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1. 发明授权

US06814273B2 Flatwire repair tool systems and methods 失效
标题翻译： Flatwire维修工具系统和方法
公开(公告)号：US06814273B2
公开(公告)日：2004-11-09
申请号：US10241898
申请日：2002-09-12
申请人： Anne Marie Sullivan , Xu Song , Lakhi N. Goenka , Yutaka Kawase , Cuong-Van Pham , Bhavani Shankar Tata , Peter Joseph Sinkunas
发明人： Anne Marie Sullivan , Xu Song , Lakhi N. Goenka , Yutaka Kawase , Cuong-Van Pham , Bhavani Shankar Tata , Peter Joseph Sinkunas
IPC分类号： B23K3704
CPC分类号： H01R12/613 , B23K1/012 , B23K2101/38 , H01R43/0263 , H05K3/0052 , H05K3/225 , H05K3/3494 , H05K3/363 , H05K2203/0195 , H05K2203/086 , H05K2203/167
摘要： A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.
摘要翻译：公开了一种用于返修，修理和升级扁线的系统和方法。公开了用于修复和/或修理扁线的修理工具，用于与原始系统相比创建相同或更高质量的后续电气和机械接头。修理工具包括加热刀片，功率控制器，工具组件，惰性系统，冷却系统，扁平线盒，工具材料，扁线材料，升级/修复程序以及用于将扁丝快速加热到连接扁丝的两个分开的部分。本发明的系统和方法解决了在通常用于形成焊点的温度下通常降解的衬底材料的挑战。此外，本发明的焊接工具可以是可用于现场的便携式轻型单元，用于汽车和航空应用。

2. 发明授权

US06642485B2 System and method for mounting electronic components onto flexible substrates 有权
公开(公告)号：US06642485B2
公开(公告)日：2003-11-04
申请号：US10007485
申请日：2001-12-03
申请人： Lakhi N. Goenka , Peter Joseph Sinkunas
发明人： Lakhi N. Goenka , Peter Joseph Sinkunas
IPC分类号： B23K112
CPC分类号： B23K3/087 , B23K1/012 , H05K3/3494 , H05K2201/0305 , H05K2203/0165 , H05K2203/081 , H05K2203/111 , H05K2203/1121 , H05K2203/1581
摘要： A system and method for reflowing solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder, and a pallet for supporting the substrate, wherein the supplemental heat source creates a stream of hot gas that flows transversely across the substrate.

3. 发明授权

US06284998B1 Method for laser soldering a three dimensional component 失效
标题翻译：激光焊接三维元件的方法
公开(公告)号：US06284998B1
公开(公告)日：2001-09-04
申请号：US09452241
申请日：1999-12-01
申请人： Peter Joseph Sinkunas , Andrew Zachary Glovatsky , Bernard Allen Meyer , Zhong-You Joe Shi , Myron Lemecha , Rexanne M. Coyner
发明人： Peter Joseph Sinkunas , Andrew Zachary Glovatsky , Bernard Allen Meyer , Zhong-You Joe Shi , Myron Lemecha , Rexanne M. Coyner
IPC分类号： B23K2620
CPC分类号： B23K26/20 , B23K1/0056 , B23K2101/40 , H01L2224/75253 , H01L2224/81224 , H01L2924/01087 , H01L2924/01322 , H05K3/3494 , H05K2201/0108 , H05K2203/107
摘要： There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component 10 having at least two terminations thereon; a dielectric substrate 14 having a first surface 16 on a first side thereof, a second surface on a second side thereof, and at least two mounting pads 24 arranged on the first surface 16 in matched relation with the terminations of the electronic component 10; and a diode laser 50; (b) depositing solder paste atop the mounting pads 24; (c) placing the electronic component 10 atop the substrate 14 such that each termination rests generally atop its respective mounting pad 24; and (d) directing laser energy 70 from the diode laser 50 to at least one of the mounting pads 24 from the second side of the substrate 14 for a predetermined time, such that the solder paste atop the at least one of the mounting pads 24 is melted.
摘要翻译：这里公开了一种用于激光焊接的方法，包括以下步骤：（a）提供其上具有至少两个终端的电子部件10; 电介质基板14，其第一面上具有第一表面16，在其第二侧上具有第二表面，以及至少两个安装焊盘24，其布置在第一表面16上，与电子部件10的端接部相配合; 和二极管激光器50; （b）在安装焊盘24的上方沉积焊膏; （c）将电子部件10放置在基板14的顶部，使得每个端子大致位于其相应的安装焊盘24的顶部; 以及（d）将来自二极管激光器50的激光能量70从衬底14的第二侧引导到至少一个安装焊盘24预定的时间，使得焊膏位于至少一个安装焊盘24的顶部被融化

4. 发明授权

US06583385B1 Method for soldering surface mount components to a substrate using a laser 有权
标题翻译：使用激光将表面安装部件焊接到基板的方法
公开(公告)号：US06583385B1
公开(公告)日：2003-06-24
申请号：US10028417
申请日：2001-12-19
申请人： Peter Joseph Sinkunas , Zhong-You (Joe) Shi , Jay D. Baker
发明人： Peter Joseph Sinkunas , Zhong-You (Joe) Shi , Jay D. Baker
IPC分类号： B23K1005
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/0056 , B23K26/0838 , B23K26/10 , B23K2101/42 , H01R43/0221 , H01R43/0256
摘要： A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads along a common axis, placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser, and sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.
摘要翻译：公开了一种用于回流分散在连接到柔性基板的多个电路导体焊盘和使用激光的至少一个电子部件之间的焊料的方法。该方法包括沿公共轴对准多个电路导体焊盘，将至少一个具有浅色表面侧的电子部件放置在一对电路导体焊盘上，其中浅色表面面对激光，并且扫掠激光穿过多个电子部件和导体焊盘以回流焊料而不损坏衬底。

5. 发明授权

US5914534A Three-dimensional multi-layer molded electronic device and method for manufacturing same 失效
标题翻译：三维多层成型电子器件及其制造方法
公开(公告)号：US5914534A
公开(公告)日：1999-06-22
申请号：US642722
申请日：1996-05-03
申请人： Michael George Todd , Peter Joseph Sinkunas , Andrew Zachary Glovatsky
发明人： Michael George Todd , Peter Joseph Sinkunas , Andrew Zachary Glovatsky
IPC分类号： H05K1/00 , H05K1/11 , H05K1/14 , H05K3/36 , H05K3/46 , H01L21/44 , H01L23/02 , H01L23/16 , H01L29/41
CPC分类号： H05K3/462 , H05K1/119 , H05K1/144 , H01L2924/1515 , H05K1/0284 , H05K2201/09045 , H05K2201/09118 , H05K2201/09536 , H05K2201/096 , H05K2201/09845 , H05K2201/1059 , H05K2201/10666 , H05K2203/167 , H05K3/368 , H05K3/4623 , Y10S438/977
摘要： A three-dimensional multi-layer molded electronic device and method for manufacturing same, wherein the device comprises at least two molded, three-dimensional substrates having mating surfaces, each substrate including a layer of patterned conductive material on at least one surface and electrically conductive vias at selected locations of the substrate for interconnection of the conductive layers, wherein the substrates are electrically joined at their mating surfaces and the circuit layers are aligned and interconnected to form a multi-layer, three-dimensional circuit which may include molded-in structural features.
摘要翻译：一种三维多层成型电子器件及其制造方法，其中所述器件包括至少两个具有配合表面的模制的三维衬底，每个衬底在至少一个表面上包括图案化的导电材料层并具有导电性在基板的选定位置处的通孔，用于导电层的互连，其中基板在其配合表面处电连接，并且电路层被对准和互连以形成多层三维电路，其可以包括模制结构特征。

6. 发明授权

US06830176B2 System and method for repairing flex circuits 失效
标题翻译：修复柔性电路的系统和方法
公开(公告)号：US06830176B2
公开(公告)日：2004-12-14
申请号：US10061599
申请日：2002-02-01
申请人： Peter Joseph Sinkunas , Zhong-You Shi , Jay D. Baker , Robert Edward Belke , Charles Frederick Schweitzer , Raymond Eric Foster , Stephen Edward Fuks
发明人： Peter Joseph Sinkunas , Zhong-You Shi , Jay D. Baker , Robert Edward Belke , Charles Frederick Schweitzer , Raymond Eric Foster , Stephen Edward Fuks
IPC分类号： B23K3100
CPC分类号： H05K3/225 , H05K3/363
摘要： A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.
摘要翻译：公开了一种用于修复柔性电路的新系统和方法。柔性电路向电子设备传导电信号。该系统通常包括柔性电路衬底，至少一个电导体和修补贴片。柔性电路基板具有切割区域和修复区域。所述至少一个电导体由所述柔性电路基板支撑。电导体被配置为承载电信号。修补补片用于至少电连接两个维修区域。

7. 发明授权

US6100178A Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same 失效
标题翻译：具有多导体层的三维电子电路及其制造方法
公开(公告)号：US6100178A
公开(公告)日：2000-08-08
申请号：US808403
申请日：1997-02-28
申请人： Michael George Todd , Andrew Zachary Glovatsky , Peter Joseph Sinkunas
发明人： Michael George Todd , Andrew Zachary Glovatsky , Peter Joseph Sinkunas
IPC分类号： H05K1/00 , H05K3/10 , H05K3/46 , H01L21/4763 , H01L21/00
CPC分类号： H05K3/4644 , H05K1/0284 , H05K2201/09118 , H05K3/108 , Y10T29/49128
摘要： A three-dimensional multi-layer electronic device and method for manufacturing same, wherein the device comprises a three-dimensional substrate including a conductive trace on at least one surface of the substrate, a thin layer of dielectric material substantially covering a desired portion of the conductive trace(s) on the substrate, the dielectric layer including vias at selected locations, and applying a coating of conductive material on the dielectric layer and in the vias, and defining a conductive trace in the material to thereby form a multi-layer, interconnected three-dimensional electronic device. Additional layers of dielectric material and conductive traces may be similarly applied to create the desired number of circuit layers. Molded-in structural features, and/or vias may be defined in the appropriate layers to accommodate the attachment and/or interconnection of other electronic devices to the device.
摘要翻译：一种三维多层电子器件及其制造方法，其中所述器件包括在衬底的至少一个表面上包括导电迹线的三维衬底，基本覆盖所述衬底的所需部分的介电材料薄层导电迹线，介电层包括选定位置处的通孔，以及在介电层和通孔中施加导电材料涂层，并在材料中限定导电迹线，从而形成多层，互联三维电子设备。可以类似地应用附加的介电材料层和导电迹线以产生所需数量的电路层。模制的结构特征和/或通孔可以在适当的层中限定，以适应其他电子设备到设备的附接和/或互连。

8. 发明授权

US5938455A Three-dimensional molded circuit board having interlocking connections 失效
标题翻译：具有互锁连接的三维模制电路板
公开(公告)号：US5938455A
公开(公告)日：1999-08-17
申请号：US649735
申请日：1996-05-15
申请人： Andrew Zachary Glovatsky , Michael George Todd , Peter Joseph Sinkunas , Myron Lemecha
发明人： Andrew Zachary Glovatsky , Michael George Todd , Peter Joseph Sinkunas , Myron Lemecha
IPC分类号： H01R31/08 , H05K1/00 , H05K1/11 , H05K3/32 , H05K3/36 , H05K3/40 , H05K3/42 , H01R9/09
CPC分类号： H01R12/58 , H01R12/523 , H05K1/119 , H05K3/326 , H05K3/368 , H01R31/08 , H05K1/0284 , H05K1/117 , H05K2201/0191 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09163 , H05K2201/09472 , H05K2201/09481 , H05K2201/096 , H05K2201/09845 , H05K2201/10386 , H05K2201/10393 , H05K2201/1059 , H05K2201/209 , H05K2203/167 , H05K3/325 , H05K3/36 , H05K3/403 , H05K3/42
摘要： A circuit board assembly is disclosed comprising a pair of three-dimensional substrates having integral, metallized connectors. The connector of the first substrate protrudes therefrom, while the connector of the second substrate is recessed therein. The geometries of the protruding connector and the recessed connector are different such that they deform when assembled to provide an electrical connection and a detachable physical connection. In one embodiment, the recessed connector has a parabolic cross-section and the protruding connector has a circular cross-section. A flexible molded edge connector for the circuit board assembly is also disclosed.
摘要翻译：公开了一种电路板组件，其包括具有整体金属化连接器的一对三维基板。第一基板的连接器从其突出，而第二基板的连接器凹入其中。突出连接器和凹入连接器的几何形状不同，使得它们在组装时变形以提供电连接和可拆卸的物理连接。在一个实施例中，凹入式连接器具有抛物面截面，并且突出连接器具有圆形横截面。还公开了一种用于电路板组件的柔性成型边缘连接器。

9. 发明授权

US06168070A Method for soldering DPAK-type electronic components to circuit boards 失效
标题翻译：将DPAK型电子部件焊接到电路板的方法
公开(公告)号：US06168070A
公开(公告)日：2001-01-02
申请号：US09172047
申请日：1998-10-14
申请人： Peter Joseph Sinkunas
发明人： Peter Joseph Sinkunas
IPC分类号： B23K3100
CPC分类号： H05K3/341 , H01L2224/05553 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H05K3/3494 , H05K2201/10166 , H05K2201/10969 , H05K2203/0405 , H05K2203/107 , Y02P70/613 , H01L2924/00014 , H01L2924/00
摘要： There is disclosed herein a method for soldering an electronic component 10 having a heatspreader 14 on a bottom surface thereof and at least one lead 18 (e.g., a DPAK-type component) to a circuit board 30 having a heatspreader mounting pad 32 and at least one lead mounting pad 34, comprising the steps of: (a) depositing solder paste 36 on the heatspreader mounting pad 32 and on each of the at least one lead mounting pad 34; (b) placing the electronic component 10 on the circuit board 30 such that the heatspreader 14 rests atop the heatspreader mounting pad 32 and each lead 18 rests atop a respective one of the at least one lead mounting pad 34; (c) directing a laser energy beam 42 from a diode laser 40 at the heatspreader 14 and/or at the heatspreader mounting pad 32 for a first predetermined length of time, thereby heating the solder paste 36 on the pad 32; and (d) continuing to direct the laser energy beam 42 at the heatspreader/pad 14/32 for a second predetermined length of time while simultaneously feeding a predetermined amount of flux-core wire solder 50 into the laser energy beam 42 proximate the heatspreader 14, such that the wire solder 50 melts and flows onto at least one of the heatspreader 14 and the heatspreader mounting pad 32.
摘要翻译：这里公开了一种将其底面上具有散热器14的电子部件10和至少一个引线18（例如，DPAK型部件）焊接到具有散热器安装焊盘32并且至少具有散热器安装焊盘32的电路板30的方法一个引线安装焊盘34，包括以下步骤：（a）将焊膏36沉积在散热器安装焊盘32上和每个至少一个引线安装焊盘34上; （b）将电子部件10放置在电路板30上，使得散热器14搁置在散热器安装焊盘32的顶部，并且每个引线18位于至少一个引线安装焊盘34中的相应一个之上; （c）将来自二极管激光器40的激光能量束42引导到散热器14和/或在散热器安装垫32上第一预定长度的时间，从而加热焊盘32上的焊膏36; 和（d）继续将激光能量束42引导到散热器/焊盘14/32处第二预定长度的时间，同时将预定量的磁芯焊丝50馈送到靠近散热器14的激光能量束42中使得焊丝50熔化并流到散热器14和散热器安装焊盘32中的至少一个。

10. 发明授权

US5920462A Heat spreader mounting pad configurations for laser soldering 失效
标题翻译：散热器安装垫配置用于激光焊接
公开(公告)号：US5920462A
公开(公告)日：1999-07-06
申请号：US58128
申请日：1998-04-10
申请人： Andrew Zachary Glovatsky , Jay DeAvis Baker , Peter Joseph Sinkunas
发明人： Andrew Zachary Glovatsky , Jay DeAvis Baker , Peter Joseph Sinkunas
IPC分类号： H05K1/02 , H05K1/11 , H05K3/34 , H05K3/42 , H05K7/20 , H05K7/02
CPC分类号： H05K7/20509 , H05K1/0206 , H05K1/0212 , H05K1/111 , H05K3/341 , H05K2201/09381 , H05K2201/09663 , H05K2201/09781 , H05K2201/10166 , H05K2201/10969 , H05K2203/107 , H05K2203/1178 , H05K3/3494 , H05K3/42 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a printed circuit board onto which an electronic component heat spreader may be soldered by laser soldering, one embodiment of which comprises: a dielectric substrate 10 having a top surface 11 on which a footprint perimeter P of the component heat spreader is defined, and two or more heat spreader mounting pads 20 arranged on the substrate top surface 12. Each mounting pad 20 comprises a first portion 21 arranged on the substrate surface 12 outside of the footprint perimeter P, and a second portion 22 arranged on the substrate surface 12 inside of the footprint perimeter P contiguous with the first portion 21.
摘要翻译：这里公开了一种印刷电路板，其上可以通过激光焊接将电子部件散热器焊接在该印刷电路板上，其一个实施例包括：具有顶表面11的电介质基板10，在该顶表面上限定了部件散热器的覆盖区周边P 以及布置在基板顶表面12上的两个或更多个散热器安装焊盘20.每个安装垫20包括布置在基板表面12上的第一部分21，其位于覆盖区周边P的外部，第二部分22布置在基板表面上 12在与第一部分21相邻的足迹周边P内。

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