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1. 发明申请

US20080264228A1 Wire Guide Roll For Wire Saw 审中-公开
标题翻译：线锯导丝辊
公开(公告)号：US20080264228A1
公开(公告)日：2008-10-30
申请号：US12106428
申请日：2008-04-21
申请人： Anton Huber , Engelbert Auer , Manfred Schoenhofer , Helmut Seehofer , Peter Wiesner
发明人： Anton Huber , Engelbert Auer , Manfred Schoenhofer , Helmut Seehofer , Peter Wiesner
IPC分类号： B26D1/54 , B28D1/08
CPC分类号： B23D57/0053 , B23D61/18 , B24B27/0633 , B28D5/045 , B65H57/14 , Y10T83/696 , Y10T83/9292
摘要： A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130°. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by means of a wire saw using such wire guide rolls.
摘要翻译：用于线锯同时从圆筒形工件切片多个晶片的导丝辊设置有厚度至少为2mm且至多7.5mm的涂层，该涂层的肖氏A硬度至少为 60和至多99个，并且其包含多个槽，锯线通过该槽被引导，所述槽各自具有曲率半径为弯曲直径的0.25-1.6倍的弯曲槽基部，并且孔径角 60-130°。通过使用这种导线辊的线锯同时从圆柱形工件切片多个晶片。

2. 发明授权

US10245661B2 Wire guide roll for wire saw and method 有权
公开(公告)号：US10245661B2
公开(公告)日：2019-04-02
申请号：US12106428
申请日：2008-04-21
申请人： Anton Huber , Engelbert Auer , Manfred Schoenhofer , Helmut Seehofer , Peter Wiesner
发明人： Anton Huber , Engelbert Auer , Manfred Schoenhofer , Helmut Seehofer , Peter Wiesner
IPC分类号： B23D57/00 , B23D61/18 , B24B27/06 , B28D5/04 , B65H57/14
摘要： A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130°. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by a wire saw using such wire guide rolls.

3. 发明授权

US07766724B2 Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers 有权
标题翻译：用于将至少两个圆柱形工件同时切割成多个晶片的方法
公开(公告)号：US07766724B2
公开(公告)日：2010-08-03
申请号：US11923722
申请日：2007-10-25
申请人： Anton Huber , Alexander Heilmaier , Clemens Radspieler , Helmut Seehofer
发明人： Anton Huber , Alexander Heilmaier , Clemens Radspieler , Helmut Seehofer
IPC分类号： B24B49/00 , B24D1/06
CPC分类号： B28D5/042
摘要： Slicing multiple cylindrical workpieces into wafers by a multi wire saw with a gang length LG, is performed by: a) selecting a number n≧2 of workpieces from a stock of workpieces with different lengths, satisfying the inequality L G ≥ ( n - 1 ) · A min + ∑ i = 1 n ⁢ ⁢ L 1 ( 1 ) and making right-hand side of the inequality as large as possible, where Li with i=1 . . . n are for the lengths of the workpieces and Amin is a predefined minimum spacing, b) fixing the n workpieces successively in the longitudinal direction on a mounting plate while maintaining a spacing A≧Amin therebetween such that the relationship L G ≥ ( n - 1 ) · A + ∑ i = 1 n ⁢ ⁢ L i ( 2 ) is satisfied, c) clamping mounting plates workpieces in a multi wire saw, and d) slicing the n workpieces perpendicularly to their longitudinal axis by means of the multi wire saw. Preferably, the wafer stacks are separated from one another by separating pieces after slicing, and at the same time are laterally supported.
摘要翻译：通过以下方式执行多个圆柱形工件进入晶圆：通过以下步骤进行：a）从不同长度的工件库存中选择n≥2个工件，满足不等式LG≥（n-1） ·A min +Σi = 1 n⁢L 1（1），使不等式的右边尽可能大，其中i i = 1。。。 n为工件的长度，Amin为预定的最小间距，b）将n个工件在长度方向上连续固定在安装板上，同时保持间距A≥Am，使得LG≥（n-1） ·A +Σi = 1 n≠L i（2），c）将多个线锯中的工件夹紧，d）通过多线锯将n个工件垂直于其纵向轴线切割。优选地，通过在切片之后分离片而将晶片堆叠彼此分离，并且同时被横向支撑。

4. 发明申请

US20080099006A1 METHOD FOR SIMULTANEOUSLY SLICING AT LEAST TWO CYLINDRICAL WORKPIECES INTO A MULTIPLICITY OF WAFERS 有权
公开(公告)号：US20080099006A1
公开(公告)日：2008-05-01
申请号：US11923722
申请日：2007-10-25
申请人： Anton Huber , Alexander Heilmaier , Clemens Radspieler , Helmut Seehofer
发明人： Anton Huber , Alexander Heilmaier , Clemens Radspieler , Helmut Seehofer
IPC分类号： B23D57/00
CPC分类号： B28D5/042
摘要： Slicing multiple cylindrical workpieces into wafers by a multi wire saw with a gang length LG, is performed by: a) selecting a number n≧2 of workpieces from a stock of workpieces with different lengths, satisfying the inequality L G ≥ ( n - 1 ) · A min + ∑ i = 1 n   L 1 ( 1 ) and making right-hand side of the inequality as large as possible, where Li with i=1 . . . n are for the lengths of the workpieces and Amin is a predefined minimum spacing, b) fixing the n workpieces successively in the longitudinal direction on a mounting plate while maintaining a spacing A≧Amin therebetween such that the relationship L G ≥ ( n - 1 ) · A + ∑ i = 1 n   L i ( 2 ) is satisfied, c) clamping mounting plates workpieces in a multi wire saw, and d) slicing the n workpieces perpendicularly to their longitudinal axis by means of the multi wire saw. Preferably, the wafer stacks are separated from one another by separating pieces after slicing, and at the same time are laterally supported.

5. 发明授权

US09073135B2 Method for slicing wafers from a workpiece 有权
标题翻译：从工件切片晶圆的方法
公开(公告)号：US09073135B2
公开(公告)日：2015-07-07
申请号：US13423350
申请日：2012-03-19
申请人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
发明人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
IPC分类号： B28D5/00 , B28D1/08 , B23D57/00 , B28D5/04
CPC分类号： B23D57/0053 , B28D5/0064 , B28D5/0076 , B28D5/045
摘要： A method for slicing wafers from a workpiece includes providing wire guide rolls that each have a grooved coating with a specific thickness, providing a fixed bearing respectively associated with each wire guide roll and providing a sawing wire including wire sections disposed in a parallel fashion. The wire sections are tensioned between the wire guide rolls and are moved relative to the workpiece so as to perform a sawing operation. The wire guide rolls cooled and the fixed bearings are cooled independently of the wire guide rolls.
摘要翻译：一种用于从工件切片晶片的方法包括提供每个具有特定厚度的带槽涂层的导丝辊，提供分别与每个线导向辊相关联的固定轴承，并提供包括以平行方式设置的线段的锯线。线段在线导向辊之间张紧并相对于工件移动，以进行锯切操作。导丝辊被冷却，固定的轴承独立于导线辊被冷却。

6. 发明授权

US08746227B2 Method for slicing wafers from a workpiece 有权
标题翻译：从工件切片晶圆的方法
公开(公告)号：US08746227B2
公开(公告)日：2014-06-10
申请号：US13415863
申请日：2012-03-09
申请人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
发明人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
IPC分类号： B23D61/18
CPC分类号： B28D5/045 , B23D57/0053 , B28D5/0076
摘要： A method for slicing wafers from a workpiece includes providing wire guide rolls each having a grooved coating with a specific thickness and providing rings at opposing ends of a first of the coatings of a respective wire guide roll. The rings are fixed exclusively to the first coating. A sawing wire including wire sections disposed in a parallel fashion is tensioned between the wire guide rolls. The wire sections of the sawing wire are moved relative to the workpiece so as to perform a sawing operation. A change in length of the first coating, brought about by a temperature change, is measured by measuring distances between sensors and the rings. The wire guide rolls are cooled in a manner dependent on the measured distances.
摘要翻译：用于从工件切片晶片的方法包括提供每个具有特定厚度的带槽涂层的导丝辊，并且在相应导丝辊的第一涂层的相对端处提供环。环固定在第一个涂层上。包括以平行方式设置的线段的锯线在线导向辊之间被张紧。锯线的线段相对于工件移动，以进行锯切操作。通过测量传感器和环之间的距离来测量由温度变化引起的第一涂层的长度变化。导线辊以取决于测量距离的方式冷却。

7. 发明申请

US20120240914A1 METHOD FOR SLICING WAFERS FROM A WORKPIECE 有权
标题翻译：用于从工件中切割波形的方法
公开(公告)号：US20120240914A1
公开(公告)日：2012-09-27
申请号：US13415863
申请日：2012-03-09
申请人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
发明人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
IPC分类号： B28D5/00
CPC分类号： B28D5/045 , B23D57/0053 , B28D5/0076
摘要： A method for slicing wafers from a workpiece includes providing wire guide rolls each having a grooved coating with a specific thickness and providing rings at opposing ends of a first of the coatings of a respective wire guide roll. The rings are fixed exclusively to the first coating. A sawing wire including wire sections disposed in a parallel fashion is tensioned between the wire guide rolls. The wire sections of the sawing wire are moved relative to the workpiece so as to perform a sawing operation. A change in length of the first coating, brought about by a temperature change, is measured by measuring distances between sensors and the rings. The wire guide rolls are cooled in a manner dependent on the measured distances.
摘要翻译：用于从工件切片晶片的方法包括提供每个具有特定厚度的带槽涂层的导丝辊，并且在相应导丝辊的第一涂层的相对端处提供环。环固定在第一个涂层上。包括以平行方式设置的线段的锯线在线导向辊之间被张紧。锯线的线段相对于工件移动，以进行锯切操作。通过测量传感器和环之间的距离来测量由温度变化引起的第一涂层的长度变化。导线辊以取决于测量距离的方式冷却。

8. 发明申请

US20120178346A1 METHOD FOR COOLING A WORKPIECE MADE OF SEMICONDUCTOR MATERIAL DURING WIRE SAWING 有权
标题翻译：用于在电线穿线期间冷却半导体材料的工作原理的方法
公开(公告)号：US20120178346A1
公开(公告)日：2012-07-12
申请号：US13340719
申请日：2011-12-30
申请人： Peter Wiesner , Anton Huber
发明人： Peter Wiesner , Anton Huber
IPC分类号： B24B57/02
CPC分类号： B28D5/0076 , B28D1/08
摘要： A method for cooling a cylindrical workpiece during wire sawing includes applying a liquid coolant to a surface of the workpiece. The workpiece is made of semiconductor material having a surface including two end faces and a lateral face. The method includes sawing the workpiece with a wire saw including a wire web having wire sections arranged in parallel by penetrating the wire sections into the workpiece by an oppositely directed relative movement of the wire sections and the workpiece. Wipers are disposed so as to bear on the surface of the workpiece. The temperature of the workpiece is controlled during the wire sawing using a liquid coolant applied onto the workpiece above the wipers so as to remove the liquid coolant with the wipers bearing on the workpiece surface.
摘要翻译：在线锯切期间冷却圆柱形工件的方法包括将液体冷却剂施加到工件的表面。工件由具有包括两个端面和侧面的表面的半导体材料制成。该方法包括用线锯锯切工件，该线锯包括线网，该线网具有通过线部分和工件的相对定向的相对运动将导线部分穿入工件中而平行布置的线段。刮水器设置成承受在工件的表面上。使用在擦拭器上方施加到工件上的液体冷却剂在线锯期间控制工件的温度，以便通过在工件表面上承载的擦拭器去除液体冷却剂。

9. 发明授权

US08968054B2 Method for cooling a workpiece made of semiconductor material during wire sawing 有权
标题翻译：丝线切割时由半导体材料制成的工件的冷却方法
公开(公告)号：US08968054B2
公开(公告)日：2015-03-03
申请号：US13340719
申请日：2011-12-30
申请人： Peter Wiesner , Anton Huber
发明人： Peter Wiesner , Anton Huber
IPC分类号： B28D1/06 , B28D5/00 , B28D1/08
CPC分类号： B28D5/0076 , B28D1/08
摘要： A method for cooling a cylindrical workpiece during wire sawing includes applying a liquid coolant to a surface of the workpiece. The workpiece is made of semiconductor material having a surface including two end faces and a lateral face. The method includes sawing the workpiece with a wire saw including a wire web having wire sections arranged in parallel by penetrating the wire sections into the workpiece by an oppositely directed relative movement of the wire sections and the workpiece. Wipers are disposed so as to bear on the surface of the workpiece. The temperature of the workpiece is controlled during the wire sawing using a liquid coolant applied onto the workpiece above the wipers so as to remove the liquid coolant with the wipers bearing on the workpiece surface.
摘要翻译：在线锯切期间冷却圆柱形工件的方法包括将液体冷却剂施加到工件的表面。工件由具有包括两个端面和侧面的表面的半导体材料制成。该方法包括用线锯锯切工件，该线锯包括线网，该线网具有通过线部分和工件的相对定向的相对运动将导线部分穿入工件中而平行布置的线段。刮水器设置成承受在工件的表面上。使用在擦拭器上方施加到工件上的液体冷却剂在线锯期间控制工件的温度，以便通过在工件表面上承载的擦拭器去除液体冷却剂。

10. 发明申请

US20120240915A1 METHOD FOR SLICING WAFERS FROM A WORKPIECE 有权
标题翻译：用于从工件中切割波形的方法
公开(公告)号：US20120240915A1
公开(公告)日：2012-09-27
申请号：US13423350
申请日：2012-03-19
申请人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
发明人： Anton Huber , Wolfgang Gmach , Robert Kreuzeder , Peter Wiesner
IPC分类号： B28D5/00 , B28D1/08
CPC分类号： B23D57/0053 , B28D5/0064 , B28D5/0076 , B28D5/045
摘要： A method for slicing wafers from a workpiece includes providing wire guide rolls that each have a grooved coating with a specific thickness, providing a fixed bearing respectively associated with each wire guide roll and providing a sawing wire including wire sections disposed in a parallel fashion. The wire sections are tensioned between the wire guide rolls and are moved relative to the workpiece so as to perform a sawing operation. The wire guide rolls cooled and the fixed bearings are cooled independently of the wire guide rolls.
摘要翻译：一种用于从工件切片晶片的方法包括提供每个具有特定厚度的带槽涂层的导丝辊，提供分别与每个线导向辊相关联的固定轴承，并提供包括以平行方式设置的线段的锯线。线段在线导向辊之间张紧并相对于工件移动，以进行锯切操作。导丝辊被冷却，固定的轴承独立于导线辊被冷却。

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