动，以进行锯切操作。导丝辊被冷却，固定的轴承独立于导线辊被冷却。

3. 发明授权

US08746227B2 Method for slicing wafers from a workpiece 有权
标题翻译：从工件切片晶圆的方法
公开(公告)号：US08746227B2
公开(公告)日：2014-06-10
申请号：US13415863
申请日：2012-03-09
申请人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
发明人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
IPC分类号： B23D61/18
CPC分类号： B28D5/045 , B23D57/0053 , B28D5/0076
摘要： A method for slicing wafers from a workpiece includes providing wire guide rolls each having a grooved coating with a specific thickness and providing rings at opposing ends of a first of the coatings of a respective wire guide roll. The rings are fixed exclusively to the first coating. A sawing wire including wire sections disposed in a parallel fashion is tensioned between the wire guide rolls. The wire sections of the sawing wire are moved relative to the workpiece so as to perform a sawing operation. A change in length of the first coating, brought about by a temperature change, is measured by measuring distances between sensors and the rings. The wire guide rolls are cooled in a manner dependent on the measured distances.
摘要翻译：用于从工件切片晶片的方法包括提供每个具有特定厚度的带槽涂层的导丝辊，并且在相应导丝辊的第一涂层的相对端处提供环。环固定在第一个涂层上。包括以平行方式设置的线段的锯线在线导向辊之间被张紧。锯线的线段相对于工件移动，以进行锯切操作。通过测量传感器和环之间的距离来测量由温度变化引起的第一涂层的长度变化。导线辊以取决于测量距离的方式冷却。

4. 发明授权

US07767470B2 Semiconductor wafers with highly precise edge profile and method for producing them 失效
标题翻译：具有高精度边缘轮廓的半导体晶片及其制造方法
公开(公告)号：US07767470B2
公开(公告)日：2010-08-03
申请号：US11828441
申请日：2007-07-26
申请人： Peter Wagner , Hans Adolf Gerber , Anton Huber , Joerg Moser
发明人： Peter Wagner , Hans Adolf Gerber , Anton Huber , Joerg Moser
IPC分类号： H01L21/00
CPC分类号： H01L21/02021 , B24B9/065
摘要： A semiconductor wafer has a front side, a rear side and an edge which runs along the circumference of the semiconductor wafer and which connects the front side and the rear side of the edge having a defined edge profile, the edge profile being substantially constant over the entire circumference of the semiconductor wafer. A method for producing such a wafer allows for production of a multiplicity of semiconductor wafers, the edge profile being substantially constant from semiconductor wafer to semiconductor wafer.
摘要翻译：半导体晶片具有沿着半导体晶片的圆周延伸并且连接具有限定的边缘轮廓的边缘的前侧和后侧的前侧，后侧和边缘，所述边缘轮廓基本上在半导体晶片的整个周长。制造这种晶片的方法允许生产多个半导体晶片，该边缘轮廓从半导体晶片到半导体晶片基本上是恒定的。

5. 发明申请

US20080099006A1 METHOD FOR SIMULTANEOUSLY SLICING AT LEAST TWO CYLINDRICAL WORKPIECES INTO A MULTIPLICITY OF WAFERS 有权
公开(公告)号：US20080099006A1
公开(公告)日：2008-05-01
申请号：US11923722
申请日：2007-10-25
申请人： Anton Huber , Alexander Heilmaier , Clemens Radspieler , Helmut Seehofer
发明人： Anton Huber , Alexander Heilmaier , Clemens Radspieler , Helmut Seehofer
IPC分类号： B23D57/00
CPC分类号： B28D5/042
摘要： Slicing multiple cylindrical workpieces into wafers by a multi wire saw with a gang length LG, is performed by: a) selecting a number n≧2 of workpieces from a stock of workpieces with different lengths, satisfying the inequality L G ≥ ( n - 1 ) · A min + ∑ i = 1 n   L 1 ( 1 ) and making right-hand side of the inequality as large as possible, where Li with i=1 . . . n are for the lengths of the workpieces and Amin is a predefined minimum spacing, b) fixing the n workpieces successively in the longitudinal direction on a mounting plate while maintaining a spacing A≧Amin therebetween such that the relationship L G ≥ ( n - 1 ) · A + ∑ i = 1 n   L i ( 2 ) is satisfied, c) clamping mounting plates workpieces in a multi wire saw, and d) slicing the n workpieces perpendicularly to their longitudinal axis by means of the multi wire saw. Preferably, the wafer stacks are separated from one another by separating pieces after slicing, and at the same time are laterally supported.

6. 发明授权

US5400548A Process for manufacturing semiconductor wafers having deformation ground in a defined way 失效
标题翻译：以规定的方式制造具有变形地的半导体晶片的工艺
公开(公告)号：US5400548A
公开(公告)日：1995-03-28
申请号：US88171
申请日：1993-07-07
申请人： Anton Huber , Karl-Heinz Langsdorf
发明人： Anton Huber , Karl-Heinz Langsdorf
IPC分类号： B24B1/00 , B24B37/04 , B24B41/06 , C30B33/00 , H01L21/304
CPC分类号： H01L21/02013 , B24B37/04 , B24B41/06 , C30B33/00 , Y10S438/959
摘要： A process for manufacturing semiconductor wafers having deformation ground in a defined way.
摘要翻译：一种以限定的方式制造具有变形地的半导体晶片的工艺。

7. 发明授权

US5327014A Firing control device for triggering a passenger restraint system of a vehicle 失效
公开(公告)号：US5327014A
公开(公告)日：1994-07-05
申请号：US956019
申请日：1992-12-07
申请人： Anton Huber , Dieter Neugebauer , Marten Swart
发明人： Anton Huber , Dieter Neugebauer , Marten Swart
IPC分类号： B60R21/16 , B60R21/01 , B60R21/32
CPC分类号： B60R21/0173
摘要： A firing control device (G) for triggering a passenger restraint system of a vehicle by electrically firing one or more firing pellets (Z1, Z2), having a processor (P) which, during operation, criteria for the necessity of triggering derives from the output signals of one or more crash sensors (S1, S2), having at least one measuring unit (R/DR, DZ1, DZ2) which, during a crash, measures at least the firing current (I1, I2) flowing through the respective firing pellets (Z1, Z2) and/or values (for example voltages) which depend on said firing current (I1, I2), having a PROM memory (M), and having a measuring unit (R/DR) which (R/DR) contains a measuring resistor (R) which is inserted into the firing circuit (I1, I2) of the firing pellet (Z1, Z2) so as not to be usually directly accessible from the outside via external terminals (A0 to A5) of the housing (G) of the firing control device in order to determine data relating to the variation of the firing current (I1, I2) flowing across the resistor (R) during triggering. In the event of a crash, data, from which it can later be detected whether and how the passenger restraint system triggered during the crash, is written into the PROM memory (M), the data in fact being at least some of the data which relates to the criteria derived by the processor (P) during the crash, and the measuring unit (R/DR, DZ1, DZ2), the processor (P), the measuring unit (R/DR, DZ1 and/or DZ2) and the PROM memory (M), but no firing pellet (Z1, Z2) and also no explosive charge of the passenger restraint system, being mounted in the housing (G) which survives a crash intact and cannot be opened without leaving behind detectable damage.

8. 发明申请

US20120240914A1 METHOD FOR SLICING WAFERS FROM A WORKPIECE 有权
标题翻译：用于从工件中切割波形的方法
公开(公告)号：US20120240914A1
公开(公告)日：2012-09-27
申请号：US13415863
申请日：2012-03-09
申请人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
发明人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
IPC分类号： B28D5/00
CPC分类号： B28D5/045 , B23D57/0053 , B28D5/0076
摘要： A method for slicing wafers from a workpiece includes providing wire guide rolls each having a grooved coating with a specific thickness and providing rings at opposing ends of a first of the coatings of a respective wire guide roll. The rings are fixed exclusively to the first coating. A sawing wire including wire sections disposed in a parallel fashion is tensioned between the wire guide rolls. The wire sections of the sawing wire are moved relative to the workpiece so as to perform a sawing operation. A change in length of the first coating, brought about by a temperature change, is measured by measuring distances between sensors and the rings. The wire guide rolls are cooled in a manner dependent on the measured distances.
摘要翻译：用于从工件切片晶片的方法包括提供每个具有特定厚度的带槽涂层的导丝辊，并且在相应导丝辊的第一涂层的相对端处提供环。环固定在第一个涂层上。包括以平行方式设置的线段的锯线在线导向辊之间被张紧。锯线的线段相对于工件移动，以进行锯切操作。通过测量传感器和环之间的距离来测量由温度变化引起的第一涂层的长度变化。导线辊以取决于测量距离的方式冷却。

9. 发明授权

US07690883B2 Pivoting basket stacker for deep-drawn articles 有权
标题翻译：用于深冲文章的活页篓式堆垛机
公开(公告)号：US07690883B2
公开(公告)日：2010-04-06
申请号：US11449297
申请日：2006-06-08
申请人： Anton Huber , Johannes Crepaz , Stefan Julinek , Frank Scheutz
发明人： Anton Huber , Johannes Crepaz , Stefan Julinek , Frank Scheutz
IPC分类号： B65H29/00
CPC分类号： B65G57/165 , B29C51/445 , B29C2793/009 , B29C2795/007
摘要： A device for stacking articles which are molded and stamped in a multi-impression molding and stamping tool includes a transfer device having a single gripper plate made of lightweight construction for accepting all articles ejected from one work cycle of the molding and stamping tool. A stacking station having two stacking baskets arranged on respective arms is arranged so that the baskets are pivotable about a first axis for moving a first basket of the two baskets to a transfer position and a second basket of the two baskets to an ejection position, the transfer device transferring the articles to the transfer position of the stacking station. An ejector unit and conveyor belt are arranged proximate the ejection position, each of the first and second baskets being pivotable about a second axis, perpendicular to the first axis, at the ejection position to a pivoted position. The ejector unit pushes a row of article stacks onto the conveyor at the pivoted position, the each of the first and second baskets being movable in steps to align successive rows of articles stacks with the ejector unit, and the ejector unit being movable transversely to the movement of the each of the first and second baskets.
摘要翻译：用于堆叠在多压模和冲压工具中成型和冲压的物品的装置包括具有由轻型结构制成的单个夹持板的传送装置，用于接收从成型和冲压工具的一个工作循环中排出的所有物品。具有布置在相应臂上的两个堆叠篮子的堆垛站被布置成使得篮可围绕第一轴线枢转，用于将两个篮子的第一筐移动到两个篮子的转移位置和第二筐到排出位置，传送装置将物品传送到堆放站的传送位置。喷射器单元和传送带布置在喷射位置附近，第一和第二篮子中的每一个可在垂直于第一轴线的第二轴线处在弹出位置处枢转到枢转位置。排出器单元在枢转位置将一排物品堆栈推送到输送机上，第一和第二筐中的每一个可以逐步移动，以使连续的物品堆叠排列与排出器单元对齐，并且排出器单元可横向移动第一和第二筐的每一个的运动。

10. 发明申请

US20080264228A1 Wire Guide Roll For Wire Saw 审中-公开
标题翻译：线锯导丝辊
公开(公告)号：US20080264228A1
公开(公告)日：2008-10-30
申请号：US12106428
申请日：2008-04-21
申请人： Anton Huber , Engelbert Auer , Manfred Schoenhofer , Helmut Seehofer , Peter Wiesner
发明人： Anton Huber , Engelbert Auer , Manfred Schoenhofer , Helmut Seehofer , Peter Wiesner
IPC分类号： B26D1/54 , B28D1/08
CPC分类号： B23D57/0053 , B23D61/18 , B24B27/0633 , B28D5/045 , B65H57/14 , Y10T83/696 , Y10T83/9292
摘要： A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130°. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by means of a wire saw using such wire guide rolls.
摘要翻译：用于线锯同时从圆筒形工件切片多个晶片的导丝辊设置有厚度至少为2mm且至多7.5mm的涂层，该涂层的肖氏A硬度至少为 60和至多99个，并且其包含多个槽，锯线通过该槽被引导，所述槽各自具有曲率半径为弯曲直径的0.25-1.6倍的弯曲槽基部，并且孔径角 60-130°。通过使用这种导线辊的线锯同时从圆柱形工件切片多个晶片。

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