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1. 发明授权

US07678712B2 Vapor phase treatment of dielectric materials 失效
标题翻译：介电材料的气相处理
公开(公告)号：US07678712B2
公开(公告)日：2010-03-16
申请号：US11086010
申请日：2005-03-22
申请人： Anil S. Bhanap , Robert R. Roth , Kikue S. Burnham , Brian J. Daniels , Denis H. Endisch , Ilan Golecki
发明人： Anil S. Bhanap , Robert R. Roth , Kikue S. Burnham , Brian J. Daniels , Denis H. Endisch , Ilan Golecki
IPC分类号： H01L21/31
CPC分类号： H01L21/02126 , C23C16/56 , H01L21/02203 , H01L21/02216 , H01L21/02219 , H01L21/02222 , H01L21/02282 , H01L21/02337 , H01L21/02359 , H01L21/3105 , H01L21/76814
摘要： The invention concerns a method for applying a surface modification agent composition for organosilicate glass dielectric films. More particularly, the invention pertains to a method for treating a silicate or organosilicate dielectric film on a substrate, which film either comprises silanol moieties or has had at least some previously present carbon containing moieties removed therefrom. The treatment adds carbon containing moieties to the film and/or seals surface pores of the film, when the film is porous.
摘要翻译：本发明涉及一种用于涂覆有机硅酸盐玻璃介电薄膜的表面改性剂组合物的方法。更具体地说，本发明涉及一种在底物上处理硅酸盐或有机硅酸盐电介质膜的方法，该膜包含硅烷醇部分或已从其中除去至少一些先前存在的含碳部分。当膜是多孔的时，该处理向膜中加入含碳部分并且/或密封膜的表面孔。

2. 发明申请

US20080291634A1 THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热互连和界面材料，生产方法及其用途
公开(公告)号：US20080291634A1
公开(公告)日：2008-11-27
申请号：US12124998
申请日：2008-05-21
申请人： Martin W. Weiser , Kikue S. Burnham , De-Ling Zhou , Roger Y. Leung , Jan Nedbal , Ravi Rastogi
发明人： Martin W. Weiser , Kikue S. Burnham , De-Ling Zhou , Roger Y. Leung , Jan Nedbal , Ravi Rastogi
IPC分类号： H05K7/20
CPC分类号： C09K5/14 , H01L23/3737 , H01L23/42 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H01L2924/0665 , H01L2924/00
摘要： Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component. Also, thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile.
摘要翻译：公开了热界面材料，其包括至少一种基质材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂改善所述热界面材料的热性能，相容性，物理质量或其组合。还公开了形成热界面材料的方法，其包括提供至少一种基质材料组分，至少一种高电导率填料，至少一种焊料材料和至少一种材料改性剂中的每一种，混合组分; 并且可选地将热界面材料预施加或后施加到表面，基材或组分上固化。此外，公开了热界面材料，其包括至少一种基体材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂至少一种改性的热填料型材。

3. 发明申请

US20110038124A1 THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热互连和界面材料，生产方法及其用途
公开(公告)号：US20110038124A1
公开(公告)日：2011-02-17
申请号：US12988104
申请日：2009-04-18
申请人： Kikue S. Burnham , Lea Dankers , Martin William Weiser
发明人： Kikue S. Burnham , Lea Dankers , Martin William Weiser
IPC分类号： H05K7/20 , C09K5/00 , B29C65/52
CPC分类号： H01L24/31 , C08K3/10 , C08L63/00 , C08L2666/54 , C09J163/00 , H01L23/3737 , H01L23/42 , H01L24/29 , H01L24/83 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29393 , H01L2224/294 , H01L2224/29439 , H01L2224/29498 , H01L2224/83101 , H01L2224/83801 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01054 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/15747 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/01083 , H01L2924/01064 , H01L2924/3512 , H01L2924/00014 , H01L2924/05032 , H01L2924/0503 , H01L2924/00012
摘要： A curable thermal interface material composition includes an epoxy polymeric adhesive matrix; a high conductivity filler; a low melting temperature solder material; and a matrix material modification agent.
摘要翻译：可固化的热界面材料组合物包括环氧聚合物粘合剂基质; 高导电性填料; 低熔点焊料材料; 和基质材料改性剂。

4. 发明申请

US20090111925A1 THERMAL INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热界面材料，生产方法及其用途
公开(公告)号：US20090111925A1
公开(公告)日：2009-04-30
申请号：US11932094
申请日：2007-10-31
申请人： Kikue S. Burnham , Wenya Fan
发明人： Kikue S. Burnham , Wenya Fan
IPC分类号： C08L83/04 , C08K5/053
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L71/02 , C08L2666/14 , C08L83/00
摘要： Thermal interface materials comprise at least one silicon-based polymer and are formed from a combination of at least one silicon-based material, at least one catalyst and at least one elasticity promoter. In some embodiments, contemplated materials are also formed utilizing at least one polymerization component. Thermal interface materials are also disclosed that are capable of withstanding temperatures of at least 250 C where the material comprises at least one silicon-based polymer coupled with at least one elasticity promoter. Methods of forming these thermal interface materials comprise providing each of the at least one silicon-based material, at least one catalyst and at least one elasticity promoter, blending the components and optionally including the at least one polymerization component. Contemplated thermal interface materials disclosed are thermally stable, sticky, and elastic, and show a good thermal conductivity and strong adhesion when deposited on the high thermally conductive material. The thermal interface materials may then be utilized as formed or the materials may be cured pre- or post-application of the thermal interface material to the surface, substrate or component.
摘要翻译：热界面材料包括至少一种硅基聚合物，并且由至少一种硅基材料，至少一种催化剂和至少一种弹性促进剂的组合形成。在一些实施方案中，还使用至少一种聚合组分形成预期的材料。还公开了热界面材料，其能够耐受至少250℃的温度，其中该材料包含至少一种与至少一种弹性促进剂偶联的硅基聚合物。形成这些热界面材料的方法包括提供至少一种硅基材料，至少一种催化剂和至少一种弹性促进剂中的每一种，共混组分和任选地包含至少一种聚合组分。所公开的考虑的热界面材料是热稳定的，粘性的和弹性的，并且当沉积在高导热材料上时显示出良好的导热性和强粘附性。然后可以将热界面材料用作形成的材料，或者材料可以在将热界面材料施加到表面，基底或部件之前或之后固化。

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